MT8KSF12864HZ-1G6XX datasheet, PDF

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MT8KSF12864HZ-1G6XX: DescriptionDDR DRAM Module, 128MX64, CMOS, HALOGEN FREE, MO-268, SODIMM-204; Categorystorage storage; File Size345KB，17 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT8KSF12864HZ-1G6XX Overview

DDR DRAM Module, 128MX64, CMOS, HALOGEN FREE, MO-268, SODIMM-204

MT8KSF12864HZ-1G6XX Parametric

Parameter Name	Attribute value
Maker	Micron Technology
Parts packaging code	SODIMM
package instruction	DIMM,
Contacts	204
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	SINGLE BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N204
length	67.6 mm
memory density	8589934592 bit
Memory IC Type	DDR DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	204
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128MX64
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
Maximum seat height	3.8 mm
self refresh	YES
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	DUAL
width	30 mm

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1GB, 2GB (x64, SR) 204-Pin 1.35V DDR3 SODIMM

Features

1.35V DDR3 SDRAM SODIMM

MT8KSF12864H – 1GB

MT8KSF25664H – 2GB

Features

• DDR3L functionality and operations supported as

defined in the component data sheet

• 204-pin, small-outline dual in-line memory module

(SODIMM)

• Fast data transfer rates: PC3-12800, PC3-10600,

PC3-8500, or PC3-6400

• 1GB (128 Meg x 64), 2GB (256 Meg x 64)

• V

= 1.35V (1.283–1.45V)

• V

= 1.5V (1.425–1.575V)

• Backward-compatible to V

= 1.5V ±0.075V

• V

DDSPD

= 3.0–3.6V

• Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

• Single rank

• On-board I

C temperature sensor with integrated

serial presence-detect (SPD) EEPROM

• 8 internal device banks

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Gold edge contacts

• Halogen-free

• Fly-by topology

• Terminated control, command, and address bus

Table 1: Key Timing Parameters

Speed

Grade

-1G6

-1G4

-1G1

-1G0

-80B

Industry

Nomenclature

PC3-12800

PC3-10600

PC3-8500

PC3-6400

Data Rate (MT/s)

CL = 11 CL = 10

1600

–

1333

–

CL = 9

1333

–

CL = 8

1066

–

CL = 7

1066

–

CL = 6

800

CL = 5

667

RCD

Figure 1: 204-Pin SODIMM (MO-268 R/C B)

Module height: 30.0mm (1.18in)

Options

• Operating temperature

– Commercial (0°C

≤

+70°C)

• Package

– 204-pin DIMM (halogen-free)

• Frequency/CAS latency

– 1.25ns @ CL = 11 (DDR3-1600)

– 1.5ns @ CL = 9 (DDR3-1333)

– 1.87ns @ CL = 7 (DDR3-1066)

– 1.87ns @ CL = 8 (DDR3-1066)

– 2.5ns @ CL = 5 (DDR3-800)

– 2.5ns @ CL = 6 (DDR3-800)

Note:

Marking

None

-1G6

-1G4

-1G1

-1G0

-80C

-80B

1. Not recommended for new designs.

(ns)

13.125

(ns)

13.125

(ns)

48.125

49.125

50.625

52.5

PDF: 09005aef83b0ef39

ksf8c128_256x64hz – Rev. D 4/13 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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Maker	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology
Parts packaging code	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM	SODIMM
package instruction	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,
Contacts	204	204	204	204	204	204	204
Reach Compliance Code	compliant	unknown	compliant	unknown	unknown	unknow	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204	R-XDMA-N204
length	67.6 mm	67.6 mm	67.6 mm	67.6 mm	67.6 mm	67.6 mm	67.6 mm
memory density	8589934592 bit	8589934592 bit	17179869184 bit	17179869184 bit	17179869184 bit	8589934592 bi	17179869184 bi
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	64	64	64	64	64	64	64
Number of functions	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1
Number of terminals	204	204	204	204	204	204	204
word count	134217728 words	134217728 words	268435456 words	268435456 words	268435456 words	134217728 words	268435456 words
character code	128000000	128000000	256000000	256000000	256000000	128000000	256000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128MX64	128MX64	256MX64	256MX64	256MX64	128MX64	256MX64
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.8 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm	3.8 mm
self refresh	YES	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V
Minimum supply voltage (Vsup)	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V
Nominal supply voltage (Vsup)	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	30 mm	30 mm	30 mm	30 mm	30 mm	30 mm	30 mm

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