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S29GL032N90TFI30

Description
Flash, 2MX16, 90ns, PDSO48, LEAD FREE, MO-142EC, TSOP-48
Categorystorage    storage   
File Size3MB,81 Pages
ManufacturerCypress Semiconductor
Environmental Compliance
Download Datasheet Parametric View All

S29GL032N90TFI30 Overview

Flash, 2MX16, 90ns, PDSO48, LEAD FREE, MO-142EC, TSOP-48

S29GL032N90TFI30 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerCypress Semiconductor
package instructionTSSOP,
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time90 ns
Spare memory width8
JESD-30 codeR-PDSO-G48
JESD-609 codee3
length18.4 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Programming voltage3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width12 mm
S29GL-N MirrorBit
®
Flash Family
S29GL064N, S29GL032N
64 Megabit, 32 Megabit
3.0-Volt only Page Mode Flash Memory
Featuring 110 nm MirrorBit Process Technology
S29GL-N MirrorBit
®
Flash Family Cover Sheet
Data Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S29GL-N_01
Revision
12
Issue Date
October 29, 2008
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