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Datasheet> All Categories > storage> storage> M366S0924BTS-C1L
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M366S0924BTS-C1L

Description
Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-168
Categorystorage    storage   
File Size128KB，9 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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M366S0924BTS-C1L Overview

Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-168

M366S0924BTS-C1L Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeDIMM
package instructionDIMM, DIMM168
Contacts168
Reach Compliance Codecompliant
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density536870912 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width64
Humidity sensitivity level1
Number of functions1
Number of ports1
Number of terminals168
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)225
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
self refreshYES
Maximum standby current0.004 A
Maximum slew rate0.84 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

M366S0924BTS-C1L Preview

M366S0924BTS
M366S0924BTS SDRAM DIMM
PC100 Unbuffered DIMM
8Mx64 SDRAM DIMM based on 8Mx16, 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD
GENERAL DESCRIPTION
The Samsung M366S0924BTS is a 8M bit x 64 Synchronous
Dynamic RAM high density memory module. The Samsung
M366S0924BTS consists of four CMOS 8M x 16 bit with 4banks
Synchronous DRAMs in TSOP-II 400mil package and a 2K
EEPROM in 8-pin TSSOP package on a 168-pin glass-epoxy
substrate. Two 0.1uF decoupling capacitors are mounted on the
printed circuit board in parallel for each SDRAM.
The M366S0924BTS is a Dual In-line Memory Module and is
intended for mounting into 168-pin edge connector sockets.
Synchronous design allows precise cycle control with the use of
system clock. I/O transactions are possible on every clock cycle.
Range of operating frequencies, programmable latencies allows
the same device to be useful for a variety of high bandwidth,
high performance memory system applications.
FEATURE
• Performance range
Part No.
M366S0924BTS-C80
M366S0924BTS-C1H
M366S0924BTS-C1L
•
•
•
•
•
Max Freq. (Speed)
125MHz (8ns @ CL=3)
100MHz (10ns @ CL=2)
100MHz (10ns @ CL=3)
Burst mode operation
Auto & self refresh capability (4096 Cycles/64ms)
LVTTL compatible inputs and outputs
Single 3.3V
±
0.3V power supply
MRS cycle with address key programs
Latency (Access from column address)
Burst length (1, 2, 4, 8 & Full page)
Data scramble (Sequential & Interleave)
• All inputs are sampled at the positive going edge of the
system clock
• Serial presence detect with EEPROM
• PCB :
Height (1,000mil)
, single sided component
PIN CONFIGURATIONS (Front side/back side)
Pin Front Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
V
SS
DQ0
DQ1
DQ2
DQ3
V
DD
DQ4
DQ5
DQ6
DQ7
DQ8
V
SS
DQ9
DQ10
DQ11
DQ12
DQ13
V
DD
DQ14
DQ15
*CB0
*CB1
V
SS
NC
NC
V
DD
WE
DQM0
Front
Pin Front Pin
Back
V
SS
DQ32
DQ33
DQ34
DQ35
V
DD
DQ36
DQ37
DQ38
DQ39
DQ40
V
SS
DQ41
DQ42
DQ43
DQ44
DQ45
V
DD
DQ46
DQ47
*CB4
*CB5
V
SS
NC
NC
V
DD
CAS
DQM4
Pin
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
Back
DQM5
*CS1
RAS
V
SS
A1
A3
A5
A7
A9
BA0
A11
V
DD
*CLK1
*A12
V
SS
CKE0
*CS3
DQM6
DQM7
*A13
V
DD
NC
NC
*CB6
*CB7
V
SS
DQ48
DQ49
Pin
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
Back
DQ50
DQ51
V
DD
DQ52
NC
*V
REF
NC
V
SS
DQ53
DQ54
DQ55
V
SS
DQ56
DQ57
DQ58
DQ59
V
DD
DQ60
DQ61
DQ62
DQ63
V
SS
*CLK3
NC
**SA0
**SA1
**SA2
V
DD
29 DQM1 57 DQ18 85
58 DQ19 86
30
CS0
59
DU
31
V
DD
87
60 DQ20 88
32
V
SS
33
A0
61
NC
89
62 *V
REF
90
34
A2
63 *CKE1 91
A4
35
64
A6
36
V
SS
92
65 DQ21 93
A8
37
38 A10/AP 66 DQ22 94
67 DQ23 95
BA1
39
68
V
DD
40
V
SS
96
69 DQ24 97
41
V
DD
42 CLK0 70 DQ25 98
71 DQ26 99
V
SS
43
NC
44
72 DQ27 100
73
CS2
45
V
DD
101
46 DQM2 74 DQ28 102
47 DQM3 75 DQ29 103
76 DQ30 104
NC
48
V
DD
49
77 DQ31 105
78
NC
50
V
SS
106
79 CLK2 107
NC
51
52 *CB2 80
