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71WS512NC0BAWAM3

Description
Memory Circuit, 64MX8, CMOS, PBGA84, 11.6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84
Categorystorage    storage   
File Size332KB,13 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

71WS512NC0BAWAM3 Overview

Memory Circuit, 64MX8, CMOS, PBGA84, 11.6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84

71WS512NC0BAWAM3 Parametric

Parameter NameAttribute value
MakerSPANSION
Parts packaging codeBGA
package instructionTFBGA,
Contacts84
Reach Compliance Codeunknown
JESD-30 codeR-PBGA-B84
length11.6 mm
memory density536870912 bit
Memory IC TypeMEMORY CIRCUIT
memory width8
Number of functions1
Number of terminals84
word count67108864 words
character code64000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize64MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width8 mm
S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
Data Sheet
S71WS-N Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71WS-N_00
Revision
A
Amendment
7
Issue Date
April 4, 2008
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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