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AM28F256A-75PC

Description
Flash, 32KX8, 70ns, PDIP32, PLASTIC, DIP-32
Categorystorage    storage   
File Size187KB,34 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

AM28F256A-75PC Overview

Flash, 32KX8, 70ns, PDIP32, PLASTIC, DIP-32

AM28F256A-75PC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time70 ns
Other features100K WRITE/ERASE CYCLES MIN
command user interfaceYES
Data pollingYES
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length42.164 mm
memory density262144 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals32
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height5.715 mm
Maximum standby current0.0001 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width15.24 mm
FINAL
Am28F256A
256 Kilobit (32,768 x 8-Bit) CMOS 12.0 Volt, Bulk Erase
Flash Memory with Embedded Algorithms
DISTINCTIVE CHARACTERISTICS
s
High performance
— 70 ns maximum access time
s
CMOS low power consumption
— 30 mA maximum active current
— 100
µA
maximum standby current
— No data retention power consumption
s
Compatible with JEDEC-standard byte-wide
32-Pin EPROM pinouts
— 32-pin PDIP
— 32-pin PLCC
— 32-pin TSOP
— 32-pin LCC
s
100,000 write/erase cycles minimum
s
Write and erase voltage 12.0 V
±5%
s
Latch-up protected to 100 mA from –1 V to
V
CC
+1 V
Advanced
Micro
Devices
s
Embedded Erase Electrical Bulk Chip-Erase
— 1.5 seconds typical chip-erase including
pre-programming
s
Embedded Program
— 14
µs
typical byte-program including time-out
— 0.5 second typical chip program
s
Command register architecture for
microprocessor/microcontroller compatible
write interface
s
On-chip address and data latches
s
Advanced CMOS flash memory technology
— Low cost single transistor memory cell
s
Embedded algorithms for completely
self-timed write/erase operations
GENERAL DESCRIPTION
The Am28F256A is a 256K Flash memory organized as
32K bytes of 8 bits each. AMD’s Flash memories offer
the most cost-effective and reliable read/write non- vola-
tile random access memory. The Am28F256A is pack-
aged in 32-pin PDIP, PLCC, and TSOP versions. It is
designed to be reprogrammed and erased in-system or
in standard EPROM programmers. The Am28F256A is
erased when shipped from the factory.
The standard Am28F256A offers access times as fast
as 70 ns, allowing operation of high-speed microproces-
sors without wait states. To eliminate bus contention,
the Am28F256A has separate chip enable (CE) and out-
put enable (OE) controls.
AMD’s Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
Am28F256A uses a command register to manage this
functionality, while maintaining a standard JEDEC
Flash Standard 32-pin pinout. The command register al-
lows for 100% TTL level control inputs and fixed power
supply levels during erase and programming.
AMD’s Flash technology reliably stores memory con-
tents even after 100,000 erase and program cycles. The
AMD cell is designed to optimize the erase and
programming mechanisms. In addition, the combination
2-34
of advanced tunnel oxide processing and low internal
electric fields for erase and programming operations
produces reliable cycling. The Am28F256A uses a
12.0 V
±
5% V
PP
high voltage input to perform the erase
and programming functions.
The highest degree of latch-up protection is achieved
with AMD’s proprietary non-epi process. Latch-up pro-
tection is provided for stresses up to 100 milliamps on
address and data pins from –1 V to V
CC
+1 V.
Embedded Program
The Am28F256A is byte programmable using the
Embedded Programming algorithm. The Embedded
Programming algorithm does not require the system to
time-out or verify the data programmed. The typical
room temperature programming time of the
Am28F256A is one half second.
Embedded Erase
The entire chip is bulk erased using the Embedded
Erase algorithm. The Embedded Erase algorithm auto-
matically programs the entire array prior to electrical
erase. The timing and verification of electrical erase are
controlled internal to the device. Typical erasure at room
Publication#
18879
Rev.
B
Amendment
/0
Issue Date:
November 1995

AM28F256A-75PC Related Products

AM28F256A-75PC AM28F256A-75EC AM28F256A-95PC AM28F256A-95FC AM28F256A-95EC AM28F256A-75JC AM28F256A-95JC AM28F256A-75FC
Description Flash, 32KX8, 70ns, PDIP32, PLASTIC, DIP-32 Flash, 32KX8, 70ns, PDSO32, TSOP-32 Flash, 32KX8, 90ns, PDIP32, PLASTIC, DIP-32 Flash, 32KX8, 90ns, PDSO32, REVERSE, TSOP-32 Flash, 32KX8, 90ns, PDSO32, TSOP-32 Flash, 32KX8, 70ns, PQCC32, PLASTIC, LCC-32 Flash, 32KX8, 90ns, PQCC32, PLASTIC, LCC-32 Flash, 32KX8, 70ns, PDSO32, REVERSE, TSOP-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker AMD AMD AMD AMD AMD AMD AMD AMD
Parts packaging code DIP TSOP DIP TSOP TSOP QFJ QFJ TSOP
package instruction DIP, DIP32,.6 TSOP-32 PLASTIC, DIP-32 REVERSE, TSOP-32 TSOP1, TSSOP32,.8,20 QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6 REVERSE, TSOP-32
Contacts 32 32 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 70 ns 70 ns 90 ns 90 ns 90 ns 70 ns 90 ns 70 ns
Other features 100K WRITE/ERASE CYCLES MIN 100K WRITE/ERASE CYCLES MIN 100K WRITE/ERASE CYCLES MIN 100K WRITE/ERASE CYCLES MIN 100K WRITE/ERASE CYCLES MIN 100K WRITE/ERASE CYCLES MIN 100K WRITE/ERASE CYCLES MIN 100K WRITE/ERASE CYCLES MIN
command user interface YES YES YES YES YES YES YES YES
Data polling YES YES YES YES YES YES YES YES
JESD-30 code R-PDIP-T32 R-PDSO-G32 R-PDIP-T32 R-PDSO-G32 R-PDSO-G32 R-PQCC-J32 R-PQCC-J32 R-PDSO-G32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 42.164 mm 18.4 mm 42.164 mm 18.4 mm 18.4 mm 13.97 mm 13.97 mm 18.4 mm
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP TSOP1 DIP TSOP1-R TSOP1 QCCJ QCCJ TSOP1-R
Encapsulate equivalent code DIP32,.6 TSSOP32,.8,20 DIP32,.6 TSSOP32,.8,20 TSSOP32,.8,20 LDCC32,.5X.6 LDCC32,.5X.6 TSSOP32,.8,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE, THIN PROFILE IN-LINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE CHIP CARRIER CHIP CARRIER SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 12 V 12 V 12 V 12 V 12 V 12 V 12 V 12 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.715 mm 1.2 mm 5.715 mm 1.2 mm 1.2 mm 3.556 mm 3.556 mm 1.2 mm
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING GULL WING J BEND J BEND GULL WING
Terminal pitch 2.54 mm 0.5 mm 2.54 mm 0.5 mm 0.5 mm 1.27 mm 1.27 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL QUAD QUAD DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit YES YES YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 15.24 mm 8 mm 15.24 mm 8 mm 8 mm 11.43 mm 11.43 mm 8 mm

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