Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | IBM |
| Parts packaging code | BGA |
| package instruction | TBGA, BGA62,12X9,40/32 |
| Contacts | 62 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | BLOCK ORIENTED PROTOCOL |
| Maximum clock frequency (fCLK) | 300 MHz |
| I/O type | COMMON |
| JESD-30 code | R-PBGA-B62 |
| JESD-609 code | e0 |
| length | 11.79 mm |
| memory density | 134217728 bit |
| Memory IC Type | RAMBUS DRAM |
| memory width | 16 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 62 |
| word count | 8388608 words |
| character code | 8000000 |
| Operating mode | SYNCHRONOUS |
| organize | 8MX16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TBGA |
| Encapsulate equivalent code | BGA62,12X9,40/32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE |
| power supply | 1.8/2.5,2.5 V |
| Certification status | Not Qualified |
| refresh cycle | 16384 |
| Maximum seat height | 1.185 mm |
| Maximum supply voltage (Vsup) | 2.63 V |
| Minimum supply voltage (Vsup) | 2.37 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| width | 8.95 mm |





| IBM0712161KU1A-33F | IBM0712161KU1A-25F | IBM0712161KU1A-25D | IBM0712161KU1A-33J | IBM0712161KU1A-25B | |
|---|---|---|---|---|---|
| Description | Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62 | Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62 | Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62 | Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62 | Rambus DRAM, 8MX16, CMOS, PBGA62, 1 MM PITCH, MICRO, BGA-62 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | IBM | IBM | IBM | IBM | IBM |
| Parts packaging code | BGA | BGA | BGA | BGA | BGA |
| package instruction | TBGA, BGA62,12X9,40/32 | TBGA, BGA62,12X9,40/32 | TBGA, BGA62,12X9,40/32 | TBGA, BGA62,12X9,40/32 | TBGA, BGA62,12X9,40/32 |
| Contacts | 62 | 62 | 62 | 62 | 62 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL |
| Maximum clock frequency (fCLK) | 300 MHz | 400 MHz | 400 MHz | 300 MHz | 400 MHz |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 | R-PBGA-B62 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| length | 11.79 mm | 11.79 mm | 11.79 mm | 11.79 mm | 11.79 mm |
| memory density | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bi |
| Memory IC Type | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM |
| memory width | 16 | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 62 | 62 | 62 | 62 | 62 |
| word count | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
| character code | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| organize | 8MX16 | 8MX16 | 8MX16 | 8MX16 | 8MX16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TBGA | TBGA | TBGA | TBGA | TBGA |
| Encapsulate equivalent code | BGA62,12X9,40/32 | BGA62,12X9,40/32 | BGA62,12X9,40/32 | BGA62,12X9,40/32 | BGA62,12X9,40/32 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE |
| power supply | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V | 1.8/2.5,2.5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 16384 | 16384 | 16384 | 16384 | 16384 |
| Maximum seat height | 1.185 mm | 1.185 mm | 1.185 mm | 1.185 mm | 1.185 mm |
| Maximum supply voltage (Vsup) | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V |
| Minimum supply voltage (Vsup) | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V |
| Nominal supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | BALL | BALL | BALL | BALL | BALL |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| width | 8.95 mm | 8.95 mm | 8.95 mm | 8.95 mm | 8.95 mm |