HYS64D16000HDL-8-B datasheet, PDF

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HYS64D16000HDL-8-B: DescriptionDDR DRAM Module, 16MX64, 0.8ns, CMOS, SODIMM-200; Categorystorage storage; File Size777KB，31 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/; Environmental Compliance

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HYS64D16000HDL-8-B Overview

DDR DRAM Module, 16MX64, 0.8ns, CMOS, SODIMM-200

HYS64D16000HDL-8-B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Infineon
Parts packaging code	MODULE
package instruction	DIMM,
Contacts	200
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Maximum access time	0.8 ns
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N200
memory density	1073741824 bit
Memory IC Type	DDR DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	200
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX64
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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D a t a S h e e t , V 1 . 2 , A u g . 2 00 3

H Y S 64 D 3 2 0 2 0 G D L – [ 5 / 6 / 7 / 8 ] – B

H Y S 64 D 1 6 0 0 x G D L – [ 6 / 7 / 8 ] – B

200- Pi n Small Outli ne Dual -In- Line Memor y Modules

S O -D I M M

DDR SDRAM

M e m or y P r o du c t s

N e v e r

s t o p

t h i n k i n g .

HYS64D16000HDL-8-B Related Products

	HYS64D16000HDL-8-B	HYS64D32020HDL-6-B	HYS64D32020HDL-8-B	HYS64D32020HDL-5-B	HYS64D16001HDL-6-B	HYS64D16000HDL-6-B
Description	DDR DRAM Module, 16MX64, 0.8ns, CMOS, SODIMM-200	DDR DRAM Module, 32MX64, 0.7ns, CMOS, SODIMM-200	DDR DRAM Module, 32MX64, 0.8ns, CMOS, SODIMM-200	DDR DRAM Module, 32MX64, 0.6ns, CMOS, SODIMM-200	DDR DRAM Module, 16MX64, 0.7ns, CMOS, SODIMM-200	DDR DRAM Module, 16MX64, 0.7ns, CMOS, SODIMM-200
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	MODULE	MODULE	MODULE	MODULE	MODULE	MODULE
package instruction	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,
Contacts	200	200	200	200	200	200
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	SINGLE BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST
Maximum access time	0.8 ns	0.7 ns	0.8 ns	0.6 ns	0.7 ns	0.7 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N200	R-XDMA-N200	R-XDMA-N200	R-XDMA-N200	R-XDMA-N200	R-XDMA-N200
memory density	1073741824 bit	2147483648 bit	2147483648 bit	2147483648 bit	1073741824 bit	1073741824 bit
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	64	64	64	64	64	64
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	200	200	200	200	200	200
word count	16777216 words	33554432 words	33554432 words	33554432 words	16777216 words	16777216 words
character code	16000000	32000000	32000000	32000000	16000000	16000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	16MX64	32MX64	32MX64	32MX64	16MX64	16MX64
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	2.3 V	2.3 V	2.5 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.6 V	2.5 V	2.5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maker	Infineon	Infineon	Infineon	Infineon	-	Infineon
Base Number Matches	-	1	1	1	1	-

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