W19B320BBB-H datasheet, PDF - EEWORLD Datasheet

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W19B320BBB-H: Description2MX16 FLASH 3V PROM, 70ns, PBGA48, 6X 8 MM, TFBGA-48; Categorystorage storage; File Size650KB，56 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W19B320BBB-H Overview

2MX16 FLASH 3V PROM, 70ns, PBGA48, 6X 8 MM, TFBGA-48

W19B320BBB-H Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	BGA
package instruction	6X 8 MM, TFBGA-48
Contacts	48
Reach Compliance Code	compliant
Maximum access time	70 ns
Spare memory width	8
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B48
length	8 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	8,63
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	8K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
switch bit	YES
type	NOR TYPE
width	6 mm

W19B320BBB-H Preview

W19B320BT/B DATASHEET

Table of Contents-

GENERAL DESCRIPTION .............................................................................................................. 4

FEATURES ...................................................................................................................................... 5

PIN CONFIGURATIONS.................................................................................................................. 7

BLOCK DIAGRAM ........................................................................................................................... 8

PIN DESCRIPTION.......................................................................................................................... 8

FUNCTIONAL DESCRIPTION ........................................................................................................ 9

6.1

Device Bus Operation ............................................................................................................. 9

6.1.1

6.1.2

6.1.3

6.1.4

6.1.5

6.1.6

6.1.7

6.1.8

6.1.9

6.1.10

6.1.11

6.1.12

6.1.13

Word/Byte Configuration ..........................................................................................................9

Reading Array Data ..................................................................................................................9

Writing Commands/Command Sequences...............................................................................9

Standby Mode ........................................................................................................................10

Automatic Sleep Mode ...........................................................................................................10

#RESET: Hardware Reset Pin................................................................................................10

Output Disable Mode..............................................................................................................11

autoselect Mode .....................................................................................................................11

Sector/Sector Block Protection and Unprotection...................................................................11

Write Protect (#WP)................................................................................................................11

Temporary Sector Unprotect ..................................................................................................12

Security Sector Flash Memory Region ...................................................................................12

Hardware Data Protection ......................................................................................................13

Reading Array Data ................................................................................................................13

Reset Command.....................................................................................................................14

AUTOSELECT Command Sequence .....................................................................................14

Byte/Word Program Command Sequence..............................................................................15

Unlock Bypass Command Sequence .....................................................................................15

Chip Erase Command Sequence ...........................................................................................16

Sector Erase Command Sequence ........................................................................................16

Erase Suspend/Erase Resume Commands ...........................................................................17

DQ7: #Data Polling.................................................................................................................17

RY/#BY: Ready/#Busy ...........................................................................................................18

DQ6: Toggle Bit I ....................................................................................................................18

DQ2: Toggle Bit II ...................................................................................................................19

Reading Toggle Bits DQ6/DQ2...............................................................................................19

DQ5: Exceeded Timing Limits ................................................................................................19

6.2

Command Definitions............................................................................................................ 13

6.2.1

6.2.2

6.2.3

6.2.4

6.2.5

6.2.6

6.2.7

6.2.8

6.3

Write Operation Status.......................................................................................................... 17

6.3.1

6.3.2

6.3.3

6.3.4

6.3.5

6.3.6

-1-

Publication Release Date: Dec. 25, 2007

Revision A3

W19B320BT/B DATASHEET

6.3.7

DQ3: Sector Erase Timer .......................................................................................................20

TABLE OF OPERATION MODES ................................................................................................. 21

7.1

7.2

7.3

7.4

7.5

7.6

Device Bus Operations ......................................................................................................... 21

AUTOSELECT Codes (High Voltage Method) ..................................................................... 22

Sector Address Table (Top Boot Block) ............................................................................... 23

Sector Address Table (Bottom Boot Block) .......................................................................... 25

Top Boot Sector/Sector Block Address for Protection/Unprotection) ................................... 27

CFI Query Identification String.............................................................................................. 29

7.6.1

7.6.2

7.6.3

7.6.4

7.6.5

System Interface String ..........................................................................................................29

Device Geometry Definition ....................................................................................................30

Primary Vendor-Specific Extended Query ..............................................................................31

Command Definitions .............................................................................................................32

Write Operation Status ...........................................................................................................33

