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ECCM7AA18-17.734475MTR

Description
QUARTZ CRYSTAL RESONATOR, 17.734475MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
CategoryPassive components    Crystal/resonator   
File Size154KB,5 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Environmental Compliance  
Download Datasheet Parametric View All

ECCM7AA18-17.734475MTR Overview

QUARTZ CRYSTAL RESONATOR, 17.734475MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

ECCM7AA18-17.734475MTR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerECLIPTEK
package instructionROHS COMPLIANT, CERAMIC, SMD, 4 PIN
Reach Compliance Codecompliant
Other featuresAT-CUT CRYSTAL; TAPE AND REEL
Ageing3 PPM/YEAR
Crystal/Resonator TypePARALLEL - FUNDAMENTAL
Drive level100 µW
frequency stability0.005%
frequency tolerance50 ppm
JESD-609 codee4
load capacitance18 pF
Manufacturer's serial numberECCM7
Installation featuresSURFACE MOUNT
Nominal operating frequency17.734475 MHz
Maximum operating temperature60 °C
Minimum operating temperature-10 °C
physical sizeL3.2XB2.5XH0.8 (mm)/L0.126XB0.098XH0.031 (inch)
Series resistance100 Ω
surface mountYES
Terminal surfaceNickel/Gold (Ni/Au)

ECCM7AA18-17.734475MTR Preview

ECCM7AA18-17.734475M TR
Series
RoHS Compliant (Pb-free) 2.5mm x 3.2mm Ceramic
SMD Crystal
Frequency Tolerance/Stability
±50ppm at 25°C, ±50ppm over -10°C to +60°C
Mode of Operation
AT-Cut Fundamental
RoHS
Pb
Packaging Options
Tape & Reel
ECCM7 A A 18 -17.734475M TR
Nominal Frequency
17.734475MHz
Load Capacitance
18pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Crystal Cut
Spurious Response
Storage Temperature Range
Insulation Resistance
17.734475MHz
±50ppm at 25°C, ±50ppm over -10°C to +60°C
±3ppm/Year Maximum
18pF Parallel Resonant
5pF Maximum
100 Ohms Maximum
AT-Cut Fundamental
100µWatts Maximum
AT-Cut
>3dB (from Fo to Fo +5000ppm)
-40°C to +85°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
CONNECTION
Crystal
Cover/Ground
Crystal
Cover/Ground
2.50
±0.10
MARKING
ORIENTATION
0.70 ±0.10
4
1
1.20
±0.10
3
2
0.90 ±0.10
(X4)
2
1.00
±0.10
(X4)
3
4
LINE MARKING
1
2
E17.7
E=Ecliptek Designator
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
3.20
±0.10
0.80 MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 1 of 5
ECCM7AA18-17.734475M TR
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.3 (X4)
1.3 (X4)
0.8
Solder Land
(X4)
0.4
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 2 of 5
ECCM7AA18-17.734475M TR
Tape & Reel Dimensions
Quantity Per Reel: 3,000 units
4.0 ±0.1
2.00 ±0.05
DIA 1.5 ±0.2
0.20 ±0.05
3.5 ±0.1
8.0 ±0.2
2.75 ±0.10
3.6
±0.1
4.0 ±0.1
*Compliant to EIA 481A
2.9 ±0.1
1.0 ±0.1
1.5 MIN
DIA 40 MIN
Access Hole at
Slot Location
14.4 MAX
360 MAX
DIA 50 MIN
DIA 20.2 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
8.4 +1.5/-0.0
DIA 13.0 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 3 of 5
ECCM7AA18-17.734475M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 4 of 5
ECCM7AA18-17.734475M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 245°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 5 of 5
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