UPD29F008LGZ-B12T-LJH datasheet, PDF

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UPD29F008LGZ-B12T-LJH: DescriptionIC,EEPROM,NOR FLASH,1MX8,CMOS,TSSOP,40PIN,PLASTIC; Categorystorage storage; File Size852KB，27 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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UPD29F008LGZ-B12T-LJH Overview

IC,EEPROM,NOR FLASH,1MX8,CMOS,TSSOP,40PIN,PLASTIC

UPD29F008LGZ-B12T-LJH Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Reach Compliance Code	unknown
Maximum access time	120 ns
startup block	TOP
command user interface	YES
Data polling	YES
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G40
JESD-609 code	e0
memory density	8388608 bit
Memory IC Type	FLASH
memory width	8
Number of departments/size	1,2,1,15
Number of terminals	40
word count	1048576 words
character code	1000000
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
organize	1MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP40,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
power supply	3/3.3 V
Certification status	Not Qualified
ready/busy	YES
Department size	16K,8K,32K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.045 mA
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
switch bit	YES
type	NOR TYPE

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UPD29F008LGZ-B12T-LJH Related Products

	UPD29F008LGZ-B12T-LJH	UPD29F008LGZ-B12B-LJH	UPD29F008LGZ-B12T-LKH	UPD29F008LGZ-B15B-LKH	UPD29F008LGZ-B15T-LKH	UPD29F008LGZ-B15B-LJH	UPD29F008LGZ-B15T-LJH	UPD29F008LGZ-B12B-LKH
Description	IC,EEPROM,NOR FLASH,1MX8,CMOS,TSSOP,40PIN,PLASTIC	IC,EEPROM,NOR FLASH,1MX8,CMOS,TSSOP,40PIN,PLASTIC	IC,EEPROM,NOR FLASH,1MX8,CMOS,TSSOP,40PIN,PLASTIC	IC,EEPROM,NOR FLASH,1MX8,CMOS,TSSOP,40PIN,PLASTIC	IC,EEPROM,NOR FLASH,1MX8,CMOS,TSSOP,40PIN,PLASTIC	IC,EEPROM,NOR FLASH,1MX8,CMOS,TSSOP,40PIN,PLASTIC	IC,EEPROM,NOR FLASH,1MX8,CMOS,TSSOP,40PIN,PLASTIC	IC,EEPROM,NOR FLASH,1MX8,CMOS,TSSOP,40PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	120 ns	120 ns	120 ns	150 ns	150 ns	150 ns	150 ns	120 ns
startup block	TOP	BOTTOM	TOP	BOTTOM	TOP	BOTTOM	TOP	BOTTOM
command user interface	YES	YES	YES	YES	YES	YES	YES	YES
Data polling	YES	YES	YES	YES	YES	YES	YES	YES
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G40	R-PDSO-G40	R-PDSO-G40	R-PDSO-G40	R-PDSO-G40	R-PDSO-G40	R-PDSO-G40	R-PDSO-G40
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	8	8	8	8
Number of departments/size	1,2,1,15	1,2,1,15	1,2,1,15	1,2,1,15	1,2,1,15	1,2,1,15	1,2,1,15	1,2,1,15
Number of terminals	40	40	40	40	40	40	40	40
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
organize	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP	TSSOP
Encapsulate equivalent code	TSSOP40,.8,20	TSSOP40,.8,20	TSSOP40,.8,20	TSSOP40,.8,20	TSSOP40,.8,20	TSSOP40,.8,20	TSSOP40,.8,20	TSSOP40,.8,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES	YES	YES	YES	YES
Department size	16K,8K,32K,64K	16K,8K,32K,64K	16K,8K,32K,64K	16K,8K,32K,64K	16K,8K,32K,64K	16K,8K,32K,64K	16K,8K,32K,64K	16K,8K,32K,64K
Maximum standby current	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
Maximum slew rate	0.045 mA	0.045 mA	0.045 mA	0.045 mA	0.045 mA	0.045 mA	0.045 mA	0.045 mA
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
switch bit	YES	YES	YES	YES	YES	YES	YES	YES
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE

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