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IC234-1444-007

Description
QFP160, IC SOCKET
CategoryThe connector   
File Size148KB,8 Pages
ManufacturerETC2
Download Datasheet Parametric View All

IC234-1444-007 Overview

QFP160, IC SOCKET

IC234-1444-007 Parametric

Parameter NameAttribute value
Number of contacts160
Type of equipment usedQFP160
stateCONSULT MFR
shell materialPSF
Device slot typeintegrated circuit socket
Manufacturer SeriesIC51
SMT Devices
Series IC51 (Clamshell)
QFP, PQFP, TQFP and MQUAD
®
Specifications
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Series Overview
*QFP (Quad Flat Packages, Gullwing Leads)
*QFP variations e.g. BQFP...
0.4mm to 1.27 Pitch
Part Number (Details)
Mating Cycles:
1,000MΩ min. at 100V DC
for 1 minute (socket depended)
30mΩ max. at 10mA/20mV max.
–40°C to +150°C (for type PEI/PSF)
–55°C to +170°C (for type PES)
–55°C to +170°C (for type PEI)
10,000 insertions min.
IC51
Series No.
-
064
4
-
807
No. of Contact Pins
Number of Sides
with Contacts
Design Number
As specifications for this product differ by pitch
and material-mix, please contact our Sales Department
for detailed information.
Materials and Finish
Housing: Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass-filled
Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Series IC357 and IC402 (Open Top)
Quad Flat Package (QFP) with 2-Point Contact Type
Specifications
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
Contact Force:
1,000MΩ min. at 500V DC, pitch 0.4 to 0.8
100V AC for 1 minute, pitch 0.5 to 0.8
30mΩ max. at 10mA/20mV max.
–40°C to +150°C
10,000 insertions min.
20g to 45g per pin
0.4 to 0.8mm Pitch
Part Number (Details)
IC357
Series No.
-
100 4
-
002
*
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin
N = Without Positioning Pin
P = With Positioning Pin
Materials and Finish
Housing:
Polyetherimide (PEI), glass-filled
Polyethersulphone (PES) glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:
Gold over Nickel
Series IC234 (Open Top)
Quad Flat Package (QFP) with Shoulder Contact Type
Specifications
1,000MΩ min. at 100V DC pitch 0.4, 0.5
1,000MΩ min. at 500V DC pitch 0.65, 0.8
Dielectric Withstanding Voltage: 100V AC for 1 minute pitch 0.4, 0.5
500V AC for 1 minute pitch 0.65
700V AC for 1 minute pitch 0.8
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C
Contact Force:
20g to 80g per pin
Mating Cycles:
10,000 insertions min.
Insulation Resistance:
0.4 to 0.8mm Pitch
Part Number (Details)
IC234
Series No.
-
120 4
-
017
*
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin
N = Without Positioning Pin
P = With Positioning Pin
K = Protection Key
**
** Protection Key: Prevents IC from releasing during transportation
Materials and Finish
Polyetherimide (PEI), glass-filled
Polyethersulphone (PES) glass-filled
Contacts: Beryllium Copper (BeCu)
Plating:
Gold over Nickel
Housing:
46
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