EEWORLDEEWORLDEEWORLD

Part Number

Search

ECCM5A5EA-20-14.31818M

Description
QUARTZ CRYSTAL RESONATOR, 14.31818 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
CategoryPassive components    Crystal/resonator   
File Size126KB,4 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Environmental Compliance  
Download Datasheet Parametric View All

ECCM5A5EA-20-14.31818M Overview

QUARTZ CRYSTAL RESONATOR, 14.31818 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

ECCM5A5EA-20-14.31818M Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerECLIPTEK
package instructionROHS COMPLIANT, CERAMIC, SMD, 4 PIN
Reach Compliance Codecompliant
Other featuresAT-CUT CRYSTAL; BULK
Ageing3 PPM/YEAR
Crystal/Resonator TypePARALLEL - FUNDAMENTAL
Drive level100 µW
frequency stability0.003%
frequency tolerance30 ppm
JESD-609 codee4
load capacitance20 pF
Manufacturer's serial numberECCM5A
Installation featuresSURFACE MOUNT
Nominal operating frequency14.31818 MHz
Maximum operating temperature60 °C
Minimum operating temperature-10 °C
physical sizeL6.0XB3.5XH1.0 (mm)/L0.236XB0.138XH0.039 (inch)
Series resistance60 Ω
surface mountYES
Terminal surfaceNickel/Gold (Ni/Au)

ECCM5A5EA-20-14.31818M Preview

ECCM5A5EA-20-14.31818M
Series
RoHS Compliant (Pb-free) 3.5mm x 6mm Ceramic
4-Pad SMD Crystal
Frequency Tolerance
±30ppm
Frequency Stability
±30ppm
RoHS
Pb
Nominal Frequency
14.31818MHz
ECCM5A 5 E A -20 -14.31818M
Load Capacitance
20pF Parallel Resonant
Operating Temperature Range
-10°C to +60°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance
Frequency Stability
Aging at 25°C
Operating Temperature Range
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Spurious Response
Storage Temperature Range
Insulation Resistance
14.31818MHz
±30ppm
±30ppm
±3ppm/year Maximum
-10°C to +60°C
20pF Parallel Resonant
5pF Maximum
60 Ohms Maximum
AT-Cut Fundamental
100µWatts Maximum
-3dB Minimum; Fo to Fo +5000ppm
-40°C to +85°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev P 2/16/2010 | Page 1 of 4
ECCM5A5EA-20-14.31818M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
1
2
CONNECTION
Input
Case/Ground
Output
Case/Ground
3.5
±0.2
1
6.0
±0.2
2
4
MARKING
ORIENTATION
1.5 ±0.2
4
1.5 ±0.1
1
(x4)
3
4
LINE MARKING
1
E14.31
E=Ecliptek Designator
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
3.0 ±0.2
2
3
1.0 ±0.2
3
1.0 ±0.1 (x4)
2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev P 2/16/2010 | Page 2 of 4
ECCM5A5EA-20-14.31818M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev P 2/16/2010 | Page 3 of 4
ECCM5A5EA-20-14.31818M
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 245°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev P 2/16/2010 | Page 4 of 4
A large number of PCB design skills resources are on the way, please be prepared to receive them!
There is always a resource you can use. No more nonsense, here are the resources! [font=微软雅黑][size=4][url=https://download.eeworld.com.cn/source/581764]AD skills: 3D Model lib.rar[/url] [url=https://d...
高进 Download Centre
How many types of Beaglebone black are there?
After reading a lot of introductions, I found that beaglebone black has a global version and a Chinese version. The Chinese version is produced by Inbet, and the hardware is not completely the same as...
e小强2013 DSP and ARM Processors
【CN0194】Galvanically isolated, dual-channel, 16-bit, simultaneous sampling, daisy-chained data acquisition system
Circuit Functionality and Benefits This circuit provides galvanic isolation for high speed, high accuracy, simultaneous sampling analog-to-digital conversion applications, as shown in Figure 1. The 16...
EEWORLD社区 ADI Reference Circuit
Problems and solutions encountered when using msp430 low power delay function
[size=4]Recently I am using MSP430 to make something[/size] [size=4]There are some requirements for heat generation[/size] [size=4]In order to reduce heat generation as much as possible[/size] [size=4...
littleshrimp Microcontroller MCU
SINA31S unboxing experience
A few days ago, everyone agreed to bid for a SIN A31S development board. Let's take a look at this development board with these pictures. First of all, the outer packaging. The box is well made. There...
白丁 Embedded System
430 AD conversion
Do we need to consider impedance matching when converting AD?As shown in the figure, do we need to consider that the impedance of Rs, Ri and Ci should be equal?...
zzbaizhi Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 112  271  1877  2312  2174  3  6  38  47  44 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号