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IS24C01-5PA

Description
EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
Categorystorage    storage   
File Size54KB,16 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Download Datasheet Parametric Compare View All

IS24C01-5PA Overview

EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8

IS24C01-5PA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeDIP
package instruction0.300 INCH, PLASTIC, DIP-8
Contacts8
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum clock frequency (fCLK)0.4 MHz
JESD-30 codeR-PDIP-T8
JESD-609 codee0
length9.325 mm
memory density1024 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count128 words
character code128
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize128X8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height4.57 mm
Serial bus typeI2C
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
Maximum write cycle time (tWC)10 ms
IS24C01 IS24C02
IS24C04 IS24C08 IS24C16
1K-bit/2K-bit/4K-bit/8K-bit/16K-bit
2-WIRE SERIAL CMOS EEPROM
FEATURES
• Low Power CMOS Technology
–Standby Current less than 8 µA (5.5V)
–Read Current (typical) less than 1 mA (5.5V)
–Write Current (typical) less than 3 mA (5.5V)
• Flexible Voltage Operation
–Vcc = 1.8V to 5.5V for –2 version
–Vcc = 2.5V to 5.5V for –3 version
• 400 KHz (I
2
C Protocol) Compatibility
• Hardware Data Protection
–Write Protect Pin
• Sequential Read Feature
• Filtered Inputs for Noise Suppression
• 8-pin PDIP and 8-pin SOIC packages
• 8-pin TSSOP (1K,2K, 4K & 8K only)
• 8-pin MSOP (1K,2K only)
• Self time write cycle with auto clear
5 ms @ 2.5V
• Organization:
–IS24C01 128x8 (one block of 128 bytes)
–IS24C02 256x8 (one block of 256 bytes)
–IS24C04 512x8 (two blocks of 256 bytes)
–IS24C08 1024x8 (four blocks of 256 bytes)
–IS24C16 2048x8 (eight blocks of 256 bytes)
• Page Write Buffer
• Two-Wire Serial Interface
–Bi-directional data transfer protocol
• High Reliability
–Endurance: 1,000,000 Cycles
–Data Retention: 100 Years
• Commercial, Industrial and Automotive tempera-
ture ranges
ISSI
APRIL 2002
®
DESCRIPTION
The IS24CXX (refers to IS24C01, IS24C02, IS24C04,
IS24C08, IS24C16) family is a low-cost and low voltage 2-
wire Serial EEPROM. It is fabricated using ISSI’s advanced
CMOS EEPROM technology and provides a low power and
low voltage operation. The IS24CXX family features a write
protection feature, and is available in 8-pin DIP and 8-pin
SOIC packages.
The IS24C01 is a 1K-bit EEPROM; IS24C02 is a 2K-bit
EEPROM; IS24C04 is a 4K-bit EEPROM; IS24C08 is a 8K-
bit EEPROM; IS24C16 is a 16K-bit EEPROM.
The IS24C01 and IS24C02 are available in 8-pin MSOP
package. The IS24C01, IS24C02, IS24C04, and IS24C08
are available in 8-Pin TSSOP package.
Automotive data is preliminary.
Copyright © 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. D
06/25/02
1

IS24C01-5PA Related Products

IS24C01-5PA IS24C01-3SA IS24C01-5GA IS24C01-3GA IS24C01-3PA IS24C01-5SA IS24C01-5ZA
Description EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 EEPROM, 128X8, Serial, CMOS, PDSO8, MSOP-8 EEPROM, 128X8, Serial, CMOS, PDSO8, SOIC-8 EEPROM, 128X8, Serial, CMOS, PDSO8, SOIC-8 EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 EEPROM, 128X8, Serial, CMOS, PDSO8, MSOP-8 EEPROM, 128X8, Serial, CMOS, PDSO8, TSSOP-8
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP MSOP SOIC SOIC DIP MSOP SOIC
package instruction 0.300 INCH, PLASTIC, DIP-8 TSSOP, TSSOP8,.19 SOIC-8 SOIC-8 0.300 INCH, PLASTIC, DIP-8 MSOP-8 TSSOP-8
Contacts 8 8 8 8 8 8 8
Reach Compliance Code unknown not_compliant unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 0.4 MHz 0.1 MHz 0.4 MHz 0.1 MHz 0.1 MHz 0.4 MHz 0.4 MHz
JESD-30 code R-PDIP-T8 S-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 S-PDSO-G8 R-PDSO-G8
JESD-609 code e0 e0 e0 e0 e0 e0 e0
length 9.325 mm 3 mm 4.9 mm 4.9 mm 9.325 mm 3 mm 4.4 mm
memory density 1024 bit 1024 bit 1024 bit 1024 bit 1024 bit 1024 bit 1024 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8
word count 128 words 128 words 128 words 128 words 128 words 128 words 128 words
character code 128 128 128 128 128 128 128
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 128X8 128X8 128X8 128X8 128X8 128X8 128X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP TSSOP SOP SOP DIP TSSOP TSSOP
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.57 mm 1.1 mm 1.75 mm 1.75 mm 4.57 mm 1.1 mm 1.2 mm
Serial bus type I2C I2C I2C I2C I2C I2C I2C
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 2.7 V 4.5 V 2.7 V 2.7 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES YES NO YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch 2.54 mm 0.65 mm 1.27 mm 1.27 mm 2.54 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 3 mm 3.9 mm 3.9 mm 7.62 mm 3 mm 3 mm
Maximum write cycle time (tWC) 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms
Maker Integrated Silicon Solution ( ISSI ) - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Is it lead-free? - Contains lead Contains lead Contains lead - - Contains lead
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