ISL6614AIB datasheet, PDF - EEWORLD Datasheet

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ISL6614AIB: Description2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PDSO14, PLASTIC, MS-012AB, SOIC-14; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size601KB，12 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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ISL6614AIB Overview

2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PDSO14, PLASTIC, MS-012AB, SOIC-14

ISL6614AIB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Parts packaging code	SOIC
package instruction	PLASTIC, MS-012AB, SOIC-14
Contacts	14
Reach Compliance Code	not_compliant
ECCN code	EAR99
high side driver	YES
Interface integrated circuit type	HALF BRIDGE BASED MOSFET DRIVER
JESD-30 code	R-PDSO-G14
JESD-609 code	e0
length	8.65 mm
Humidity sensitivity level	1
Number of functions	2
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP14,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	240
power supply	12 V
Certification status	Not Qualified
Maximum seat height	1.75 mm
Maximum supply voltage	13.2 V
Minimum supply voltage	10.8 V
Nominal supply voltage	12 V
Supply voltage 1-max	12 V
Mains voltage 1-minute	5 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3.9 mm

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DATASHEET

ISL6614A

Dual Advanced Synchronous Rectified Buck MOSFET Drivers with Pre-POR OVP

The ISL6614A integrates two ISL6613A MOSFET drivers and

is specifically designed to drive two Channel MOSFETs in a

synchronous rectified buck converter topology. These drivers

combined with HIP63xx or ISL65xx Multi-Phase Buck PWM

controllers and N-Channel MOSFETs form complete core

voltage regulator solutions for advanced microprocessors.

The ISL6614A drives both the upper and lower gates

simultaneously over a range from 5V to 12V. This drive

voltage provides the flexibility necessary to optimize

applications involving trade-offs between gate charge and

conduction losses.

An advanced adaptive zero shoot-through protection is

integrated to prevent both the upper and lower MOSFETs

from conducting simultaneously and to minimize the dead

time. These products add an overvoltage protection feature

operational before VCC exceeds its turn-on threshold, at

which the PHASE node is connected to the gate of the low

side MOSFET (LGATE). The output voltage of the converter

is then limited by the threshold of the low side MOSFET,

which provides some protection to the microprocessor if the

upper MOSFET(s) is shorted during startup.

The ISL6614A also features a three-state PWM input which,

working together with Intersil’s multi-phase PWM controllers,

prevents a negative transient on the output voltage when the

output is shut down. This feature eliminates the Schottky

diode that is used in some systems for protecting the load

from reversed output voltage events.

FN9160

Rev.4.00

May 5, 2008

Features

• Pin-to-pin Compatible with HIP6602 SOIC Family

• Quad N-Channel MOSFET Drives for Two Synchronous

Rectified Bridges

• Advanced Adaptive Zero Shoot-Through Protection

- Body Diode Detection

- Auto-zero of r

DS(ON)

Conduction Offset Effect

• Adjustable Gate Voltage (5V to 12V) for Optimal Efficiency

• Internal Bootstrap Schottky Diode

• Bootstrap Capacitor Overcharging Prevention

• Supports High Switching Frequency (up to 1MHz)

- 3A Sinking Current Capability

- Fast Rise/Fall Times and Low Propagation Delays

• Three-State PWM Input for Output Stage Shutdown

• Three-State PWM Input Hysteresis for Applications With

Power Sequencing Requirement

• Pre-POR Overvoltage Protection

• VCC Undervoltage Protection

• Expandable Bottom Copper Pad for Enhanced Heat

Sinking

• QFN Package:

- Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat

No Leads - Package Outline

- Near Chip Scale Package Footprint, which Improves

PCB Efficiency and has a Thinner Profile

• Pb-Free Plus Anneal Available (RoHS Compliant)

Applications

• Core Regulators for Intel® and AMD® Microprocessors

• High Current DC/DC Converters

• High Frequency and High Efficiency VRM and VRD

Related Literature

• Technical Brief TB363 “Guidelines for Handling and

Processing Moisture Sensitive Surface Mount Devices

(SMDs)”

