TABLE OF CONTENTS
Description of Terminology…………………………………………………………………………………2
Structural Drawing …………………………………………………………………………………………2
Reliability Test and Measuring Method …………………………………………………………………2
Handling Precautions ………………………………………………………………………………………3
Super Bright LED Light Bar Module
Description of Part Number …………………………………………………………………………4
Characteristics by Color ………………………………………………………………………………4
LED Light Bar Module Product Line ………………………………………………………………4-7
Super Bright LED Numeric Display (Seven Segment Display)
Description of Part Number ………………………………………………………………………………8
Characteristics by Color …………………………………………………………………………………8
7.5mm Type …………………………………………………………………………………………………9
10.0mm Type ……………………………………………………………………………………………10-12
15.0mm Type ………………………………………………………………………………………………13
25.0mm Type ………………………………………………………………………………………………14
Bi-Color LED Numeric Display…………………………………………………………………………………15
Alpha Numeric LED Display ………………………………………………………………………………16
Index by Part Number …………………………………………………………………………………17-19
1
DESCRIPTION OF TERMINOLOGY
ITEMS
Absolute Max. Ratings
Power dissipation
Forward current
Peak forward current
Current derating
Forward voltage
Reverse current
Luminous intensity
Peak wavelength
Spectral line half width
SYMBOLS
(Pd)
(I
F
)
(I
FM
)
(∆I
F
)
(V
F
)
(I
R
)
(I
V
)
(λp)
(∆λ)
DEFINITION
Power dissipated by forward current and forward voltage
Current from anode to cathode
Forward peak current driven during pulse lighting
Derating over 25°C ambient temperature
Voltage drop when forward current goes from anode to cathode
Leakage current when bias voltage is applied from cathode to anode
Flux in lumens per unit of solid angle on optical axis
Wavelength at which radiant intensity becomes greatest
Wavelength range in which radiant intensity becomes more than 50% of its peak value
UNIT
(mW)
(mA)
(mA)
(mA/°C)
(V)
(µA)
(mcd)
(nm)
(nm)
RELIABILITY TEST AND MEASURING METHOD
■
Items to be Guaranteed for LEDs
TEST ITEM
Operating Endurance Test
STANDARDS
TEST CONDITION
Ta=25°C, I
F
=Maximum Rated Current, t=1000 Hrs.
260+5°C, 10+1sec., 3mm from package base
-30°C (30 min) to normal temperature (15 min) to +100°C (30 min) To normal temperature (15 min) 5 cycles
Ta=60+2°C, RH=90+5%, t=1000Hr
Ta=100+2°C, t=1000Hr
Ta=30+2°C, t=1000Hr
*1kg/10 sec. one time (thin lead: 0.5kg)
10G, 100 to 2000Hz sweep for 20 min., 2 hours for directions X, Y and Z
SAMPLE
SIZE
25
25
25
25
25
25
10
10
■
Measuring Method
Luminous Intensity (Iv)
Detector
7°
100mm
(0.01sr)
Dark room
Electro-optical
characteristics
JIS C 7035
Added documents
JIS C 7021
Resistance to Soldering Heat
A-1
JIS C 7021
Temperature Cycling
A-4
JIS C 7021
Humidity (Steady State)
B-11
JIS C 7021
High Temperature (Storage)
B-10
JIS C 7021
Low Temperature (Storage)
A-12
JIS C 7021
Lead Tension
A-11
JIS C 7021
Vibration Fatigue
A-10
■
Structural Drawing for Numeric Display
Epoxy resin
LED chip
Lamp house
LED
A
Constant Current Power Supply
Lead frame
2
HANDLING PRECAUTIONS
■
Soldering Conditions
Please refer to each product to see if it’s compatible with lead-free soldering.
Conventional Soldering Conditions
SOLDERING IRON
DIP SOLDERING
Pre-heat: 80°C Max. / 60 sec. Max.
(Resin surface temperature)
Bath Temperature: 260°C Max.
Dipping Time: 5 sec. Max.
Position: At least 3.0mm away from resin body
REFLOW SOLDERING
Iron Tip Temperature: 300°C Max. (30W Max.)
Soldering Time: 3 Seconds Max.
Location: At least 3.0mm away from resin
Not recommended
Lead-Free Soldering Conditions
SOLDERING IRON
Iron Tip Temperature: 400°C Max.
Soldering Iron: 30W Max.
Soldering Time: 3 Seconds Max.
Position: At least 2.0mm away from resin
DIP SOLDERING
Pre-heat: 100°C Max. / 60 seconds Max.
(Resin surface temperature)
Bath Temperature: 265°C Max.
Dipping time: 5 sec. Max.
