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MT45W2ML16BABB-701LIT

Description
Pseudo Static RAM, 2MX16, 70ns, CMOS, PBGA54, LEAD FREE, FBGA-54
Categorystorage    storage   
File Size816KB,55 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance  
Download Datasheet Parametric View All

MT45W2ML16BABB-701LIT Overview

Pseudo Static RAM, 2MX16, 70ns, CMOS, PBGA54, LEAD FREE, FBGA-54

MT45W2ML16BABB-701LIT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicron Technology
Parts packaging codeBGA
package instructionVFBGA,
Contacts54
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time70 ns
JESD-30 codeR-PBGA-B54
JESD-609 codee1
length8 mm
memory density33554432 bit
Memory IC TypePSEUDO STATIC RAM
memory width16
Number of functions1
Number of terminals54
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width6 mm
ADVANCE
2 MEG x 16
ASYNC/PAGE/BURST CellularRAM MEMORY
BURST
CellularRAM
TM
Features
Single device supports asynchronous, page, and burst
operations
V
CC
, V
CC
Q Voltages
1.70V–1.95V V
CC
1.70V–2.25V V
CC
Q (Option W)
2.30V–2.70V V
CC
Q (Option V—contact factory)
2.70V–3.30V V
CC
Q (Option L—contact factory)
Random Access Time: 70ns
Burst Mode Write Access
Continuous burst
Burst Mode Read Access
4, 8, or 16 words, or continuous burst
MAX clock rate: 104 MHz (
t
CLK = 9.62ns)
Burst initial latency: 39ns (4 clocks) @ 104 MHz
t
ACLK: 6.5ns @ 104 MHz
MT45W2MW16BAFB
Figure 1: Ball Assignment 54-Ball FBGA
1
A
B
C
D
E
F
G
H
J
LB#
2
OE#
3
A0
4
A1
5
A2
6
CRE
DQ8
UB#
A3
A4
CE#
DQ0
DQ9
DQ10
A5
A6
DQ1
DQ2
V
SS
Q
DQ11
A17
A7
DQ3
V
CC
V
CC
Q
DQ12
NC
A16
DQ4
V
SS
Page Mode Read Access
Sixteen-word page size
Interpage read access: 70ns
Intrapage read access: 20ns
Low Power Consumption
Asynchronous READ < 25mA
Intrapage READ < 15mA
Initial access, burst READ:
(39ns [4 clocks] @ 104 MHz) < 35mA
Continuous burst READ < 15mA
Standby: 90µA Low-power; 110µA Standard
Deep power-down < 10µA
Low-Power Features
Temperature Compensated Refresh (TCR)
On-Chip Sensor Control
Partial Array Refresh (PAR)
Deep Power-Down (DPD) Mode
DQ14
DQ13
A14
A15
DQ5
DQ6
DQ15
A19
A12
A13
WE#
DQ7
A18
A8
A9
A10
A11
A20
WAIT
CLK
ADV#
NC
NC
NC
Top View
(Ball Down)
See Table 1 on page 6 for ball descriptions, and Figure 44 on
page 52 for 54-ball mechanical drawing.
Options
(continued)
Designator
6
1
1
None
L
WT
IT
1
Options
Configuration:
2 Meg x 16
V
CC
Core Voltage Supply:
1.80V – MT45WxMx16BA
V
CC
Q I/O Voltage
3.0V – MT45WxML16BA
2.5V – MT45WxMV16BA
1.8V – MT45WxMW16BA
Package
54-ball FBGA
54-ball FBGA—Lead-free
Timing
60ns access
70ns access
85ns access
Designator
MT45W2Mx16BA
Frequency
66 MHz
104 MHz
Standby Power
Standard
Low-power
Operating Temperature Range
Wireless (-25°C to +85°C)
Industrial (-40°C to +85°C)
W
L
1
V
1
W
FB
BB
1
-60
1
-70
-85
NOTE:
1. Contact factory.
Part Number Example:
MT45W2MW16BAFB-706LWT
1
09005aef80ec6f63
Burst CellularRAM_32.fm - Rev. A 2/18/04 EN
©2004 Micron Technology, Inc. All Rights Reserved.
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE BY
MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.
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