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XC17256ELPD8C

Description
256KX1 CONFIGURATION MEMORY, PDIP8, PLASTIC, DIP-8
Categorystorage    storage   
File Size935KB,14 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Environmental Compliance  
Download Datasheet Parametric View All

XC17256ELPD8C Overview

256KX1 CONFIGURATION MEMORY, PDIP8, PLASTIC, DIP-8

XC17256ELPD8C Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeDIP
package instructionPLASTIC, DIP-8
Contacts8
Reach Compliance Codeunknown
Other featuresUSED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 codeR-PDIP-T8
JESD-609 codee0
length9.3599 mm
memory density262144 bit
Memory IC TypeCONFIGURATION MEMORY
memory width1
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX1
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)225
Certification statusCOMMERCIAL
Maximum seat height4.5974 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width7.62 mm
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