|
KMM5322200AW-8 |
KMM5322200AWG-8 |
| Description |
Fast Page DRAM Module, 2MX32, 80ns, CMOS, SIMM-72 |
Fast Page DRAM Module, 2MX32, 80ns, CMOS, SIMM-72 |
| Maker |
SAMSUNG |
SAMSUNG |
| Parts packaging code |
SIMM |
SIMM |
| Contacts |
72 |
72 |
| Reach Compliance Code |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
| access mode |
FAST PAGE |
FAST PAGE |
| Maximum access time |
80 ns |
80 ns |
| Other features |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| Spare memory width |
16 |
16 |
| JESD-30 code |
R-XSMA-N72 |
R-XSMA-N72 |
| memory density |
67108864 bit |
67108864 bit |
| Memory IC Type |
FAST PAGE DRAM MODULE |
FAST PAGE DRAM MODULE |
| memory width |
32 |
32 |
| Number of functions |
1 |
1 |
| Number of ports |
1 |
1 |
| Number of terminals |
72 |
72 |
| word count |
2097152 words |
2097152 words |
| character code |
2000000 |
2000000 |
| Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
| Maximum operating temperature |
70 °C |
70 °C |
| organize |
2MX32 |
2MX32 |
| Output characteristics |
3-STATE |
3-STATE |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
MICROELECTRONIC ASSEMBLY |
MICROELECTRONIC ASSEMBLY |
| Certification status |
Not Qualified |
Not Qualified |
| refresh cycle |
1024 |
1024 |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
| surface mount |
NO |
NO |
| technology |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
| Terminal form |
NO LEAD |
NO LEAD |
| Terminal location |
SINGLE |
SINGLE |