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HY6264LP-10

Description
Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
Categorystorage    storage   
File Size577KB,11 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
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HY6264LP-10 Overview

Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

HY6264LP-10 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSK Hynix
Parts packaging codeDIP
package instructionDIP, DIP28,.6
Contacts28
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time100 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T28
JESD-609 codee0
length37 mm
memory density65536 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals28
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height4.953 mm
Maximum standby current0.00005 A
Minimum standby current2 V
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm

HY6264LP-10 Related Products

HY6264LP-10 HY6264LP-15 HY6264LP-12 HY6264LP-85
Description Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Standard SRAM, 8KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Standard SRAM, 8KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Standard SRAM, 8KX8, 85ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker SK Hynix SK Hynix SK Hynix SK Hynix
Parts packaging code DIP DIP DIP DIP
package instruction DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6
Contacts 28 28 28 28
Reach Compliance Code compliant compliant compliant compli
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 100 ns 150 ns 120 ns 85 ns
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-PDIP-T28 R-PDIP-T28 R-PDIP-T28 R-PDIP-T28
JESD-609 code e0 e0 e0 e0
length 37 mm 37 mm 37 mm 37 mm
memory density 65536 bit 65536 bit 65536 bit 65536 bi
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of ports 1 1 1 1
Number of terminals 28 28 28 28
word count 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 8KX8 8KX8 8KX8 8KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP
Encapsulate equivalent code DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.953 mm 4.953 mm 4.953 mm 4.953 mm
Maximum standby current 0.00005 A 0.00005 A 0.00005 A 0.00005 A
Minimum standby current 2 V 2 V 2 V 2 V
Maximum slew rate 0.07 mA 0.07 mA 0.07 mA 0.07 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 15.24 mm 15.24 mm 15.24 mm
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