MT8LS25632M-35L datasheet, PDF

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MT8LS25632M-35L: DescriptionSRAM Module, 256KX32, 35ns, CMOS, SIMM-64; Categorystorage storage; File Size247KB，8 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT8LS25632M-35L Overview

SRAM Module, 256KX32, 35ns, CMOS, SIMM-64

MT8LS25632M-35L Parametric

Parameter Name	Attribute value
Maker	Micron Technology
Parts packaging code	SIMM
package instruction	SIMM, SSIM64
Contacts	64
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	35 ns
I/O type	COMMON
JESD-30 code	R-XSMA-N64
memory density	8388608 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	64
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX32
Output characteristics	3-STATE
Exportable	YES
Package body material	UNSPECIFIED
encapsulated code	SIMM
Encapsulate equivalent code	SSIM64
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	15.113 mm
Maximum standby current	0.0004 A
Minimum standby current	2 V
Maximum slew rate	0.44 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	SINGLE

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MT8LS25632M-35L Related Products

	MT8LS25632M-35L	MT8LS25632Z-35L	MT8LS25632M-35LP	MT8LS25632Z-35LP
Description	SRAM Module, 256KX32, 35ns, CMOS, SIMM-64	SRAM Module, 256KX32, 35ns, CMOS, ZIP-64	SRAM Module, 256KX32, 35ns, CMOS, SIMM-64	SRAM Module, 256KX32, 35ns, CMOS, ZIP-64
Maker	Micron Technology	Micron Technology	Micron Technology	Micron Technology
Parts packaging code	SIMM	ZIP	SIMM	ZIP
package instruction	SIMM, SSIM64	ZIP-64	SIMM, SSIM64	ZIP-64
Contacts	64	64	64	64
Reach Compliance Code	unknown	not_compliant	unknown	not_compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	35 ns	35 ns	35 ns	35 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XSMA-N64	R-XZMA-T64	R-XSMA-N64	R-XZMA-T64
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	64	64	64	64
word count	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	256KX32	256KX32	256KX32	256KX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	SIMM	ZIP	SIMM	ZIP
Encapsulate equivalent code	SSIM64	ZIP64/68,.1,.1	SSIM64	ZIP64/68,.1,.1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	15.113 mm	15.494 mm	15.113 mm	15.494 mm
Maximum standby current	0.0004 A	0.0004 A	0.0004 A	0.0004 A
Minimum standby current	2 V	2 V	2 V	2 V
Maximum slew rate	0.44 mA	0.44 mA	0.44 mA	0.44 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	SINGLE	ZIG-ZAG	SINGLE	ZIG-ZAG

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