MASW-009276-001DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Features
•
802.11b/g and Bluetooth Applications
•
Low Insertion Loss:
0.5 dB 2.4 GHz to 2.5 GHz band
•
High Isolation: 32 dB Typical on R
X
•
Low Harmonics: <-70 dBc @ 20 dBm
•
Flip-chip configuration
•
RoHS* Compliant
Rev. V2
Die Bump Pad Layout (bump side up)
Description
The MASW-009276-001DIE is a bumped GaAs
pHEMT MMIC SP3T switch. Typical applications are
WLAN (802.11 b/g) and Bluetooth applications.
The MASW-009276-001DIE delivers high
isolation, low insertion loss, and high linearity at
2.4 - 2.5 GHz. This device is fabricated using a
0.5 micron gate length GaAs pHEMT process.
The process features full passivation for
performance and reliability. This die features
SnAg(3.5%)Cu(1%) solder bumps for Wafer Level
Chip Scale Package (WLCSP) applications.
Die Bump Pad Configuration
Name
V
C
1
BT
GND
R
X
Description
Voltage Control 1
Blue Tooth T
X
/R
X
Port
Ground
2.5 GHz R
X
Port
Voltage Control 3
2.5 GHz T
X
Port
Voltage Control 2
Antenna Port
Ordering Information
Part Number
MASW-009276-001D3K
MASW-009276-002SMB
Package
Die in 3000 piece reel
Sample Board SP3T
V
C
3
T
X
V
C
2
RFC
Absolute Maximum Ratings
1,2
Parameter
Input Power @ 3 V Control
Input Power @ 5 V Control
Operating Voltage
Operating Temperature
Storage Temperature
Absolute Maximum
+32 dBm
+35 dBm
+8 volts
-40°C to +85°C
-65°C to +150°C
1. Exceeding any one or combination of these limits may cause
permanent damage to this device.
2. M/A-COM Technology does not recommend sustained
operation near these survivability limits.
*
Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
1
MASW-009276-001DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Electrical Specifications
3
: T
A
= 25°C, Z
0
= 50
Ω,
Vc = 0 V / 3 V, Pin = 0 dBm
Parameter
Insertion Loss
Isolation
Return Loss
IP3
Input P1dB
Harmonics
Switching Speed
Control Current
3. External blocking capacitors on all RF ports.
Rev. V2
Test Conditions
RFC to Tx/Rx/BT, 2.4 GHz
RFC to Tx, 2.4 GHz
RFC to Rx, 2.4 GHz
RFC to BT, 2.4 GHz
2.4 - 2.5 GHz
RFC to Tx/Rx/BT, 2.4 GHz, 20 dBm Total Power, 1MHz Spacing
RFC to Tx, 2.4 GHz
RFC to Rx, 2.4 GHz
RFC to BT, 2.4 GHz
RFC to Tx 2.4 GHz, 20 dBm
50% control to 90% RF
50%control to 10% RF
|Vc| = 3 V
Units
dB
dB
dB
dB
dB
dBm
dBm
dBm
ns
µA
Min.
—
20
30
20
—
—
—
—
—
—
—
—
—
Typ.
0.5
24
32
24
15
55
32
28
32
-75
165
25
<1
Max.
0.75
—
—
—
—
—
—
—
—
—
—
—
10
Recommended PCB Configuration
Truth Table
4,5,6
V
C
1
1
0
0
V
C
2
0
1
0
V
C
3
0
0
1
RFC–BT
On
Off
Off
RFC-T
X
Off
On
Off
RFC-R
X
Off
Off
On
4. For positive voltage control, external DC blocking capacitors
are required on all RF ports.
5. Differential voltage, V(state 1) - V(state 0), must be
+2.7 V minimum and must not exceed +5 V.
6. 0 = 0 ± 0.3 V, 1 = +2.7 V to +5 V.
Handling Procedures
Parts List
Part
C1 - C4
C5 - C7
Value
39 pF
1000 pF
Case Style
0402
0402
Please observe the following precautions to avoid
damage:
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
2
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-009276-001DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Product Consistency Distribution Charts
7
(on wafer RF test)
LS L
Rev. V2
Process Capability
P rocess Data
LS L
20
Target
*
S ample M ean 24.1799
O v erall C apability
P pk
8.55
LS L
Process Capability
P rocess Data
LS L
30
Target
*
S ample M ean 32.0545
O v erall C apability
P pk
3.04
18
19
20
21
22
23
24
25
26
27
28
28
29
30
31
32
33
34
35
36
37
38
T
X
and
and
Isolation (dB)
(dB)
Tx
BT
BT Isolation
R
RX Isolation (dB)
X
Isolation (dB)
LB
Process Capability
P rocess Data
LB
0
Target
*
USL
0.75
S ample M ean 0.513984
O v erall C apability
P pk
2.64
USL
LB
Process Capability
P rocess Data
LB
0
Target
*
USL
2
S ample M ean 0.272007
USL
O v erall C apability
P pk
3.69
-0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.00
0.28
0.56
0.84
1.12
1.40
1.68
1.96
Insertion
- All
(dB)
Insertion Loss
Loss
Paths (dB)
Switch
Current -
-
All Paths (µA)
Current All Paths (uA)
7. Represents >5 wafers, tested per electrical specifications, probed directly on the die to the solder bump: T
A
= 25°C, Z
0
= 50
Ω,
V
C
= 0/3V,
P
IN
= 0 dBm
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-009276-001DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Typical Performance Curves (plots = chip on board assembly)
T
X
Insertion Loss
0.80
+25°C
-40°C
+85°C
Rev. V2
T
X
Isolation
35
0.75
30
+25°C
-40°C
+85°C
0.70
25
0.65
20
0.60
2.40
2.42
2.44
2.46
2.48
2.50
15
2.40
2.42
2.44
2.46
2.48
2.50
Frequency (GHz)
Frequency (GHz)
R
X
Insertion Loss
0.75
R
X
Isolation
35
0.70
30
0.65
25
+25°C
-40°C
+85°C
0.60
+25°C
-40°C
+85°C
20
0.55
2.40
2.42
2.44
2.46
2.48
2.50
15
2.40
2.42
2.44
2.46
2.48
2.50
Frequency (GHz)
Frequency (GHz)
BT Insertion Loss
0.80
+25°C
-40°C
+85°C
BT Isolation
35
0.75
30
+25°C
-40°C
+85°C
0.70
25
0.65
20
0.60
2.40
2.42
2.44
2.46
2.48
2.50
15
2.40
2.42
2.44
2.46
2.48
2.50
Frequency (GHz)
Frequency (GHz)
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW-009276-001DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Die Dimensions (Top and Side Views)
PCB Top Metal / Solder Mask
Rev. V2
Die Bump Pad Layout - Top View
(bump side up)
Die Bump Pad Layout - Bottom View
(bump side down - as installed on board)
8. Orientation mark is only on material that is shipped in tape and
reel. The mark is not available on die shipped on grip ring.
5
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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