Sirenza Microdevices SGA-5389 is a high performance SiGe
HBT MMIC Amplifier. A Darlington configuration featuring 1
micron emitters provides high F
T
and excellent thermal
perfomance. The heterojunction increases breakdown voltage
and minimizes leakage current between junctions. Cancellation
of emitter junction non-linearities results in higher suppression
of intermodulation products. At 850 Mhz and 60mA , the SGA-
5389 typically provides +31.5 dBm output IP3, 16.4 dB of gain,
and +16.3 dBm of 1dB compressed power using a single positive
voltage supply. Only 2 DC-blocking capacitors, a bias resistor
and an optional RF choke are required for operation.
Gain & Return Loss vs. Frequency
V
D
= 3.6 V, I
D
= 60 mA (Typ.)
SGA-5389
DC-4500 MHz, Cascadable
SiGe HBT MMIC Amplifier
Product Features
High Gain : 15.4 dB at 1950 MHz
Cascadable 50 Ohm
Patented SiGe Technology
20
GAIN
0
-10
Return Loss (dB)
15
Gain (dB)
ORL
Operates From Single Supply
Low Thermal Resistance Package
10
5
0
0
1
2
3
4
Frequency (GHz)
5
6
IRL
-20
-30
-40
Applications
PA Driver Amplifier
Cellular, PCS, GSM, UMTS
IF Amplifier
Wireless Data, Satellite
Units
dB
dB
dB
dBm
dBm
dBm
dBm
M Hz
dB
dB
dB
V
mA
°C/W
1950 M Hz
1950 M Hz
1950 M Hz
3.1
54
Frequency
850 M Hz
1950 M Hz
2400 M Hz
850 M Hz
1950 M Hz
850 M Hz
1950 M Hz
Min.
14.8
Ty p.
16.4
15.4
14.9
16.3
15.0
31.5
28.1
4500
27.6
15.9
3.5
3.6
60
97
4.1
66
Max.
18.0
Sy mbol
G
P
1dB
OIP
3
Parameter
Small Signal Gain
Output Pow er at 1dB Compression
Output Third Order Intercept Point
Bandw idth
Determined by Return Loss (>10dB)
IRL
ORL
NF
V
D
I
D
R
TH
, j-l
Input Return Loss
Output Return Loss
Noise Figure
Device Operating Voltage
Device Operating Current
Thermal Resistance (junction to lead)
V
S
= 8 V
R
BIAS
= 75 Ohms
I
D
= 60 mA Typ.
T
L
= 25ºC
Test Conditions:
OIP
3
Tone Spacing = 1 MHz, Pout per tone = 0 dBm
Z
S
= Z
L
= 50 Ohms
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of
this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are
implied or granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2001 Sirenza Microdevices, Inc..
All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
1
http://www.sirenza.com
EDS-100616 Rev C
Preliminary
SGA-5389 DC-4500 MHz Cascadable MMIC Amplifier
Typical RF Performance at Key Operating Frequencies
Sy mbol
Parameter
Unit
100
Frequency
Frequency (MHz)
Frequency (MHz)(MHz)
500
850
1950
2400
3500
G
OIP
3
P
1dB
IRL
ORL
S
12
NF
Small Signal Gain
Output Third Order Intercept Point
Output Pow er at 1dB Compression
Input Return Loss
Output Return Loss
Reverse Isolation
Noise Figure
dB
dBm
dBm
dB
dB
dB
dB
16.9
16.7
31.8
16.7
16.4
31.5
16.3
22.2
23.4
20.8
3.3
15.4
28.1
15.0
27.6
15.9
21.6
2.8
14.9
26.6
14.1
21.6
14.4
21.7
4.1
13.7
37.5
27.8
20.5
24.0
26.2
20.6
3.4
14.1
12.7
21.1
V
S
= 8 V
Test Conditions:
V
S
= 8 V
Test Conditions:
R
BIAS
= 75 Ohms
R
BIAS
= 39 Ohms
= 60 mA Typ.
