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Datasheet> All Categories > storage> storage> Z21010-08
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Z21010-08

Description
Fast Page DRAM, 1MX1, 80ns, CMOS, PZIP19, PLASTIC, ZIP-20/19
Categorystorage    storage   
File Size475KB，16 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
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Z21010-08 Overview

Fast Page DRAM, 1MX1, 80ns, CMOS, PZIP19, PLASTIC, ZIP-20/19

Z21010-08 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntel
Parts packaging codeZIP
package instructionZIP, ZIP20,.1
Contacts20
Reach Compliance Codecompliant
ECCN codeEAR99
access modeFAST PAGE
Maximum access time80 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O typeSEPARATE
JESD-30 codeR-PZIP-T19
JESD-609 codee0
length26.162 mm
memory density1048576 bit
Memory IC TypeFAST PAGE DRAM
memory width1
Number of functions1
Number of ports1
Number of terminals19
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX1
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeZIP
Encapsulate equivalent codeZIP20,.1
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
refresh cycle512
Maximum seat height10.16 mm
Maximum standby current0.001 A
Maximum slew rate0.07 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch1.27 mm
Terminal locationZIG-ZAG
Maximum time at peak reflow temperatureNOT SPECIFIED
width3 mm

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Z21010-08 Related Products

Z21010-08 PE21010-06 Z21010-10 P21010-10 PE21010-07 PE21010-10 PE21010-08 P21010-06 Z21010-06 Z21010-07
Description Fast Page DRAM, 1MX1, 80ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 Fast Page DRAM, 1MX1, 60ns, CMOS, PDSO20, PLASTIC, SOJ-20 Fast Page DRAM, 1MX1, 100ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 Fast Page DRAM, 1MX1, 100ns, CMOS, PDIP18, PLASTIC, DIP-18 Fast Page DRAM, 1MX1, 70ns, CMOS, PDSO20, PLASTIC, SOJ-20 Fast Page DRAM, 1MX1, 100ns, CMOS, PDSO20, PLASTIC, SOJ-20 Fast Page DRAM, 1MX1, 80ns, CMOS, PDSO20, PLASTIC, SOJ-20 Fast Page DRAM, 1MX1, 60ns, CMOS, PDIP18, PLASTIC, DIP-18 Fast Page DRAM, 1MX1, 60ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 Fast Page DRAM, 1MX1, 70ns, CMOS, PZIP19, PLASTIC, ZIP-20/19
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Intel Intel Intel Intel Intel Intel Intel Intel Intel Intel
Parts packaging code ZIP SOJ ZIP DIP SOJ SOJ SOJ DIP ZIP ZIP
package instruction ZIP, ZIP20,.1 SOJ, SOJ20/26,.34 ZIP, ZIP20,.1 DIP, DIP18,.3 SOJ, SOJ20/26,.34 SOJ, SOJ20/26,.34 SOJ, SOJ20/26,.34 DIP, DIP18,.3 ZIP, ZIP20,.1 ZIP, ZIP20,.1
Contacts 20 20 20 18 20 20 20 18 20 20
Reach Compliance Code compliant unknown compliant unknown unknown unknown unknown unknow unknow compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
Maximum access time 80 ns 60 ns 100 ns 100 ns 70 ns 100 ns 80 ns 60 ns 60 ns 70 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-PZIP-T19 R-PDSO-J20 R-PZIP-T19 R-PDIP-T18 R-PDSO-J20 R-PDSO-J20 R-PDSO-J20 R-PDIP-T18 R-PZIP-T19 R-PZIP-T19
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
length 26.162 mm 17.145 mm 26.162 mm 21.965 mm 17.145 mm 17.145 mm 17.145 mm 21.965 mm 26.162 mm 26.162 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bi 1048576 bi 1048576 bi
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM
memory width 1 1 1 1 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1 1
Number of terminals 19 20 19 18 20 20 20 18 19 19
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code ZIP SOJ ZIP DIP SOJ SOJ SOJ DIP ZIP ZIP
Encapsulate equivalent code ZIP20,.1 SOJ20/26,.34 ZIP20,.1 DIP18,.3 SOJ20/26,.34 SOJ20/26,.34 SOJ20/26,.34 DIP18,.3 ZIP20,.1 ZIP20,.1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 512 512 512 512 512 512 512 512 512 512
Maximum seat height 10.16 mm 3.56 mm 10.16 mm 5.0038 mm 3.56 mm 3.56 mm 3.56 mm 5.0038 mm 10.16 mm 10.16 mm
Maximum standby current 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A
Maximum slew rate 0.07 mA 0.09 mA 0.06 mA 0.06 mA 0.08 mA 0.06 mA 0.07 mA 0.09 mA 0.09 mA 0.08 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO NO YES YES YES NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE J BEND J BEND J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location ZIG-ZAG DUAL ZIG-ZAG DUAL DUAL DUAL DUAL DUAL ZIG-ZAG ZIG-ZAG
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3 mm 7.62 mm 3 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 3 mm 3 mm

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