Inverter, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, TSSOP-14
| Parameter Name | Attribute value |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | TSSOP |
| package instruction | TSSOP, |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| series | LVC/LCX/Z |
| JESD-30 code | R-PDSO-G14 |
| JESD-609 code | e0 |
| length | 5 mm |
| Logic integrated circuit type | INVERTER |
| Number of functions | 6 |
| Number of entries | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| propagation delay (tpd) | 5.5 ns |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| width | 4.4 mm |





| IDT74LVC04APG8 | IDT74LVC04APY | IDT74LVC04APY8 | IDT74LVC04ADCG8 | IDT74LVC04ADC8 | IDT74LVC04ADCG | |
|---|---|---|---|---|---|---|
| Description | Inverter, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, TSSOP-14 | Inverter, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, 0.65 MM PITCH, SSOP-14 | Inverter, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, SSOP-14 | Inverter, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, 1.27 MM PITCH, SOIC-14 | Inverter, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, 1.27 MM PITCH, SOIC-14 | Inverter, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, 1.27 MM PITCH, SOIC-14 |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | TSSOP | SSOP | SSOP | SOIC | SOIC | SOIC |
| package instruction | TSSOP, | 0.65 MM PITCH, SSOP-14 | SSOP-14 | 1.27 MM PITCH, SOIC-14 | SOP, | SOP, |
| Contacts | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | not_compliant | compliant | compliant | compliant | compliant |
| series | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 code | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609 code | e0 | e0 | e0 | e3 | e0 | e3 |
| length | 5 mm | 6.2 mm | 6.2 mm | 8.65 mm | 8.65 mm | 8.65 mm |
| Logic integrated circuit type | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| Number of functions | 6 | 6 | 6 | 6 | 6 | 6 |
| Number of entries | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | SSOP | SSOP | SOP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| propagation delay (tpd) | 5.5 ns | 5.5 ns | 5.5 ns | 5.5 ns | 5.5 ns | 5.5 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 2 mm | 2 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 4.4 mm | 5.3 mm | 5.3 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| Is it lead-free? | - | Contains lead | Contains lead | Lead free | Contains lead | Lead free |
| Is it Rohs certified? | - | incompatible | incompatible | conform to | incompatible | conform to |
| Peak Reflow Temperature (Celsius) | - | 225 | 225 | 260 | NOT SPECIFIED | 260 |
| Maximum time at peak reflow temperature | - | 30 | 30 | 40 | NOT SPECIFIED | 40 |