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MPC8560PXAPDB

Description
32-BIT, 833MHz, RISC PROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,108 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MPC8560PXAPDB Overview

32-BIT, 833MHz, RISC PROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783

MPC8560PXAPDB Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeBGA
package instructionBGA,
Contacts783
Reach Compliance Codeunknown
ECCN code3A001.A.3
Address bus width64
bit size32
boundary scanYES
maximum clock frequency166 MHz
External data bus width64
FormatFIXED POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B783
length29 mm
low power modeYES
Number of terminals783
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height3.75 mm
speed833 MHz
Maximum supply voltage1.26 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width29 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Freescale Semiconductor
Technical Data
MPC8540EC
Rev. 3.1, 12/2004
MPC8560
Integrated Processor
Hardware Specifications
The MPC8560 contains a PowerPC™ processor core. The
MPC8560 integrates a processor that implements the PowerPC
architecture with system logic required for networking, storage,
and general-purpose embedded applications. For functional
characteristics of the processor, refer to the
MPC8560
PowerQUICC III™ Integrated Communications Processor
Preliminary Reference Manual.
To locate any published errata or updates for this document,
contact your Freescale sales office.
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 8
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 13
Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 19
DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Ethernet: Three-Speed, MII Management . . . . . . . . 25
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
CPM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
PCI/PCI-X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
RapidIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 72
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
System Design Information . . . . . . . . . . . . . . . . . . . 96
Document Revision History . . . . . . . . . . . . . . . . . . 102
Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . 105
1
Overview
The following section provides a high-level overview of the
MPC8560 features.
Figure 1
shows the major functional units
within the MPC8560.
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
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19.
© Freescale Semiconductor, Inc., 2004. All rights reserved.

MPC8560PXAPDB Related Products

MPC8560PXAPDB MPC8560PXALDB MPC8560CPXALDB
Description 32-BIT, 833MHz, RISC PROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783 32-BIT, 667MHz, RISC PROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783 32-BIT, 667MHz, RISC PROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
Parts packaging code BGA BGA BGA
package instruction BGA, BGA, BGA783,28X28,40 BGA, BGA783,28X28,40
Contacts 783 783 783
Reach Compliance Code unknown unknown unknown
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3
Address bus width 64 64 64
bit size 32 32 32
boundary scan YES YES YES
maximum clock frequency 166 MHz 166 MHz 166 MHz
External data bus width 64 64 64
Format FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES
JESD-30 code S-PBGA-B783 S-PBGA-B783 S-PBGA-B783
length 29 mm 29 mm 29 mm
low power mode YES YES YES
Number of terminals 783 783 783
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 3.75 mm 3.75 mm 3.75 mm
speed 833 MHz 667 MHz 667 MHz
Maximum supply voltage 1.26 V 1.26 V 1.26 V
Minimum supply voltage 1.14 V 1.14 V 1.14 V
Nominal supply voltage 1.2 V 1.2 V 1.2 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Terminal form BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM
width 29 mm 29 mm 29 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Maker NXP - NXP
Encapsulate equivalent code - BGA783,28X28,40 BGA783,28X28,40
power supply - 1.2,2.5/3.3 V 1.2,2.5/3.3 V

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