• Technical Brief 400 and 417 for Power Train Design,

Layout Guidelines, and Feedback Compensation Design

FN9160 Rev.4.00

May 5, 2008

Page 1 of 12

ISL6614AIB Related Products

	ISL6614AIB	ISL6614AIR-T	ISL6614ACB	ISL6614ACBZA-T	ISL6614ACR	ISL6614ACR-T	ISL6614AIBZ	ISL6614AIRZ	ISL6614AIR
Description	2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PDSO14, PLASTIC, MS-012AB, SOIC-14	2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PQCC16, 4 X 4 MM, PLASTIC, MO-220VGGC, QFN-16	2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PDSO14, PLASTIC, MS-012AB, SOIC-14	2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PDSO14, ROHS COMPLIANT, PLASTIC, MS-012AB, SOIC-14	2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PQCC16, 4 X 4 MM, PLASTIC, MO-220VGGC, QFN-16	2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PQCC16, 4 X 4 MM, PLASTIC, MO-220VGGC, QFN-16	2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PDSO14, ROHS COMPLIANT, PLASTIC, MS-012AB, SOIC-14	2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PQCC16, 4 X 4 MM, ROHS COMPLIANT, PLASTIC, MO-220VGGC, QFN-16	2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PQCC16, 4 X 4 MM, PLASTIC, MO-220VGGC, QFN-16
Is it Rohs certified?	incompatible	incompatible	incompatible	conform to	incompatible	incompatible	conform to	conform to	incompatible
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	SOIC	QFN	SOIC	SOIC	QFN	QFN	SOIC	QFN	QFN
package instruction	PLASTIC, MS-012AB, SOIC-14	4 X 4 MM, PLASTIC, MO-220VGGC, QFN-16	PLASTIC, MS-012AB, SOIC-14	SOP, SOP14,.25	4 X 4 MM, PLASTIC, MO-220VGGC, QFN-16	4 X 4 MM, PLASTIC, MO-220VGGC, QFN-16	SOP, SOP14,.25	HVQCCN, LCC16,.16SQ,25	4 X 4 MM, PLASTIC, MO-220VGGC, QFN-16
Contacts	14	16	14	14	16	16	14	16	16
Reach Compliance Code	not_compliant	not_compliant	not_compliant	compliant	not_compliant	not_compliant	compliant	compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
high side driver	YES	YES	YES	YES	YES	YES	YES	YES	YES
Interface integrated circuit type	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER
JESD-30 code	R-PDSO-G14	S-PQCC-N16	R-PDSO-G14	R-PDSO-G14	S-PQCC-N16	S-PQCC-N16	R-PDSO-G14	S-PQCC-N16	S-PQCC-N16
JESD-609 code	e0	e0	e0	e3	e0	e0	e3	e3	e0
length	8.65 mm	4 mm	8.65 mm	8.65 mm	4 mm	4 mm	8.65 mm	4 mm	4 mm
Humidity sensitivity level	1	1	1	3	1	1	3	3	1
Number of functions	2	2	2	2	2	2	2	2	2
Number of terminals	14	16	14	14	16	16	14	16	16
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-	-	-	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	HVQCCN	SOP	SOP	HVQCCN	HVQCCN	SOP	HVQCCN	HVQCCN
Encapsulate equivalent code	SOP14,.25	LCC16,.16SQ,25	SOP14,.25	SOP14,.25	LCC16,.16SQ,25	LCC16,.16SQ,25	SOP14,.25	LCC16,.16SQ,25	LCC16,.16SQ,25
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	SQUARE
Package form	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	240	240	240	260	240	240	260	260	240
power supply	12 V	12 V	12 V	12 V	12 V	12 V	12 V	12 V	12 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.75 mm	1 mm	1.75 mm	1.75 mm	1 mm	1 mm	1.75 mm	1 mm	1 mm
Maximum supply voltage	13.2 V	13.2 V	13.2 V	13.2 V	13.2 V	13.2 V	13.2 V	13.2 V	13.2 V
Minimum supply voltage	10.8 V	10.8 V	10.8 V	10.8 V	10.8 V	10.8 V	10.8 V	10.8 V	10.8 V
Nominal supply voltage	12 V	12 V	12 V	12 V	12 V	12 V	12 V	12 V	12 V
Supply voltage 1-max	12 V	12 V	12 V	12 V	12 V	12 V	12 V	12 V	12 V
Mains voltage 1-minute	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	OTHER	OTHER	OTHER	OTHER	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Matte Tin (Sn) - annealed	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	NO LEAD	GULL WING	GULL WING	NO LEAD	NO LEAD	GULL WING	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	0.65 mm	1.27 mm	1.27 mm	0.65 mm	0.65 mm	1.27 mm	0.65 mm	0.65 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	QUAD	QUAD	DUAL	QUAD	QUAD
Maximum time at peak reflow temperature	30	30	30	40	30	30	30	30	30
width	3.9 mm	4 mm	3.9 mm	3.9 mm	4 mm	4 mm	3.9 mm	4 mm	4 mm

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