EEWORLDEEWORLDEEWORLD

Part Number

Search

89HPES16T4AG2ALGI

Description
FCBGA-324, Tray
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size469KB,33 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
Download Datasheet Parametric Compare View All

89HPES16T4AG2ALGI Online Shopping

Suppliers Part Number Price MOQ In stock  
89HPES16T4AG2ALGI - - View Buy Now

89HPES16T4AG2ALGI Overview

FCBGA-324, Tray

89HPES16T4AG2ALGI Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeFCBGA
package instructionBGA,
Contacts324
Manufacturer packaging codeALG324
Reach Compliance Codecompliant
ECCN codeEAR99
Samacsys DescriptionFLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM
Bus compatibilityPCI
maximum clock frequency100 MHz
Drive interface standardsIEEE 1149.1
JESD-30 codeS-PBGA-B324
JESD-609 codee1
length19 mm
Humidity sensitivity level4
Number of terminals324
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
Maximum seat height3.42 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
16-Lane 4-Port
Gen2 PCI Express® Switch
®
89HPES16T4AG2
Data Sheet
The 89HPES16T4AG2 is a member of IDT’s PRECISE™ family of
PCI Express® switching solutions. The PES16T4AG2 is a 16-lane, 4-
port Gen2 peripheral chip that performs PCI Express Base switching
with a feature set optimized for high performance applications such as
servers, storage, and communications/networking. It provides connec-
tivity and switching functions between a PCI Express upstream port and
up to three downstream ports and supports switching between down-
stream ports.
Device Overview
Features
High Performance PCI Express Switch
– Sixteen 5 Gbps Gen2 PCI Express lanes
– Four switch ports
• One x8 or x4 upstream port
• Up to three x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates sixteen 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
– Supports Hot-Swap
Block Diagram
4-Port Switch Core / 16 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 1)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 32
June 2, 2015
DSC 6928

89HPES16T4AG2ALGI Related Products

89HPES16T4AG2ALGI 89HPES16T4AG2ZCALG 89HPES16T4AG2ZBALG 89HPES16T4AG2ALGI8 89HPES16T4AG2ZBAL
Description FCBGA-324, Tray FCBGA-324, Tray FCBGA-324, Tray FCBGA-324, Reel FCBGA-324, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Lead free Lead free Contains lead
Is it Rohs certified? conform to conform to conform to conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code FCBGA FCBGA FCBGA FCBGA FCBGA
package instruction BGA, BGA, BGA324,18X18,40 19 X 19 MM, 1 MM PITCH, GREEN, FCBGA-324 BGA, 19 X 19 MM, 1 MM PITCH, FCBGA-324
Contacts 324 324 324 324 324
Manufacturer packaging code ALG324 ALG324 ALG324 ALG324 AL324
Reach Compliance Code compliant compliant compliant compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Bus compatibility PCI PCI PCI PCI PCI
maximum clock frequency 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
JESD-30 code S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609 code e1 e1 e1 e1 e0
length 19 mm 19 mm 19 mm 19 mm 19 mm
Humidity sensitivity level 4 4 4 4 4
Number of terminals 324 324 324 324 324
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 260 260 260 260 225
Maximum seat height 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V 1 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 30 30 NOT SPECIFIED 30
width 19 mm 19 mm 19 mm 19 mm 19 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Samacsys Description FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM - FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM -
Encapsulate equivalent code - BGA324,18X18,40 BGA324,18X18,40 - BGA324,18X18,40
power supply - 1,2.5,3.3 V 1,2.5,3.3 V - 1,2.5,3.3 V
Certification status - Not Qualified Not Qualified - Not Qualified

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 203  2564  2101  1655  583  5  52  43  34  12 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号