[color=#555555]For C5000, the on-chip BOOT program moves the contents of the data area to the RAM in the program area after power-on, so the FLASH must be placed in the data area after RESET. Since th...
I am very happy to participate in the 2022 Digi-Key Innovation Design Competition.
I was originally unsuccessful, but because some friends gave up this competition, I was successfully resurrected. Thi...
More and more consumer applications are integrating streaming video into their designs, resulting in the introduction of many standard and proprietary encryption algorithms. However, the lack of unifo...
I have tried to use X9315 to design an amplifier circuit with adjustable gain, using the classic circuit connection method in the manual. After debugging, I found that I had been ignoring a factor: th...
I'm installing Tornado 2.2/VxWorks 5.5 for ARM (DISK_ID: TDK-14624-ZC-00). The first install went smoothly, but the second install stopped at if_elf.c at 25%. I tried two machines and it was the same....
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
Limited vocabulary recognition
According to the number of characters, words or short sentences in the vocabulary, it can be roughly divided into: less than 100 is small vocabulary; 100-1000 is...[Details]
Recently,
Xpeng Motors and Xinlian Integrated Circuit jointly announced the mass production of China's first hybrid silicon carbide product.
Designed and developed by Xpeng Motors and joint...[Details]
1 Introduction
In the mid-1960s, American scientist Maas conducted extensive experimental research on the charging process of open-cell batteries and proposed an acceptable charging curve for ...[Details]
On August 22nd, Lantu Motors unveiled a new technology called "Lanhai Intelligent Hybrid" during a live broadcast of CCTV News' "Top Laboratory." The name sounds like another new term, but a closer...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Laird Thermal Systems has introduced the HiTemp ET series Peltier cooler modules, which can operate at high temperatures and provide on-site cooling for sensitive electronic devices.
Dig...[Details]
There are basically three causes of spontaneous combustion of electric vehicles: The first is that the battery components are punctured or suffer fatal damage due to a collision accident, and part ...[Details]
SMT placement machines are important equipment in surface mount technology (Surface Mount Technology). Their performance has a decisive impact on the quality and efficiency of electronic manufactur...[Details]
The 2025 China International Automotive Testing Exhibition will be held at the Shanghai World Expo Exhibition and Convention Center from August 27 to 29, 2025.
Clacton Seafront, UK, ...[Details]
Compared to cloud databases, minicomputers are purpose-built for decentralized, rugged computing at the edge of the network. By moving applications, analytics, and processing services closer to the...[Details]
Reflow soldering, as an electronics assembly process, has become a vital component of the electronics manufacturing industry. Choosing reflow soldering equipment is crucial for improving production...[Details]
Shenzhen Baowei Power Supply high frequency pure sine wave power, communication inverter power supply has two communication interfaces, RS232 and R485 interfaces, their functions and characteristic...[Details]
As the range of electric vehicles continues to increase, driving electric vehicles for long-distance travel has become a trend. For high-speed travel, how much impact will high-speed driving of ele...[Details]
Speaking of the problem of vehicle spontaneous combustion, whether it is a pure electric vehicle or a fuel vehicle, there will be incidents of spontaneous combustion. For the same spontaneous combu...[Details]