Position: At least 2.0mm away from resin body
REFLOW SOLDERING
Not recommended
■
Cleaning
Residual solder of flux left on the LED housing could reduce intensity
and could affect the optical characteristics. Excess flux can be
removed by the following chemical method:
1. Cleaning solvents (dipping time: 3 minutes maximum at
normal temperature)
• Ethyl alcohol
• Isopropyl alcohol
• Pure water (after cleaning, the water must be removed
by drying)
• Drying condition: 90°C max., 30 sec. max. and 4 times max.
2. The effect of ultrasonic cleaning on the LED resin body depends
on such factors as the oscillator output, size of PCB and LED
mounting method. Ultrasonic cleaning is strongly recommended
after confirming that there are no problems.
1. Ultrasonic wave frequency: 28 kHz or 40 kHz
2. Output: 20 W/I
3. The solvent for freon equivalent (recommended after confirming
that there are no problems).
• AK-225AES
• Clean through
• Pine alpha ST-100S
Chemicals
Ethyl alcohol
Isopropyl alcohol
Pure water
Freon substitute detergent
AK225AES
Clean through 705H
Pine alpha ST-100S
*
DIP Soldering and cleaning is not recommended for Alpha-Numeric (AAR121and AAA121) LED displays.
3
SUPER BRIGHT LED LIGHT BAR MODULE
Stanley’s MU series of super-bright LED light bar modules can be selected from a wide variety of configurations and colors to suit a broad range of
requirements. By using front mask patterns, including letters, numbers and even graphics, this series is usable for a myriad of display applications.
■
Description of Part Number
MU 0 2 - 2 2 0 1
■
Characteristics by Color
Part No.
Material
Emitted Color
Forward
Current
I
F
"
1
2
" " "
3
" " "
4
" " "
5
" "
1
5
" "
2
5
" "
5
9
" "
1
GaAIAs
GaAsP
GaP
GaP
GaP
GaP
GaAIAs
GaP
GaAIAs
9
" "
2
GaP
GaAIAs
9
" "
3
GaAsP
Units
(Red)
(Orange)
(Yellow)
(Pure Green)
(Green)
(Pure Green)
(Red)
(Pure Green)
(Red)
(Yellow)
(Red)
(Orange)
30
25
30
25
30
25
30
25
30
30
30
25
mA
Peak
Forward
Current
I
FM
"
2
60
60
60
60
60
60
60
60
60
60
60
60
mA
Shape
Code
Emitted
color
Suffix
2.Red 3.Orange 4.Yellow 5.Green / Pure Green
Electro-Optical Characteristics
Forward Voltage
Derating
∆
I
F
0.40
0.33
0.40
0.33
0.40
0.33
0.40
0.33
0.40
0.40
0.40
0.33
mA/°C
TYP.
1.7
2.2
2.1
2.2
2.1
2.2
1.7
2.2
1.7
2.1
1.7
2.2
V
V
F
MAX.
2.0
2.5
2.5
2.5
2.5
2.5
2.0
2.5
2.0
2.5
2.0
2.5
I
F
20
20
20
20
20
20
20
20
20
20
20
20
mA
MAX.
100
100
100
100
100
100
100
100
100
100
100
100
µA
Reverse Current
I
R
V
R
4
4
4
4
4
4
4
4
4
4
4
4
V
Peak
λ
p
Ta=25°C
Wavelength
Spectral Line
Half Width
∆λ
Absolute Maximum Ratings
Reverse
Voltage
V
R
4
4
4
4
4
4
4
4
4
4
4
4
V
Operating
Temperature
Topr
"
3
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
°C
Storage
Temperature
Tstg
"
4
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
–40~
+
85
T Y P.
660
605
570
555
560
555
660
555
660
570
660
605
nm
TYP
30
30
30
30
30
30
30
30
30
30
30
30
I
F
20
20
20
20
20
20
20
20
20
20
20
20
mA
"
1 : MU91, MU92 and MU93 series are all 30 mA.
"
2 : tw≤ 2 msec, duty
≤
1/5 However, for the MU91, MU92 and MU93 series, 300 mA for red and 100 mA for yellow, orange and pure green (tw
≤
1 msec, duty
≤
1/20)
"
3
"
4 : For MU91, MU92 and MU93 series, the temperature range is -30°C to +85°C.
■
Characteristics by Shape
Shape
Part No.