II
D
= 80 mA Typ.
D
T = 25ºC
T
LL
= 25ºC
OIP Tone Spacing = 1 MHz, Pout per tone = 0 dBm
OIP
33
Tone Spacing = 1 MHz, Pout per tone = 0 dBm
Z
S
= Z = 50 Ohms
Z
S
= Z
LL
= 50 Ohms
Noise Figure vs. Frequency
V
D
=3.6 V, I
D
= 60 mA (Typ.)
7
6
Noise Figure (dB)
5
4
3
2
0
0.5
1
1.5
2
Frequency (GHz)
2.5
3
Absolute Maximum Ratings
Parameter
Max.
Device Current
(I
D
)
Max.
Device
Voltage (V
D
)
Max.
RF Input Pow er
Max.
Junction Temp
. (T
J
)
Operating Temp
. Range (T
L
)
Absolute Limit
1
20
mA
5V
+16 dBm
+150°C
-40°C to +85°C
+150°C
Max.
Storage Temp
.
T
L
=+25ºC
Operation of this device beyond any one of these limits may
cause permanent damage. For reliable continous operation,
the device voltage and current must not exceed the maximum
operating values specified in the table on page one.
Bias Conditions should also satisfy the follow ing expression:
I
D
V
D
< (T
J
- T
L
) / R
TH
, j-l
40
35
OIP
3
(dBm)
V
D
= 3.6 V, I
D
= 60 mA (Typ.)
OIP
3
vs. Frequency
20
18
P
1dB
(dBm)
16
14
12
V
D
= 3.6 V, I
D
= 60 mA (Typ.)
P
1dB
vs. Frequency
30
25
T
L
=+25ºC
20
0
0.5
1
1.5
2
Frequency (GHz)
2.5
3
T
L
=+25ºC
10
0
0.5
1
1.5
2
Frequency (GHz)
2.5
3
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
2
http://www.sirenza.com
EDS-100616 Rev. C
Preliminary
SGA-5389 DC-4500 MHz Cascadable MMIC Amplifier
|
S
21
|
vs. Frequency
20
15
S
21
(dB)
S
11
(dB)
|
S
11
|
vs. Frequency
0
V
D
= 3.6 V, I
D
= 60 mA (Typ.)
V
D
= 3.6 V, I
D
= 60 mA (Typ.)
-10
-20
10
5
T
L
0
0
1
2
3
4
Frequency (GHz)
5
+25°C
-40°C
+85°C
-30
T
L
-40
+25°C
-40°C
+85°C
6
0
1
2
3
4
Frequency (GHz)
5
6
|
S
12
|
vs. Frequency
-12
-15
|
S
22
|
vs. Frequency
0
-10
S
22
(dB)
-20
-30
V
D
= 3.6 V, I
D
= 60 mA (Typ.)
V
D
= 3.6 V, I
D
= 60 mA (Typ.)
S
12
(dB)
-18
-21
T
L
-24
0
1
2
3
4
Frequency (GHz)
5
+25°C
-40°C
+85°C
T
L
-40
6
+25°C
-40°C
+85°C
0
1
2
3
4
Frequency (GHz)
5
6
NOTE: Full S-parameter data available at
www.sirenza.com
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
3
http://www.sirenza.com
EDS-100616 Rev. C
Preliminary
SGA-5389 DC-4500 MHz Cascadable MMIC Amplifier
Basic Application Circuit
R
BIAS
1 uF
1000
pF
Application Circuit Element Values
Reference
Designator
Frequency (Mhz)
500
850
1950
2400
3500
V
S
C
D
L
C
C
B
C
D
L
C
220 pF
100 pF
68 nH
100 pF
68 pF
33 nH
68 pF
22 pF
22 nH
56 pF
22 pF
18 nH
39 pF
15 pF
15 nH
RF in
C
B
1
SGA-5389
3
2
C
B
4
RF out
R ecommended B ias R esistor Values for I
D
=60mA
R
BIAS
=( V
S
-V
D
) / I
D
Supply Voltage(V
S
)
R
BIAS
6V
43
8V
75
10 V
110
12 V
150
V
S
R
BIAS
Note: R
BIAS
provi des D C bi as stabi li ty over temperature.
