256KX1 STANDARD SRAM, 20ns, CDIP24, 0.300 INCH, CERDIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | DIP |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 20 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| memory density | 262144 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Negative supply voltage rating | -4.5 V |
| Number of terminals | 24 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| organize | 256KX1 |
| Output characteristics | OPEN-EMITTER |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | -4.5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 0.16 mA |
| surface mount | NO |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| UPD100500D-20 | UPD100500D-15 | |
|---|---|---|
| Description | 256KX1 STANDARD SRAM, 20ns, CDIP24, 0.300 INCH, CERDIP-24 | IC,SRAM,256KX1,BICMOS-ECL100,DIP,24PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Parts packaging code | DIP | DIP |
| Contacts | 24 | 24 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| Maximum access time | 20 ns | 15 ns |
| I/O type | SEPARATE | SEPARATE |
| JESD-30 code | R-XDIP-T24 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 |
| memory density | 262144 bit | 262144 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 |
| Negative supply voltage rating | -4.5 V | -4.5 V |
| Number of terminals | 24 | 24 |
| word count | 262144 words | 262144 words |
| character code | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C |
| organize | 256KX1 | 256KX1 |
| Output characteristics | OPEN-EMITTER | OPEN-EMITTER |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP24,.3 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| power supply | -4.5 V | -4.5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum slew rate | 0.16 mA | 0.16 mA |
| surface mount | NO | NO |
| Temperature level | OTHER | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
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