7.7

7.8

7.9

Temporary Sector Unprotect Algorithm ................................................................................ 33

In-System Sector Protect/Unprotect Algorithms ................................................................... 35

Security Sector Protect Verify ............................................................................................... 36

7.10 Program Algorithm ................................................................................................................ 36

7.11 Erase Algorithm..................................................................................................................... 37

7.12 Data Polling Algorithm........................................................................................................... 37

7.13 Toggle Bit Algorithm.............................................................................................................. 38

ELECTRICAL CHARACTERISTICS.............................................................................................. 39

8.1

8.2

8.3

8.4

8.5

8.6

8.7

8.8

8.9

Absolute Maximum Ratings .................................................................................................. 39

Operating Ranges ................................................................................................................. 39

DC Characteristics ................................................................................................................ 40

CMOS Compatible ................................................................................................................ 40

AC Characteristics ................................................................................................................ 41

Test Condition ....................................................................................................................... 41

8.6.1

AC Test Load and Waveforms ...............................................................................................41

Read-Only Operations .......................................................................................................... 42

Hardware Reset (#RESET)................................................................................................... 42

Word/Byte Configuration (#BYTE) ........................................................................................ 42

8.10 Erase and Program Operation .............................................................................................. 43

8.11 Temporary Sector Unprotect................................................................................................. 43

8.12 Alternate #CE Controlled Erase and Program Operations ................................................... 44

TIMING WAVEFORMS .................................................................................................................. 45

9.1

AC Read Waveform .............................................................................................................. 45

Publication Release Date:Dec.25, 2007

Revisionv A3

-2-

W19B320BT/B DATASHEET

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

Reset Waveform ................................................................................................................... 45

#BYTE Waveform for Read Operation.................................................................................. 46

#BYTE Waveform for Write Operation.................................................................................. 46

Programming Waveform ....................................................................................................... 47

Accelerated Programming Waveform ................................................................................... 47

Chip/Sector Erase Waveform ............................................................................................... 48

Back-to back Read/Write Cycle Waveform........................................................................... 48

#Data Polling Waveform (During Embedded Algorithms) .................................................... 49

9.10 Toggle Bit Waveform (During Embedded Algorithms).......................................................... 49

9.11 DQ 2 vs. DQ6 Waveform ...................................................................................................... 50

9.12 Temporary Sector Unprotect Timing Diagram ...................................................................... 50

9.13 Sector/Sector Block Protect and Unprotect Timing Diagram................................................ 50

9.14 Alternate #CE Controlled Write (Erase/Program) Operation Timing .................................... 51

10. LATCHUP CHARACTERISTICS ................................................................................................... 52

11. CAPACITANCE.............................................................................................................................. 52

12. ORDERING INFORMATION.......................................................................................................... 53

13. PACKAGE DIMENSIONS .............................................................................................................. 54

13.1 TFBGA48ball (6X8 mm^2, Ø=0.40mm) ................................................................................ 54

13.2 48-Pin Standard Thin Small Outline Package ...................................................................... 55

14. VERSION HISTORY ...................................................................................................................... 56

-3-

Publication Release Date:Dec. 25, 2007

Revisionv A3

W19B320BT/B DATASHEET

1. GENERAL DESCRIPTION

The W19B320BT/B is a 32Mbit, 2.7~3.6-volt single bank CMOS flash memory organized as 4M x 8 or

16 bits. The word-wide (× 16) data appears on DQ15-DQ0, and byte-wide (x 8) data appears on

DQ7-DQ0. The device can be programmed and erased in-system with a standard 3.0-volt power

supply. A 12-volt V

is not required. The unique cell architecture of the W19B320BT/B results in fast

program/erase operations with extremely low current consumption (compared to other comparable 3-

volt flash memory products). The device can also be programmed and erased by using standard

EPROM programmers.

