HC/UH SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | QLCC |
| package instruction | QCCN, LCC20,.35SQ |
| Contacts | 20 |
| Reach Compliance Code | not_compliant |
| series | HC/UH |
| JESD-30 code | S-CQCC-N20 |
| length | 8.89 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.0052 A |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | OPEN-DRAIN |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC20,.35SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 2/6 V |
| Prop。Delay @ Nom-Sup | 36 ns |
| propagation delay (tpd) | 155 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 2.03 mm |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 8.89 mm |
| SN54HC03FK | SN74HC03D-00 | SN74HC03N-10 | SN54HC03J-00 | SN74HC03DR-00 | SN54HC03FK-00 | SN74HC03N-00 | |
|---|---|---|---|---|---|---|---|
| Description | HC/UH SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDIP14 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, CDIP14 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDSO14 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, CQCC20 | HC/UH SERIES, QUAD 2-INPUT NAND GATE, PDIP14 |
| Reach Compliance Code | not_compliant | unknown | unknown | unknown | unknown | unknown | unknown |
| series | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 code | S-CQCC-N20 | R-PDSO-G14 | R-PDIP-T14 | R-GDIP-T14 | R-PDSO-G14 | S-CQCC-N20 | R-PDIP-T14 |
| length | 8.89 mm | 8.65 mm | 19.305 mm | 19.56 mm | 8.65 mm | 8.89 mm | 19.305 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 20 | 14 | 14 | 14 | 14 | 20 | 14 |
| Maximum operating temperature | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C |
| Minimum operating temperature | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C | -55 °C | -40 °C |
| Output characteristics | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| Package body material | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| encapsulated code | QCCN | SOP | DIP | DIP | SOP | QCCN | DIP |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER | IN-LINE |
| propagation delay (tpd) | 155 ns | 25 ns | 25 ns | 30 ns | 25 ns | 30 ns | 25 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.03 mm | 1.75 mm | 5.08 mm | 5.08 mm | 1.75 mm | 2.03 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL |
| Terminal form | NO LEAD | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
| width | 8.89 mm | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm | 8.89 mm | 7.62 mm |
| Maker | Texas Instruments | - | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | QCCN, LCC20,.35SQ | SOP, | DIP, | DIP, | SOP, | - | DIP, |