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1N5804USE3

Description
Rectifier Diode, Avalanche, 1 Element, 1A, 100V V(RRM), Silicon, ROHS COMPLIANT, HERMETIC SEALED, GLASS, A, MELF-2
CategoryDiscrete semiconductor    diode   
File Size630KB,5 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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1N5804USE3 Overview

Rectifier Diode, Avalanche, 1 Element, 1A, 100V V(RRM), Silicon, ROHS COMPLIANT, HERMETIC SEALED, GLASS, A, MELF-2

1N5804USE3 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
package instructionROHS COMPLIANT, HERMETIC SEALED, GLASS, A, MELF-2
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresHIGH RELIABILITY
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)0.875 V
JESD-30 codeO-LELF-R2
JESD-609 codee3
Maximum non-repetitive peak forward current35 A
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Maximum output current1 A
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)260
Maximum repetitive peak reverse voltage100 V
Maximum reverse recovery time0.025 µs
surface mountYES
technologyAVALANCHE
Terminal surfaceMATTE TIN OVER NICKEL
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperature30
1N5802US, 1N5804US, 1N5806US and URS
VOIDLESS HERMETICALLY SEALED ULTRAFAST
RECOVERY GLASS RECTIFIERS
Qualified per MIL-PRF-19500/477
Qualified Levels:
JAN, JANTX,
JANTXV and JANS
Available on
commercial
versions
DESCRIPTION
This “Ultrafast Recovery” rectifier diode series is military qualified and is ideal for high-reliability
applications where a failure cannot be tolerated. The industry-recognized 2.5 amp rated rectifiers
with working peak reverse voltages from 50 to 150 volts are hermetically sealed with voidless glass
construction using an internal
“Category 1”
metallurgical bond. These devices are available in both
surface mount MELF and leaded package configurations. Microsemi also offers numerous other
rectifier products to meet higher and lower current ratings with various recovery time requirements
including standard, fast and ultrafast device types in both through-hole and surface mount
packages.
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
JEDEC registered surface mount equivalent of1N5802, 1N5804, 1N5806 series.
Voidless hermetically sealed glass package.
Quadruple-layer passivation
Extremely robust construction.
Internal
“Category 1”
metallurgical bonds.
JAN, JANTX, JANTXV and JANS qualifications are available per MIL-PRF-19500/477.
RoHS compliant versions available (commercial grade only).
“A” or D-5A
Package (US)
APPLICATIONS / BENEFITS
Ultrafast recovery 2.5 amp rectifier series from 50 to 150 V.
Military, space and other high-reliability applications.
Switching power supplies or other applications requiring extremely fast switching & low forward
loss.
High forward surge current capability.
Low thermal resistance.
Controlled avalanche with peak reverse power capability.
Inherently radiation hard as described in Microsemi
MicroNote 050.
“A” Package
(URS)
Also available in:
“A” Package
(axial-leaded)
1N5802, 04 and 06
MAXIMUM RATINGS
@ T
A
= 25
o
C unless otherwise specified
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-End Cap
(see
Figure 1)
Working Peak Reverse Voltage:
1N5802US & URS
1N5804US & URS
1N5806US & URS
(3)
Forward Surge Current
Average Rectified Output Current
o
(1)
@ T
EC
= +75 C
Average Rectified Output-Current
o
(2)
@ T
A
= +55 C
Capacitance
@ V
R
= 10 V, f = 1 MHz; Vsig = 50 mV (p-p)
(4)
Reverse Recovery Time
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJEC
V
RWM
Value
-65 to +175
13
50
100
150
35
2.5
1.0
25
25
260
Unit
o
C
C/W
V
o
I
FSM
I
O1
I
O2
C
t
rr
T
SP
A
A
A
pF
ns
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. I
O1
is rated at 2.5 A @ T
EC
= 75
o
C. Derate at 50 mA/
o
C for T
EC
above 125
o
C.
2. I
O2
is rated at 1.0 A @ T
A
= 55
o
C for PC boards where thermal resistance from mounting point to ambient
is sufficiently controlled (R
ӨJX
< 154
o
C/W) where T
J(max)
175
o
C is not exceeded. Derate at 8.33 mA/
o
C
for T
A
above 55
o
C.
3. T
A
= 25
o
C @ I
O
= 1.0 A and V
RWM
for ten 8.3 ms surges at 1 minute intervals.
4. I
F
= 0.5 A, I
RM
= 0.5 A, I
R(REC)
= .05 A.
T4-LDS-0211-1, Rev. 1 (111900)
©2011 Microsemi Corporation
Page 1 of 5

