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K8F5715EBM-SE1C0

Description
Flash, 16MX16, 100ns, PBGA44, 8 X 9 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44
Categorystorage    storage   
File Size1MB,59 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance
Download Datasheet Parametric View All

K8F5715EBM-SE1C0 Overview

Flash, 16MX16, 100ns, PBGA44, 8 X 9 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44

K8F5715EBM-SE1C0 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSAMSUNG
Parts packaging codeBGA
package instruction8 X 9 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44
Contacts44
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time100 ns
Other featuresSYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B44
JESD-609 codee1
length9 mm
memory density268435456 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level2
Number of functions1
Number of departments/size4,255
Number of terminals44
word count16777216 words
character code16000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize16MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA44,8X14,20
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply1.8 V
Programming voltage1.8 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1 mm
Department size16K,64K
Maximum standby current0.00002 A
Maximum slew rate0.055 mA
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
switch bitYES
typeNOR TYPE
width8 mm
K8F56(57)15ET(B)M
NOR FLASH MEMORY
256Mb M-die MLC NOR Specification
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure couldresult in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
1
Revision 1.2
September, 2006

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