NAND Gate, S Series, 2-Func, 4-Input, TTL, CQCC20
| Parameter Name | Attribute value |
| Maker | YAGEO |
| package instruction | , |
| Reach Compliance Code | unknown |
| series | S |
| JESD-30 code | S-CQCC-N20 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| Number of functions | 2 |
| Number of entries | 4 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Maximum supply current (ICC) | 18 mA |
| propagation delay (tpd) | 9 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal location | QUAD |
| 54S20/B2A | 54LS20/BCA | 54LS20/B2A | 54LS20/BDA | 54S20/BCX | 54S20/BCA | 54S20/BDA | |
|---|---|---|---|---|---|---|---|
| Description | NAND Gate, S Series, 2-Func, 4-Input, TTL, CQCC20 | NAND Gate, LS Series, 2-Func, 4-Input, TTL, CDIP14 | NAND Gate, LS Series, 2-Func, 4-Input, TTL, CQCC20 | NAND Gate, LS Series, 2-Func, 4-Input, TTL, CDFP14 | NAND Gate, S Series, 2-Func, 4-Input, TTL, CDIP14, CERAMIC, DIP-14 | NAND Gate, S Series, 2-Func, 4-Input, TTL, CDIP14 | NAND Gate, S Series, 2-Func, 4-Input, TTL, CDFP14 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown |
| series | S | LS | LS | LS | S | S | S |
| JESD-30 code | S-CQCC-N20 | R-CDIP-T14 | S-CQCC-N20 | R-CDFP-F14 | R-CDIP-T14 | R-CDIP-T14 | R-CDFP-F14 |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of entries | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 20 | 14 | 20 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE | IN-LINE | FLATPACK |
| propagation delay (tpd) | 9 ns | 26 ns | 26 ns | 26 ns | 9 ns | 9 ns | 9 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES | YES | NO | NO | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | NO LEAD | THROUGH-HOLE | NO LEAD | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal location | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
| Maker | YAGEO | - | - | - | YAGEO | YAGEO | YAGEO |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF |
| Maximum supply current (ICC) | 18 mA | 2.2 mA | 2.2 mA | 2.2 mA | - | 18 mA | 18 mA |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 |