MADS-011010-1419-V1 datasheet, PDF

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MADS-011010-1419-V1: DescriptionSchottky Zero Bias Detector Diode Chip; File Size171KB，3 Pages; ManufacturerMACOM; Websitehttp://www.macom.com

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MADS-011010-1419-V1 Overview

Schottky Zero Bias Detector Diode Chip

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MADS-011010-1419

Schottky Zero Bias Detector Diode Chip

Absolute Maximum Ratings

1,2

Features

•

P-Type Schottky Diode

Can be used Without External DC Bias

Large Bondable Contact

RoHs Compliant

Available in Chip Form (ODS-1419)

Can be Mounted with Solder or

Conductive Epoxy.

Operating Temperature

Storage Temperature

Reverse Voltage @ 25

°C

Maximum Mounting

Temperature

ESD Classification

-55°C to +125°C

-55°C to +150°C

1.5 Volts

+320C for 10 sec.

Class 0

Description

M/ A - CO M

T e c h n o lo g y

S o lu t io n s ’

MADS-011010-1419 Zero Bias Detector

Diode (ZBD) is suitable for use in microstrip

or stripline detector circuits. These chips

can be used in automatic assembly

processes due to their 2.6 x 5.7 mil rectan-

gular gold contact and sturdy construction.

Exceeding any one or combination of these limits may cause

permanent damage to this device.

M/A-COM does not recommend sustained operation near

these survivability limits.

Human Body Model

Chip Layout ( ODS– 1419 )

Cathode Contact

Ordering Information

Part Number

MAVR-011010-14190G

Package

Gel Pack

Full Area Anode

•

North America

Tel: 800.366.2266 •

Europe

Tel: +353.21.244.6400

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

•

India

Tel: +91.80.43537383

•

China

Tel: +86.21.2407.1588

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

Visit www.macomtech.com for additional data sheets and product information.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes

Commitment to produce in volume is not guaranteed.

to the product(s) or information contained herein without notice.

MADS-011010-1419

Schottky Zero Bias Detector Diode Chip

Die Handling and Mounting Information

Handling:

All semiconductor chips should be handled with care in order to avoid damage or contamination

from perspiration, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up

tools is strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are mini-

mized.

Die Attach:

The die have Ti-Pt-Au back metal and gold plated contact metal. Die can be mounted with a gold

-tin, eutectic solder preform or conductive silver epoxy.

Eutectic Die Attachment Using Hot Gas Die Bonder:

An 80/20, gold tin eutectic solder perform is

recommended with a work surface temperature of 255°C and a tool tip temperature of 220°C. When the hot gas

is applied, the temperature at the tool tip should be approximately 290°C. The chip should not be exposed to

temperature greater than 320°C for more than 10 seconds.

Eutectic Die Attachment Using Reflow Oven:

See Application Note M541, “Bonding and Handling

Procedures for Chip Diode Devices” . Link below.

Epoxy Die Attachment:

A thin, controlled amount of electrically conductive silver epoxy should be applied

at approximately a 1-2 mils thickness to minimize ohmic and thermal resistances. A thin epoxy fillet should be

visible around the perimeter of the chip after placement to ensure full area coverage. Cure conductive epoxy per

manufacturer’s schedule.

Wire Bonding:

0.001” diameter gold wire is recommended with a stage temperature of 150°C and minimal

force. Ultrasonic energy should be adjusted to the minimum required. Automatic ball bonding can also be used.

ee Application Note M541, “Bonding and Handling Procedures for Chip Diode Devices” for

more detailed handling and assembly instructions at following link:

http://www.macom.com/Application%20Notes/pdf/m541.pdf

•

North America

Tel: 800.366.2266 •

Europe

Tel: +353.21.244.6400

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

•

India

Tel: +91.80.43537383

•

China

Tel: +86.21.2407.1588

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

Visit www.macomtech.com for additional data sheets and product information.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes

Commitment to produce in volume is not guaranteed.

to the product(s) or information contained herein without notice.

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