Emitted
Color
Resin
Color
Red
Milky White
Orange
Milky White
Yellow
Milky White
Green
Green
Milky White
Green
Red
Milky White
Orange
Milky White
Yellow
Milky White
Green
Green
Milky White
Milky
White
mm
6x9
(7 x 10)
14 x 14
(15 x 15)
Light
Emitting
Surface
(Outer Size)
No.
of
Chips
Ta=25°C
Absolute Max. Rating
Power Dissipation
Pd
240
240
250
250
300
300
250
300
250
240
250
120
120
125
125
150
150
125
150
125
60
62.5
mW
Electro-Optical Characteristics
Luminous Intensity
MIN.
20
20
10
10
20
20
10
15
10
8
8
10
10
5
5
10
10
3
8
5
5
3
mcd
TYP.
42
42
20
20
42
42
20
32
20
12
12
20
20
10
10
20
20
7
16
10
7
4
Iv
I
F
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
mA
3
2
1
fig.
MU02-2201
MU02-2205
MU02-3201
Red
4
4
4
4
4
4
4
4
4
4
4
2
2
2
2
2
2
2
2
2
1
1
pcs
*
MU02-3205
MU02-4201
MU02-4205
MU02-5201
MU02-5202
MU02-5205
MU02-9301
MU03-2201
MU03-2205
MU03-3201
MU03-3205
Orange
Yellow
Pure Green
Green
Pure Green
Red
Pure Green
Red
Orange
*
MU03-4201
MU03-4205
MU03-5201
MU03-5202
MU03-5205
MU03-9201
Units
Yellow
Pure Green
Green
Pure Green
Red
Pure Green
* Lead-free soldering compatible product
■
Package Dimensions
fig.1
unit : mm
Tolerance : ±0.25mm
fig.2
15
14
15
14
10 9 8 7 6
+++ ++
10
1
5.5MIN.
+++ ++
1 23 4 5
(Top View)
10 9 8 7 6
G RRG
0.5
(2.54)
(10.16)
GRRG
1 2 34 5
4
0.25
(12.7)
SUPER BRIGHT LED LIGHT BAR MODULE
■
Characteristics by Shape
Shape
Part No.
Emitted
Color
Resin
Color
Red
Milky White
Orange
Milky White
Yellow
Pure Green
Green
Pure Green
Red
Orange
Yellow
Pure Green
Red
Orange
Yellow
Pure Green
Red
Pure Green
Yellow
Milky White
Green
Green
Milky White
Red
Orange
Yellow
Green
Red
Orange
Yellow
Green
Green
mm
14
x
16
(15
x
17)
6
x
29
(7
x
30)
6
x
19
(7
x
20)
Light
Emitting
Surface
(Outer Size)
No.
of
Chips
3
3
3
3
3
3
3
3
3
5
5
5
5
4
4
4
4
4
4
pcs
Absolute Max. Rating
Power Dissipation
Pd
180
180
190
190
225
225
190
225
190
300
320
375
320
240
250
300
250
240
250
mW
Electro-Optical Characteristics
Luminous Intensity
MIN.
15
15
8
8
15
15
8
10
8
20
10
20
10
20
10
20
10
8
8
mcd
TYP.
32
32
16
16
32
32
16
20
16
40
20
40
20
40
20
40
20
12
12
Iv
I
F
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
mA
7
6
5
4
fig.
Ta=25°C
MU04-2101
MU04-2105
MU04-3101
Red
*
MU04-3105
MU04-4101
MU04-4105
MU04-5101
MU04-5102
MU04-5105
Orange
*
MU07-2101
MU07-3101
MU07-4101
MU07-5101
MU08-2201
*
MU08-3201
MU08-4201
MU08-5201
MU08-9301
Units
* Lead-free soldering compatible product
■
Package Dimensions
fig.3
7
6
(2.2)
10
9
6.5 4MIN.
0.5
0.25
unit : mm
Tolerance : ±0.25mm
fig.4
(Top View)
R G
"9201Type
only
1
2
3
+ + +
7
6
+ + + + + +
1 2 3
View)
1 2 3 4 5 6
(Top View)
"2250Type
only
0.5
1
(2.54)
(5.08)
2
3
1
2
3
1.5
(2.54)
(12.7)
0.5
1
2 3
4 5 6
+ + + +
0.25
fig.5
fig.6
15
14
17
16
8 7 6 5
7 4MIN.
3.5 1
1
+ + + +
1 2 3 4
(Top View)
8 7 6 5
0.5
(2.54)
(7.62)
15
1
2 3
4
+ + + + +
0. 25
fig.7
17
16
10 9 8 7 6
7 5.5MIN.
3.5 1
1
(12.7)
15
14
+ + + + +
12 34 5
2
(Top View)
10 9 8 7 6
G R R G
0.5
(2.54)
(10.16)
15
G R R G
1 2 3 4 5
(12.7)
2
0.25
(2.2)
20
19
6.5 4MIN.
0.5
5
Embedded System
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