5962-8966606XX datasheet, PDF - EEWORLD Datasheet

5962-8966606XX: DescriptionFIFO, 256X9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, THIN, CERAMIC, DIP-28; Categorystorage storage; File Size459KB，14 Pages; ManufacturerIDT (Integrated Device Technology)

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5962-8966606XX Overview

FIFO, 256X9, 30ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, THIN, CERAMIC, DIP-28

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	30 ns
Other features	RETRANSMIT
period time	40 ns
JESD-30 code	R-GDIP-T28
length	37.1475 mm
memory density	2304 bi
memory width	9
Number of functions	1
Number of terminals	28
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256X9
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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