EEWORLDEEWORLDEEWORLD

Part Number

Search

WMYP32K32V-8TQM

Description
Cache SRAM, 32KX32, 8ns, CMOS, CQFP100,
Categorystorage    storage   
File Size123KB,3 Pages
ManufacturerWhite Microelectronics
Download Datasheet Parametric Compare View All

WMYP32K32V-8TQM Overview

Cache SRAM, 32KX32, 8ns, CMOS, CQFP100,

WMYP32K32V-8TQM Parametric

Parameter NameAttribute value
MakerWhite Microelectronics
Reach Compliance Codeunknown
Maximum access time8 ns
Other featuresSELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE
JESD-30 codeR-CQFP-G100
memory density1048576 bit
Memory IC TypeCACHE SRAM
memory width32
Number of functions1
Number of terminals100
word count32768 words
character code32000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize32KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formGULL WING
Terminal locationQUAD

WMYP32K32V-8TQM Related Products

WMYP32K32V-8TQM WMYP32K32V-8TQMA WMYP32K32V-10TQI WMYP32K32V-10TQMA WMYP32K32V-8TQI WMYP32K32V-10TQIA WMYP32K32V-8TQIA WMYP32K32V-10TQM
Description Cache SRAM, 32KX32, 8ns, CMOS, CQFP100, Cache SRAM, 32KX32, 8ns, CMOS, CQFP100, Cache SRAM, 32KX32, 10ns, CMOS, CQFP100, Cache SRAM, 32KX32, 10ns, CMOS, CQFP100, Cache SRAM, 32KX32, 8ns, CMOS, CQFP100, Cache SRAM, 32KX32, 10ns, CMOS, CQFP100, Cache SRAM, 32KX32, 8ns, CMOS, CQFP100, Cache SRAM, 32KX32, 10ns, CMOS, CQFP100,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 8 ns 8 ns 10 ns 10 ns 8 ns 10 ns 8 ns 10 ns
Other features SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE
JESD-30 code R-CQFP-G100 R-CQFP-G100 R-CQFP-G100 R-CQFP-G100 R-CQFP-G100 R-CQFP-G100 R-CQFP-G100 R-CQFP-G100
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
memory width 32 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 100 100 100 100 100 100 100 100
word count 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000 32000 32000 32000 32000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 85 °C 125 °C 85 °C 85 °C 85 °C 125 °C
Minimum operating temperature -55 °C -55 °C -40 °C -55 °C -40 °C -40 °C -40 °C -55 °C
organize 32KX32 32KX32 32KX32 32KX32 32KX32 32KX32 32KX32 32KX32
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maker White Microelectronics - White Microelectronics White Microelectronics White Microelectronics White Microelectronics White Microelectronics White Microelectronics
Has anyone used IPM?
Has anyone used IPM? If the protection part is not used, do I need to do any special processing?...
安_然 Analog electronics
STM32 debugging in RAM
STM32 debugging in ramWhen debugging STM32 in RAM, the following situation occurs and the program cannot proceed. What's going on?untitled.jpg (19.65 KB) 2012-4-13 22:47untitled2.jpg (22.23 KB) 2012-4...
xinbako stm32/stm8
David Zhao: Challenges of 5G RF Front-End
[align=left][color=rgb(51, 51, 51)][font=-apple-system-font, BlinkMacSystemFont, "]In the view of many analysts and manufacturers, 2019 will be the first year of 5G. However, the arrival of this high-...
alan000345 RF/Wirelessly
About non-contact thermometers
Does anyone know what kind of sensor is good for the non-contact thermometer, and what kind of AD converter should be used? OTP-538 Non-contact Infrared Temperature Sensor What are the temperature com...
zshiping520 Embedded System
Second-hand cortex M3 and A8 development boards
TI DM3730/AM3715, 1GHz, based on ARM Cortex-A8 processor - Onboard 512MB DDR, 512MB NAND Flash[/size][/font][/color][/align][align=left][color=#737373][font=微软雅黑][size=12px]- Powerful processing perfo...
2638823746 Buy&Sell
How do you see the future of analog design?
Moore's Law tells us that improvements in silicon manufacturing allow us to double the number of transistors every two years at the same cost. Another way to look at this is that the price of silicon ...
灞波儿奔 Analogue and Mixed Signal

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2716  1188  2630  2499  1357  55  24  53  51  28 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号