Product specification
2
14
Surface-Mount Ceramic Multilayer Capacitors
Soft Termination
X7R
16 V to 630 V
SCOPE
This specification describes X7R
series chip capacitors with Flexible
leadfree terminations.
APPLICATIONS
High flexure stress circuit boards
Switch power supplies
Telecom base station
FEATURES
Supplied in tape on reel
Flexible termination system
Leaded-free termination meet
RoHS requirements
Improved resistance to thermal
stresses
Increased mechanical
performance
ORDERING INFORMATION - GLOBAL PART NUMBER, PHYCOMP
CTC & 12NC
All part numbers are identified by the series, size, tolerance, TC material,
packing style, voltage, process code, termination and capacitance value.
YAGEO / PHYCOMP
BRAND ordering code
GLOBAL PART NUMBER
CS
XXXX X X
(
PREFERRED
)
X7R
X
BB
XXX
(1)
(2) (3)
(4)
(5)
(1) SIZE – INCH BASED (METRIC)
0603 (1608)
0805 (2012)
1206 (3216)
(2) TOLERANCE
J = ±5%
(1)
K = ±10%
M = ±20%
(3) PACKING STYLE
R = Paper/PE taping reel; Reel 7 inch
K = Blister taping reel; Reel 7 inch
P = Paper/PE taping reel; Reel 13 inch
F = Blister taping reel; Reel 13 inch
C = Bulk case
(4) RATED VOLTAGE
7 = 16 V
8 = 25 V
9 = 50 V
0 = 100 V
A = 200 V
Y = 250 V
Z = 630 V
C = 1 kV
(5) CAPACITANCE VALUE
2 significant digits+number of zeros
The 3rd digit signifies the multiplying factor, and letter R is decimal point
Example: 103 = 10 x 10
3
= 10,000 pF = 10 nF
NOTE
1. Tolerance ±5% doesn't available for full product range, please contact local sales force
before order
www.yageo.com
Nov. 26, 2012 V.2
Product specification
3
14
Surface-Mount Ceramic Multilayer Capacitors
Soft Termination
X7R
16 V to 630 V
CONSTRUCTION
The capacitor consists of a rectangular block of ceramic dielectric in which a number of interleaved metal
electrodes are contained. This structure gives rise to a high capacitance per unit volume.
The inner electrodes are connected to the two end flexible terminations and finally covered with a layer of
plated tin (NiSn).
The terminations are lead-free. A cross section of the structure is shown in Fig.1 and Fig.2.
terminations
Copper
Soft electrode
(Stress relaxation)
Ni Plating
electrodes
Sn Plating
YNM0049
Fig. 2
Concept of soft termination
MLB457
ceramic material
Fig. 1
Surface mounted multilayer ceramic capacitor construction
OUTLINES
For dimension see Table 1
DIMENSION
Table 1
For outlines see fig. 3
TYPE
0603
0805
1206
L
1
(mm)
1.6 ±0.20
2.0 ±0.30
3.2 ±0.40
W (mm)
0.8 ±0.15
1.25 ±0.20
1.6 ±0.20
T (MM)
Refer to
table 2 to 3
L
2
/ L
3
(mm)
min.
0.20
0.25
0.25
L
4
(mm)
min.
0.30
0.55
1.40
T
W
max.
0.65
0.75
0.85
L2
L4
L1
L3
MBB211
Fig. 3
Surface mounted multilayer
ceramic capacitor dimension
www.yageo.com
Nov. 26, 2012 V.2
Product specification
4
14
Surface-Mount Ceramic Multilayer Capacitors
Soft Termination
X7R
16 V to 630 V
CAPACITANCE RANGE & THICKNESS
Table 2
Size from 0603
CAP.
Last 2-digit of
12NC
100 pF
150 pF
220 pF
330 pF
470 pF
680 pF
1.0 nF
1.5 nF
2.2 nF
3.3 nF
4.7 nF
6.8 nF
10 nF
15 nF
22 nF
27 nF
33 nF
47 nF
68 nF
100 nF
150 nF
220 nF
NOTE
0603
16 V
25 V
50 V
100 V
09
12
14
16
18
21
23
25
0.8±0.1
27
29
0.8±0.1
32
34
36
38
41
42
43
45
47
49
52
54
0.8±0.1
0.8±0.1
1. Values in shaded cells indicate thickness class in mm
2. For product with 5% tolerance, please contact local sales force before order
www.yageo.com
Nov. 26, 2012 V.2
Product specification
5
14
Surface-Mount Ceramic Multilayer Capacitors
Soft Termination
X7R
16 V to 630 V
CAPACITANCE RANGE & THICKNESS
Table 3
Size 0805
CAP.
100 pF
150 pF
180 pF
220 pF
330 pF
390 pF
470 pF
680 pF
1.0 nF
1.5 nF
2.2 nF
3.3 nF
4.7 nF
6.8 nF
10 nF
15 nF
18 nF
22 nF
27 nF
33 nF
47 nF
68 nF
100 nF
150 nF
220 nF
270 nF
330 nF
390 nF
470 nF
680 nF
1000 nF
NOTE
Last 2-digit of
12NC
09
12
13
14
16
17
18
21
23
25
27
29
32
34
36
38
39
41
42
43
45
47
49
52
54
55
56
57
58
61
63
0805
16 V
25 V
50 V
100 V
200 V
250 V
0.85±0.1
0.6±0.1
0.6±0.1
0.6±0.1
0.6±0.1
0.85±0.1
1.25±0.2
1.25±0.2
0.85±0.1
0.85±0.1
0.85±0.1
0.85±0.1
1. Values in shaded cells indicate thickness class in mm
2. For product with 5% tolerance, please contact local sales force before order
www.yageo.com
Nov. 26, 2012 V.2
Embedded System
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