MC14017BALD datasheet, PDF - EEWORLD Datasheet

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MC14017BALD: DescriptionIC,COUNTER,UP,DECADE,CMOS,DIP,16PIN,CERAMIC; Categorylogic logic; File Size702KB，11 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC14017BALD Overview

IC,COUNTER,UP,DECADE,CMOS,DIP,16PIN,CERAMIC

MC14017BALD Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Counting direction	UP
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Load/preset input	YES
Logic integrated circuit type	DECADE COUNTER
Maximum Frequency@Nom-Sup	2000000 Hz
Operating mode	SYNCHRONOUS
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MC14017BALD Related Products

	MC14017BALD	MC14017BCLD	MC14017BALDS	MC14017BALS
Description	IC,COUNTER,UP,DECADE,CMOS,DIP,16PIN,CERAMIC	IC,COUNTER,UP,DECADE,CMOS,DIP,16PIN,CERAMIC	IC,COUNTER,UP,DECADE,CMOS,DIP,16PIN,CERAMIC	IC,COUNTER,UP,DECADE,CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
Counting direction	UP	UP	UP	UP
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0
Load/preset input	YES	YES	YES	NO
Logic integrated circuit type	DECADE COUNTER	DECADE COUNTER	DECADE COUNTER	DECADE COUNTER
Maximum Frequency@Nom-Sup	2000000 Hz	2000000 Hz	2000000 Hz	2000000 Hz
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Number of functions	1	1	1	1
Number of terminals	16	16	16	16
Maximum operating temperature	125 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-40 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL

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