SMT Devices
Series IC51 (Clamshell)
QFP, PQFP, TQFP and MQUAD
®
Specifications
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Series Overview
*QFP (Quad Flat Packages, Gullwing Leads)
*QFP variations e.g. BQFP...
0.4mm to 1.27 Pitch
Part Number (Details)
Mating Cycles:
1,000MΩ min. at 100V DC
for 1 minute (socket depended)
30mΩ max. at 10mA/20mV max.
–40°C to +150°C (for type PEI/PSF)
–55°C to +170°C (for type PES)
–55°C to +170°C (for type PEI)
10,000 insertions min.
IC51
Series No.
-
064
4
-
807
No. of Contact Pins
Number of Sides
with Contacts
Design Number
As specifications for this product differ by pitch
and material-mix, please contact our Sales Department
for detailed information.
Materials and Finish
Housing: Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass-filled
Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Series IC357 and IC402 (Open Top)
Quad Flat Package (QFP) with 2-Point Contact Type
Specifications
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
Contact Force:
1,000MΩ min. at 500V DC, pitch 0.4 to 0.8
100V AC for 1 minute, pitch 0.5 to 0.8
30mΩ max. at 10mA/20mV max.
–40°C to +150°C
10,000 insertions min.
20g to 45g per pin
0.4 to 0.8mm Pitch
Part Number (Details)
IC357
Series No.
-
100 4
-
002
*
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin
N = Without Positioning Pin
P = With Positioning Pin
Materials and Finish
Housing:
Polyetherimide (PEI), glass-filled
Polyethersulphone (PES) glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:
Gold over Nickel
Series IC234 (Open Top)
Quad Flat Package (QFP) with Shoulder Contact Type
Specifications
1,000MΩ min. at 100V DC pitch 0.4, 0.5
1,000MΩ min. at 500V DC pitch 0.65, 0.8
Dielectric Withstanding Voltage: 100V AC for 1 minute pitch 0.4, 0.5
500V AC for 1 minute pitch 0.65
700V AC for 1 minute pitch 0.8
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C
Contact Force:
20g to 80g per pin
Mating Cycles:
10,000 insertions min.
Insulation Resistance:
0.4 to 0.8mm Pitch
Part Number (Details)
IC234
Series No.
-
120 4
-
017
*
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin
N = Without Positioning Pin
P = With Positioning Pin
K = Protection Key
**
** Protection Key: Prevents IC from releasing during transportation
Materials and Finish
Polyetherimide (PEI), glass-filled
Polyethersulphone (PES) glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:
Gold over Nickel
Housing:
46
Test Solutions
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
Series Overview
*QFP (Quad Flat Packages, Gullwing Leads)
Series IC200 / IC201 / IC216 / IC217 / IC218 / IC248 (Open Top)
Quad Flat Packages (QFP)
Specifications
1,000MΩ min. at 500V DC or
1,000MΩ min. at 100V DC
Dielectric Withstanding Voltage: 100/500/700V AC for 1 minute
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +170°C and –40°C to +150°C
Contact Force:
20g to 80g per pin
Mating Cycles:
10,000 insertions min.
The information above is typical for this Series
for individual specifications please contact Yamaichi
SMT Devices
0.4 to 0.8mm Pitch
Part Number (Details)
Insulation Resistance:
IC200
Series No.
-
128
4
-
001 *
-
*
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
P = With Positioning Pin
Protection Key**
K = With Protection Key
Unmarked = Without Protection Key
**Protection Key: Prevents IC from releasing during transportation
Materials and Finish
Polyetherimide (PEI), glass-filled
Polyphenylenesulfide (PPS), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:
Gold over Nickel
Housing:
Series IC500 (Open Top)
Quad Flat Package (QFP) with 2-Point Contact Type
Specifications
1,000MΩ min. at 100V DC pitch 0.5
1,000MΩ min. at 500V DC pitch 0.65, 0.8
Dielectric Withstanding Voltage: 100V AC for 1 minute pitch 0.5
500V AC for 1 minute pitch 0.65
700V AC for 1 minute pitch 0.8
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C
Contact Force:
20g to 80g per pin
Mating Cycles:
10,000 insertions min.
Insulation Resistance:
0.5 to 0.8mm Pitch
Part Number (Details)
IC500
Series No.
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin
N = Without Positioning Pin
P = With Positioning Pin
K = Protection Key
-
064 4
-
008
*
Materials and Finish
Housing:
Polyetherimide (PEI), glass-filled
Polyethersulphone (PES) glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:
Gold over Nickel
Contact Styles
Series IC51
Series IC357
Series IC234
Series IC (kelvin)
Series IC2**
Series IC500
Test Solutions
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
Gullwing-Leads - QFP
47
NXP MCU
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