Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CDIP40
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| package instruction | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| bit size | 8 |
| CPU series | 8051 |
| JESD-30 code | R-XDIP-T40 |
| JESD-609 code | e0 |
| Number of terminals | 40 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP40,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 128 |
| rom(word) | 0 |
| speed | 16 MHz |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| D80C31BH-1 | D80C51BH-1 | TD80C51BH | D80C31BH | TD80C31BH | D80C51BH-60XXX | P80C51BH-60XXX | |
|---|---|---|---|---|---|---|---|
| Description | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS, PDIP40 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | AMD | AMD | AMD | AMD | AMD |
| package instruction | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| bit size | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU series | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 code | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-XDIP-T40 | R-PDIP-T40 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| rom(word) | - | 4096 | 4096 | - | - | 4096 | 4096 |
| speed | 16 MHz | 16 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| ROM programmability | - | MROM | MROM | - | - | MROM | MROM |
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