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KMM536256WG-10

Description
Fast Page DRAM Module, 256KX36, 100ns, CMOS, SIMM-72
Categorystorage    storage   
File Size286KB,11 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

KMM536256WG-10 Overview

Fast Page DRAM Module, 256KX36, 100ns, CMOS, SIMM-72

KMM536256WG-10 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeSIMM
package instruction,
Contacts72
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE
Maximum access time100 ns
Other featuresRAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 codeR-XSMA-N72
memory density9437184 bit
Memory IC TypeFAST PAGE DRAM MODULE
memory width36
Number of functions1
Number of ports1
Number of terminals72
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX36
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
refresh cycle512
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal locationSINGLE

KMM536256WG-10 Related Products

KMM536256WG-10 KMM536256W-10
Description Fast Page DRAM Module, 256KX36, 100ns, CMOS, SIMM-72 Fast Page DRAM Module, 256KX36, 100ns, CMOS, SIMM-72
Maker SAMSUNG SAMSUNG
Parts packaging code SIMM SIMM
Contacts 72 72
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
access mode FAST PAGE FAST PAGE
Maximum access time 100 ns 100 ns
Other features RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
JESD-30 code R-XSMA-N72 R-XSMA-N72
memory density 9437184 bit 9437184 bit
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 36 36
Number of functions 1 1
Number of ports 1 1
Number of terminals 72 72
word count 262144 words 262144 words
character code 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 256KX36 256KX36
Package body material UNSPECIFIED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Certification status Not Qualified Not Qualified
refresh cycle 512 512
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD
Terminal location SINGLE SINGLE
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