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ECCM7DA18-32.768M

Description
QUARTZ CRYSTAL RESONATOR, 32.768MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
CategoryPassive components    Crystal/resonator   
File Size121KB,4 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Environmental Compliance  
Download Datasheet Parametric View All

ECCM7DA18-32.768M Overview

QUARTZ CRYSTAL RESONATOR, 32.768MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

ECCM7DA18-32.768M Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerECLIPTEK
package instructionROHS COMPLIANT, CERAMIC, SMD, 4 PIN
Reach Compliance Codecompliant
Other featuresAT-CUT CRYSTAL; BULK
Ageing3 PPM/YEAR
Crystal/Resonator TypePARALLEL - FUNDAMENTAL
Drive level100 µW
frequency stability0.005%
frequency tolerance30 ppm
JESD-609 codee4
load capacitance18 pF
Manufacturer's serial numberECCM7
Installation featuresSURFACE MOUNT
Nominal operating frequency32.768 MHz
Maximum operating temperature60 °C
Minimum operating temperature-10 °C
physical sizeL3.2XB2.5XH0.8 (mm)/L0.126XB0.098XH0.031 (inch)
Series resistance60 Ω
surface mountYES
Terminal surfaceNickel/Gold (Ni/Au)

ECCM7DA18-32.768M Preview

ECCM7DA18-32.768M
Series
RoHS Compliant (Pb-free) 2.5mm x 3.2mm Ceramic
SMD Crystal
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over -10°C to +60°C
Mode of Operation
AT-Cut Fundamental
RoHS
Pb
ECCM7 D A 18 -32.768M
Nominal Frequency
32.768MHz
Load Capacitance
18pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Crystal Cut
Spurious Response
Storage Temperature Range
Insulation Resistance
32.768MHz
±30ppm at 25°C, ±50ppm over -10°C to +60°C
±3ppm/Year Maximum
18pF Parallel Resonant
5pF Maximum
60 Ohms Maximum
AT-Cut Fundamental
100µWatts Maximum
AT-Cut
>3dB (from Fo to Fo +5000ppm)
-40°C to +85°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
CONNECTION
Crystal
Cover/Ground
Crystal
Cover/Ground
2.50
±0.10
MARKING
ORIENTATION
0.70 ±0.10
4
1
1.20
±0.10
3
2
0.90 ±0.10
(X4)
2
1.00
±0.10
(X4)
3
4
LINE MARKING
1
2
E32.7
E=Ecliptek Designator
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
3.20
±0.10
0.80 MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 1 of 4
ECCM7DA18-32.768M
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.3 (X4)
1.3 (X4)
0.8
Solder Land
(X4)
0.4
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 2 of 4
ECCM7DA18-32.768M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 3 of 4
ECCM7DA18-32.768M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 245°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev I 8/12/2010 | Page 4 of 4
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