W19B322MTB9L datasheet, PDF - EEWORLD Datasheet

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W19B322MTB9L: DescriptionFlash, 2MX16, 90ns, PBGA48, TFBGA-48; Categorystorage storage; File Size475KB，52 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W19B322MTB9L Overview

Flash, 2MX16, 90ns, PBGA48, TFBGA-48

W19B322MTB9L Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	BGA
package instruction	TFBGA-48
Contacts	48
Reach Compliance Code	not_compliant
ECCN code	3A991.B.1.A
Maximum access time	90 ns
Spare memory width	8
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B48
JESD-609 code	e0
length	11 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	8,63
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	8K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.75 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
type	NOR TYPE
width	8 mm

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W19B32XMT/B Data Sheet

8/2M

16 3V DUAL BANK FLASH MEMORY

Table of Contents-

GENERAL DESCRIPTION ......................................................................................................... 4

FEATURES ................................................................................................................................. 4

PIN CONFIGURATIONS ............................................................................................................ 5

BLOCK DIAGRAM ...................................................................................................................... 5

PIN DESCRIPTION..................................................................................................................... 5

FUNCTIONAL DESCRIPTION ................................................................................................... 6

6.1

Device Bus Operation..................................................................................................... 6

6.1.1

6.1.2

6.1.3

6.1.4

6.1.5

6.1.6

6.1.7

6.1.8

6.1.9

6.1.10

6.1.11

6.1.12

6.1.13

6.1.14

Word/Byte Configuration ..................................................................................................6

Reading Array Data ..........................................................................................................6

Writing Commands/Command Sequences.......................................................................6

Simultaneous Read/Write Operations with Zero Latency .................................................7

Standby Mode ..................................................................................................................7

Automatic Sleep Mode .....................................................................................................7

#RESET: Hardware Reset Pin..........................................................................................7

Output Disable Mode........................................................................................................8

Autoselect Mode...............................................................................................................8

Sector/Sector Block Protection and Unprotection...........................................................8

Write Protect (#WP) .......................................................................................................8

Temporary Sector Unprotect ..........................................................................................9

Security Sector Flash Memory Region ...........................................................................9

Hardware Data Protection ............................................................................................10

Reading Array Data ........................................................................................................11

Reset Command.............................................................................................................11

Autoselect Command Sequence ....................................................................................11

Enter Security Sector/Exit Security Sector Command Sequence ...................................12

Byte/Word Program Command Sequence......................................................................12

Unlock Bypass Command Sequence .............................................................................12

Chip Erase Command Sequence ...................................................................................13

Sector Erase Command Sequence ................................................................................13

Erase Suspend/Erase Resume Commands ...................................................................14

DQ7: #Data Polling.........................................................................................................15

RY/#BY: Ready/#Busy ...................................................................................................15

DQ6: Toggle Bit I............................................................................................................15

6.2

Command Definitions ................................................................................................... 10

6.2.1

6.2.2

6.2.3

6.2.4

6.2.5

6.2.6

6.2.7

6.2.8

6.2.9

6.3

Write Operation Status ................................................................................................. 14

6.3.1

6.3.2

6.3.3

-1-

Publication Release Date: March 23, 2004

Revision A2

W19B32XMT/B

6.3.4

6.3.5

6.3.6

6.3.7

DQ2: Toggle Bit II...........................................................................................................16

Reading Toggle Bits DQ6/DQ2 ......................................................................................16

DQ5: Exceeded Timing Limits ........................................................................................17

DQ3: Sector Erase Timer ...............................................................................................17

TABLE OF OPERATION MODES ............................................................................................ 18

7.1

7.2

7.3

7.4

7.5

Device Bus Operations ................................................................................................. 18

Autoselect Codes (High Voltage Method) .................................................................... 19

Sector Address Table (Top Boot Block) ....................................................................... 20

Sector Address Table (Bottom Boot Block) .................................................................. 22

CFI Query Identification String...................................................................................... 26

7.5.1

7.5.2

7.5.3

7.5.4

7.5.5

System Interface String ..................................................................................................26

Device Geometry Definition ............................................................................................27

Primary Vendor-Specific Extended Query ......................................................................28

Command Definitions .....................................................................................................29

Write Operation Status ...................................................................................................30

7.6

7.7

7.8

7.9

7.10

7.11

8.1

8.2

8.3

Temporary Sector Unprotect Algorithm ........................................................................ 31

In-System Sector Protect/Unprotect Algorithms........................................................... 32

Program Algorithm........................................................................................................ 33

Erase Algorithm ............................................................................................................ 33

Data Polling Algorithm .................................................................................................. 34

Toggle Bit Algorithm ..................................................................................................... 35

Absolute Maximum Ratings .......................................................................................... 36

Operating Ranges......................................................................................................... 36

DC Characteristics........................................................................................................ 37

8.3.1

CMOS Compatible..........................................................................................................37

DC CHARACTERISTICS.......................................................................................................... 36

AC CHARACTERISTICS .......................................................................................................... 38

9.1

9.2

9.3

9.4

9.5

9.6

9.7

9.8

Test Condition............................................................................................................... 38

AC Test Load and Waveforms ..................................................................................... 38

Read-Only Operations .................................................................................................. 39

Hardware Reset (#RESET) .......................................................................................... 39

Word/Byte Configuration (#BYTE)................................................................................ 39

Erase And Program Operation ..................................................................................... 40

Temporary Sector Unprotect ........................................................................................ 40

Alternate #CE Controlled Erase and Program Operations........................................... 41

AC Read Waveform...................................................................................................... 42

-2-

10.

TIMING WAVEFORMS ............................................................................................................. 42

10.1

W19B32XMT/B

10.2

10.3

10.4

10.5

10.6

10.7

10.8

10.9

10.10

10.11

10.12

10.13

10.14

11.

12.

13.

14.

Reset Waveform ........................................................................................................... 42

#BYTE Waveform for Read Operation ......................................................................... 43

#BYTE Waveform for Write Operation ......................................................................... 43

Programming Waveform............................................................................................... 44

Accelerated Programming Waveform........................................................................... 44

Chip/Sector Erase Waveform ....................................................................................... 45

Back-to back Read/Write Cycle Waveform .................................................................. 45

#Data Polling Waveform (During Embedded Algorithms) ............................................ 46

Toggle Bit Waveform (During Embedded Algorithms) ................................................ 46

DQ 2 vs. DQ6 Waveform ............................................................................................. 47

Temporary Sector Unprotect Timing Diagram............................................................. 47

Sector/Sector Block Protect and Unprotect Timing Diagram ...................................... 47

Alternate #CE Controlled Write (Erase/Program) Operation Timing........................... 48

LATCHUP CHARACTERISTICS .............................................................................................. 49

CAPACITANCE......................................................................................................................... 49

ORDERING INFORMATION .................................................................................................... 50

PACKAGE DIMENSIONS ......................................................................................................... 51

14.1

14.2

48-Ball TFBGA.............................................................................................................. 51

48-Pin Standard Thin Small Outline Package .............................................................. 51

15.

VERSION HISTORY ................................................................................................................. 52

-3-

Publication Release Date: March 23, 2004

Revision A2

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