NC 108
53 *CB3 81
WP 109
82 **SDA 110
V
SS
54
55 DQ16 83 **SCL 111
56 DQ17 84
V
DD
112
PIN NAMES
Pin Name
A0 ~ A11
BA0 ~ BA1
DQ0 ~ DQ63
CLK0, CLK2
CKE0
CS0, CS2
RAS
CAS
WE
DQM0 ~ 7
V
DD
V
SS
*V
REF
SDA
SCL
SA0 ~ 2
WP
DU
NC
Function
Address input (Multiplexed)
Select bank
Data input/output
Clock input
Clock enable input
Chip select input
Row address strobe
Column address strobe
Write enable
DQM
Power supply (3.3V)
Ground
Power supply for reference
Serial data I/O
Serial clock
Address in EEPROM
Write protection
Don′t use
No connection
* These pins are not used in this module.
**
These pins should be NC in the system
which does not support SPD.
* SAMSUNG ELECTRONICS CO., Ltd. reserves the right to change products and specifications without notice.
Rev. 0.0 Aug. 1999
M366S0924BTS
PIN CONFIGURATION DESCRIPTION
Pin
CLK
CS
Name
System clock
Chip select
PC100 Unbuffered DIMM
Input Function
Active on the positive going edge to sample all inputs.
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and DQM
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
CKE should be enabled 1CLK+t
SS
prior to valid command.
Row/column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA11, Column address : CA0 ~ CA8
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.
Latches column addresses on the positive going edge of the CLK with CAS low.
Enables column access.
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
Makes data output Hi-Z, t
SHZ
after the clock and masks the output.
Blocks data input when DQM active. (Byte masking)
Data inputs/outputs are multiplexed on the same pins.
WP pin is connected to V
SS
through 47KΩ Resistor.
When WP is "high", EEPROM Programming will be inhibited and the entire memory will
be write-protected.
Power and ground for the input buffers and the core logic.
CKE
Clock enable
A0 ~ A11
BA0 ~ BA1
RAS
CAS
WE
DQM0 ~ 7
DQ0 ~ 63
WP
V
DD
/V
SS
Address
Bank select address
Row address strobe
Column address strobe
Write enable
Data input/output mask
Data input/output
Write protection
Power supply/ground
Rev. 0.0 Aug. 1999
M366S0924BTS
FUNCTIONAL BLOCK DIAGRAM
CS0
DQM0
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQM1
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
CS2
DQM2
LDQM
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
UDQM
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
LDQM
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
UDQM
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
•
•
PC100 Unbuffered DIMM
DQM4
CS
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQM5
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQM6
CS
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQM7
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
LDQM
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
UDQM
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
Serial PD
CS
LDQM
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
UDQM
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
CS
U0
U2
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQM3
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
U1
U3
A0 ~ An, BA0 & 1
RAS
CAS
WE
CKE0
10Ω
DQn
V
DD
Vss
•
•
•
•
SDRAM U0 ~ U3
SDRAM U0 ~ U3
SDRAM U0 ~ U3
SDRAM U0 ~ U3
SDRAM U0 ~ U3
SCL
A0
A1
A2
•
SDA
WP
47KΩ
SA0 SA1 SA2
10Ω
CLK0/2
15pF
•
•
U0/U2
U1/U3
Every DQpin of SDRAM
10Ω
CLK1/3
Two 0.1uF Capacitors
per each SDRAM
To all SDRAMs
10pF
Rev. 0.0 Aug. 1999
M366S0924BTS
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on any pin relative to Vss
Voltage on V
DD
supply relative to Vss
Storage temperature
Power dissipation
Short circuit current
Symbol
V
IN
, V
OUT
V
DD
, V
DDQ
T
STG
P
D
I
OS
PC100 Unbuffered DIMM
Value
-1.0 ~ 4.6
-1.0 ~ 4.6
-55 ~ +150
4
50
Unit
V
V
°C
W
mA
Note :
Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
DC OPERATING CONDITIONS AND CHARACTERISTICS
Recommended operating conditions (Voltage referenced to V
SS
= 0V, T
A
= 0 to 70°C)
Parameter