-4-

Publication Release Date:Dec.25, 2007

Revisionv A3

W19B320BT/B DATASHEET

2. FEATURES

Performance

•

2.7~3.6-volt write (program and erase) operations

Fast write operation

−

Sector erases time: 0.4 Sec (typical)

−

Chip erases time: 30Sec (typical)

−

Byte/Word programming time: 7/9

(typical)

•

Read access time: 70 ns

•

Typical program/erase cycles: 100K

Twenty-year data retention

Ultra low power consumption

−

Active current (Read): 10 mA (typical)

−

Active current (Read while Erase): 21 mA (typical)

−

Standby current: 0.2

μA

(typical)

Architecture

•

Sector erase architecture

−

Eight 8KB, and sixty-three 64KB sectors

−

Top or bottom boot block configurations available

−

Supports full chip erase

•

Security Sector Size: 256 Bytes

−

The Security Sector is an OTP; once the sector is programmed, it cannot be erased

•

JEDEC standard byte-wide and word-wide pinouts

•

Manufactured on WinStack 0.13μm process technology

Available packages: 48-pin TSOP and 48-ball TFBGA (6x8mm)

Software Features

•

Compatible with common Flash Memory Interface (CFI) specification

−

Flash device parameters stored directly on the device

−

Allows software driver to identify and use a variety of different current and future Flash products

•

Erase Suspend/Erase Resume

−

Suspends erase operations to allow programming in same bank

•

End of program detection

−

Software method: Toggle bit/Data polling

•

Unlock Bypass Program command

−

Reduces overall programming time when issuing multiple program command sequences

-5-

Publication Release Date:Dec. 25, 2007

Revisionv A3

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Description	2MX16 FLASH 3V PROM, 70ns, PBGA48, 6X 8 MM, TFBGA-48	2MX16 FLASH 3V PROM, 70ns, PBGA48, 6X 8 MM, TFBGA-48	Flash, 2MX16, 70ns, PDSO48, TSOP-48	Flash, 2MX16, 70ns, PBGA48, 6X 8 MM, TFBGA-48	Flash, 2MX16, 70ns, PBGA48, 6X 8 MM, TFBGA-48	Flash, 2MX16, 70ns, PDSO48, TSOP-48	2MX16 FLASH 3V PROM, 70ns, PDSO48, TSOP-48	2MX16 FLASH 3V PROM, 70ns, PDSO48, TSOP-48
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	BGA	BGA	TSOP	BGA	BGA	TSOP	TSOP	TSOP
package instruction	6X 8 MM, TFBGA-48	TFBGA, BGA48,6X8,32	TSSOP, TSSOP48,.8,20	TFBGA, BGA48,6X8,32	TFBGA, BGA48,6X8,32	TSSOP, TSSOP48,.8,20	TSOP-48	TSSOP, TSSOP48,.8,20
Contacts	48	48	48	48	48	48	48	48
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
Maximum access time	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns
Spare memory width	8	8	8	8	8	8	8	8
startup block	BOTTOM	TOP	TOP	BOTTOM	TOP	BOTTOM	BOTTOM	TOP
command user interface	YES	YES	YES	YES	YES	YES	YES	YES
Universal Flash Interface	YES	YES	YES	YES	YES	YES	YES	YES
Data polling	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	R-PBGA-B48	R-PBGA-B48	R-PDSO-G48	R-PBGA-B48	R-PBGA-B48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48
length	8 mm	8 mm	18.4 mm	8 mm	8 mm	18.4 mm	18.4 mm	18.4 mm
memory density	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of departments/size	8,63	8,63	8,63	8,63	8,63	8,63	8,63	8,63
Number of terminals	48	48	48	48	48	48	48	48
word count	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-20 °C	-20 °C	-40 °C	-40 °C	-40 °C	-40 °C	-20 °C	-20 °C
organize	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TSSOP	TFBGA	TFBGA	TSSOP	TSSOP	TSSOP
Encapsulate equivalent code	BGA48,6X8,32	BGA48,6X8,32	TSSOP48,.8,20	BGA48,6X8,32	BGA48,6X8,32	TSSOP48,.8,20	TSSOP48,.8,20	TSSOP48,.8,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Programming voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES	YES	YES	YES	YES
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Department size	8K,64K	8K,64K	8K,64K	8K,64K	8K,64K	8K,64K	8K,64K	8K,64K
Maximum standby current	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	OTHER	OTHER
Terminal form	BALL	BALL	GULL WING	BALL	BALL	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm	0.5 mm	0.8 mm	0.8 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	DUAL	BOTTOM	BOTTOM	DUAL	DUAL	DUAL
switch bit	YES	YES	YES	YES	YES	YES	YES	YES
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	6 mm	6 mm	12 mm	6 mm	6 mm	12 mm	12 mm	12 mm

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