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Description Rectifier Diode, Avalanche, 1 Element, 1A, 100V V(RRM), Silicon, ROHS COMPLIANT, HERMETIC SEALED, GLASS, A, MELF-2 Rectifier Diode, 1 Element, 1A, 100V V(RRM), Silicon, HERMETIC SEALED, GLASS, MELF-2 Ceramic Capacitor, Multilayer, Ceramic, 1000V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.00091uF, 1812, Rectifier Diode, 1 Element, 1A, 50V V(RRM), Silicon, HERMETIC SEALED, GLASS, MELF-2 Rectifier Diode, 1 Element, 1A, 150V V(RRM), Silicon, HERMETIC SEALED, GLASS, MELF-2 Rectifier Diode, Avalanche, 1 Element, 1A, 150V V(RRM), Silicon, ROHS COMPLIANT, HERMETIC SEALED, GLASS, A, MELF-2 Rectifier Diode, Avalanche, 1 Element, 1A, 50V V(RRM), Silicon, ROHS COMPLIANT, HERMETIC SEALED, GLASS, A, MELF-2 Rectifier Diode, Avalanche, 1 Element, 1A, 100V V(RRM), Silicon, ROHS COMPLIANT, HERMETIC SEALED, GLASS, A, MELF-2
Is it Rohs certified? conform to incompatible conform to incompatible incompatible conform to conform to conform to
package instruction ROHS COMPLIANT, HERMETIC SEALED, GLASS, A, MELF-2 O-LELF-R2 , 1812 O-LELF-R2 HERMETIC SEALED, GLASS, MELF-2 ROHS COMPLIANT, HERMETIC SEALED, GLASS, A, MELF-2 O-LELF-R2 ROHS COMPLIANT, HERMETIC SEALED, GLASS, A, MELF-2
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Number of terminals 2 2 2 2 2 2 2 2
Maximum operating temperature 175 °C 175 °C 125 °C 175 °C 175 °C 175 °C 175 °C 175 °C
Minimum operating temperature -65 °C -65 °C -55 °C -65 °C -65 °C -65 °C -65 °C -65 °C
Package form LONG FORM LONG FORM SMT LONG FORM LONG FORM LONG FORM LONG FORM LONG FORM
Maker Microsemi Microsemi - Microsemi Microsemi Microsemi Microsemi Microsemi
Other features HIGH RELIABILITY HIGH RELIABILITY - HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY
Shell connection ISOLATED ISOLATED - ISOLATED ISOLATED ISOLATED ISOLATED ISOLATED
Configuration SINGLE SINGLE - SINGLE SINGLE SINGLE SINGLE SINGLE
Diode component materials SILICON SILICON - SILICON SILICON SILICON SILICON SILICON
Diode type RECTIFIER DIODE RECTIFIER DIODE - RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE RECTIFIER DIODE
JESD-30 code O-LELF-R2 O-LELF-R2 - O-LELF-R2 O-LELF-R2 O-LELF-R2 O-LELF-R2 O-LELF-R2
JESD-609 code e3 e0 e3 e0 e0 - - -
Number of components 1 1 - 1 1 1 1 1
Maximum output current 1 A 1 A - 1 A 1 A 1 A 1 A 1 A
Package body material GLASS GLASS - GLASS GLASS GLASS GLASS GLASS
Package shape ROUND ROUND - ROUND ROUND ROUND ROUND ROUND
Maximum repetitive peak reverse voltage 100 V 100 V - 50 V 150 V 150 V 50 V 100 V
Maximum reverse recovery time 0.025 µs 0.025 µs - 0.025 µs 0.025 µs 0.025 µs 0.025 µs 0.025 µs
surface mount YES YES - YES YES YES YES YES
Terminal surface MATTE TIN OVER NICKEL Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier - - -
Terminal form WRAP AROUND WRAP AROUND - WRAP AROUND WRAP AROUND WRAP AROUND WRAP AROUND WRAP AROUND
Terminal location END END - END END END END END
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