Supply voltage
Input logic high voltage
Input logic low voltage
Output logic high voltage
Output logic low voltage
Input leakage current
Symbol
V
DD
, V
DDQ
V
IH
V
IL
V
OH
V
OL
I
LI
Min
3.0
2.0
-0.3
2.4
-
-10
Typ
3.3
3.0
0
-
-
-
Max
3.6
V
DDQ
+0.3
0.8
-
0.4
10
Unit
V
V
V
V
V
uA
1
2
I
OH
= -2mA
I
OL
= 2mA
3
Note
Notes :
1. V
IH
(max) = 5.6V AC. The overshoot voltage duration is
≤
3ns.
2. V
IL
(min) = -2.0V AC. The undershoot voltage duration is
≤
3ns.
3. Any input 0V
≤
V
IN
≤
V
DDQ.
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
CAPACITANCE
(V
DD
= 3.3V, T
A
= 23°C, f = 1MHz, V
REF
= 1.4V
±
200 mV)
Pin
Symbol
C
ADD
C
IN
C
CKE
C
CLK
C
CS
C
DQM
C
OUT
Min
15
15
15
10
10
8
9
Max
25
25
25
13
15
10
12
Unit
pF
pF
pF
pF
pF
pF
pF
Address (A0 ~ A11, BA0 ~ BA1)
RAS, CAS, WE
CKE (CKE0)
Clock (CLK0, CLK2)
CS (CS0, CS2)
DQM (DQM0 ~ DQM7)
DQ (DQ0 ~ DQ63)
Rev. 0.0 Aug. 1999
M366S0924BTS
DC CHARACTERISTICS
(Recommended operating condition unless otherwise noted, T
A
= 0 to 70°C)
Parameter
Symbol
Burst length = 1
t
RC
≥
t
RC
(min)
I
O
= 0 mA
CKE
≤
V
IL
(max), t
CC
= 10ns
CKE & CLK
≤
V
IL
(max), t
CC
=
∞
Test Condition
PC100 Unbuffered DIMM
Version
-80
-1H
560
4
4
80
-1L
560
Unit
Note
Operating current
(One bank active)
Precharge standby current in
power-down mode
I
CC1
I
CC2
P
I
CC2
PS
I
CC2
N
600
mA
1
mA
Precharge standby current in
non power-down mode
I
CC2
NS
Active standby current in
power-down mode
Active standby current in
non power-down mode
(One bank active)
I
CC3
P
I
CC3
PS
I
CC3
N
I
CC3
NS
CKE
≥
V
IH
(min), CS
≥
V
IH
(min), t
CC
= 10ns
Input signals are changed one time during 20ns
CKE
≥
V
IH
(min), CLK
≤
V
IL
(max), t
CC
=
∞
Input signals are stable
CKE
≤
V
IL
(max), t
CC
= 10ns
CKE & CLK
≤
V
IL
(max), t
CC
=
∞
CKE
≥
V
IH
(min), CS
≥
V
IH
(min), t
CC
= 10ns
Input signals are changed one time during 20ns
CKE
≥
V
IH
(min), CLK
≤
V
IL
(max), t
CC
=
∞
Input signals are stable
I
O
= 0 mA
Page burst
4Banks activated
t
CCD
= 2CLKs
t
RC
≥
t
RC
(min)
CKE
≤
0.2V
mA
28
20
20
120
80
mA
mA
mA
Operating current
(Burst mode)
Refresh current
Self refresh current
I
CC4
680
580
580
mA
1
I
CC5
I
CC6
880
840
6
840
mA
mA
2
Notes :
1. Measured with outputs open.
2. Refresh period is 64ms.
3. Unless otherwise noted, input swing level is CMOS(V
IH
/V
IL
=V
DDQ
/V
SSQ
)
Rev. 0.0 Aug. 1999
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M366S0924BTS-C1L Related Products

M366S0924BTS-C1L M366S0924BTS-C1H M366S0924BTS-C80
Description Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-168 Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-168 Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-168
Is it Rohs certified? incompatible incompatible incompatible
Maker SAMSUNG SAMSUNG SAMSUNG
Parts packaging code DIMM DIMM DIMM
package instruction DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168
Contacts 168 168 168
Reach Compliance Code compliant compliant compli
ECCN code EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 6 ns 6 ns 6 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 100 MHz 100 MHz 125 MHz
I/O type COMMON COMMON COMMON
JESD-30 code R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
memory density 536870912 bit 536870912 bit 536870912 bi
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 64 64 64
Humidity sensitivity level 1 1 1
Number of functions 1 1 1
Number of ports 1 1 1
Number of terminals 168 168 168
word count 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 8MX64 8MX64 8MX64
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM
Encapsulate equivalent code DIMM168 DIMM168 DIMM168
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) 225 225 225
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
refresh cycle 4096 4096 4096
self refresh YES YES YES
Maximum standby current 0.004 A 0.004 A 0.004 A
Maximum slew rate 0.84 mA 0.84 mA 0.88 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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