1 uF
1000 pF
Mounting Instructions
1. Solder the copper pad on the backside of the
device package to the ground plane.
2. Use a large ground pad area with many plated
through-holes as shown.
3. We recommend 1 or 2 ounce copper. Measurement
for this data sheet were made on a 31 mil thick FR-4
board with 1 ounce copper on both sides.
A53
L
C
C
D
C
B
C
B
Part Identification Marking
The part will be marked with an A53 designator on
40 Pin FPC connector, pin spacing is 0.5mm, line spacing is 0.5mm, I need it urgently and don't have time to learn how to draw the package, thank you all for your help!...
In February, I saw a post on the Internet titled "Poor Man's MAX7219 7279". I thought it was good, so I contacted the author and asked if I could share it on our forum.
This was the author's reply in ...
I am so distressed, please help me, woooo! I recently developed a product that uses relays as on/off devices, but I don't know how to deal with the spark interference caused by turning on the relay! I...
Let's first use the following figure to understand the classification of components :Definition of storage period of components:
Storage period ts : The time components are stored under certain enviro...
It seems that more and more people in the forum are interested in this. My first card reader was developed using CM200. There is nothing special about the hardware development. CM200 has an internal a...
1. Use the hardware timer to write a program, set the hour, minute and second timers, the corresponding addresses are: 4000H, 4002H, 4004H, the crystal frequency is 12MHZ (written with 8096) 2.C08__2 ...
1. Several nouns
ABI:
The specifications that an executable file must follow in order to run in a specific execution environment;
Separately generated relocatabl...[Details]
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
...[Details]
Whether it is an electric car or an ordinary fuel car, for the vast majority of car buyers, the final cost of use is what they care about most. For fuel cars, how to save fuel is what drivers care ...[Details]
Is pure electric vehicles a false proposition for long-distance driving? At least from my personal perspective, based on current technological and infrastructure standards, I believe so. Below, I'l...[Details]
Topics: Bring Your Own Device (BYOD) trends; the impact of using employees' own mobile devices to control access to work facilities and equipment on information security; and ways to securely imple...[Details]
On August 22, Lantu Motors officially launched its Lanhai Intelligent Hybrid technology via an online livestream. This intelligent hybrid technology, which integrates a full-range 800V high-voltage...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Office (USPTO) for a patent for a door anti-collision system that may be used in future Ford vehicl...[Details]
To improve the lateral active safety of intelligent connected vehicles, the identification and definition of unexpected functional safety scenarios for the EPS (Electronic Steering System) ...[Details]
There are many motors that can use thyristor speed control, and they can be used in almost all industries. Various types of motors, such as fans, pumps, AC motors, DC motors, torque motors, single-...[Details]
Tires are a very important component for cars. They are related to the driving experience of the vehicle. We are almost inseparable from cars in our daily lives. For tires, according to the role of...[Details]
According to Reuters, citing people familiar with the matter, British semiconductor design company Arm Holdings (NASDAQ:ARM) has hired Rami Sinno, head of Amazon's (NASDAQ:AMZN) artificial intellig...[Details]
Today,
the Intel®
Universal
Quick Connector (UQD) Interchangeability Alliance was officially established
. At the inaugural ceremony, Intel and its first certified partners—Invicta...[Details]
The automotive transmission is the foundation of a vehicle's motion. The vehicle's drivetrain transfers engine power to the drive wheels, enabling the vehicle to move. The vehicle's drivetrain cons...[Details]
In industrial production, many different controllers are often used, such as those for pressure, flow, electrical parameters, temperature, and sound. However, due to the limitations of the on-site ...[Details]
PCB Design
京公网安备 11010802033920号
EEWORLD
