CYStech Electronics Corp.
3.0Amp. Surface Mount Schottky Barrier Diodes
Spec. No. : C333SC
Issued Date : 2011.01.07
Revised Date :2013.09.27
Page No. : 1/ 6
SK320SC-SK3150SC Series
Features
•
For surface mounted applications.
•
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
•
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
•
Low leakage current
•
High surge capability
•
High temperature soldering: 250°C/10 seconds at terminals
•
Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
•
Case: Molded plastic, SMC/JEDEC DO-214AB.
•
Terminals: Solder plated, solderable per MIL-STD-750 method 2026
•
Polarity: Indicated by cathode band.
•
Mounting Position : Any.
•
Weight: 0.195 gram, 0.00585 ounce
Ordering Information
Device
SK320SC- 0-T6-G
SK340SC- 0-T6-G
SK360SC- 0 -T6-G
SK3100SC-0-T6-G
SK3150SC-0-T6-G
Package
SMC
(Pb-free lead plating and halogen-free
package)
Shipping
Marking
SK32
SK33
SK34
S310
S315
3000 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T6 : 3000 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
SK320SC-SK3150SC
CYStek Product Specification
CYStech Electronics Corp.
Maximum Ratings and Electrical Characteristics
(
Rating at 25°C ambient temperature unless otherwise specified. )
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous
forward voltage, I
F
=3A
Average forward rectified current
Peak forward surge current @8.3ms single half sine
wave superimposed on rated load (JEDEC method)
Maximum DC reverse current
V
R
=V
RRM
,T
A
=25
℃
V
R
=V
RRM
,T
A
=125
℃
Maximum thermal resistance, Junction to ambient
Maximum thermal resistance, Junction to lead
Diode junction capacitance @ f=1MHz and applied
4VDC reverse voltage
Storage temperature
Operating temperature
Note : Measure on PCB with 0.2”×0.2”(5mm×5mm) copper pad area.
Spec. No. : C333SC
Issued Date : 2011.01.07
Revised Date :2013.09.27
Page No. : 2/ 6
Symbol
V
RRM
V
RMS
V
R
V
F
I
O
I
FSM
I
R
R
th,JA
R
th,JL
C
J
Tstg
T
J
Type
Units
SK320 SK340 SK360 SK3100 SK3150
20
40
60
100
150
V
14
28
42
70
105
V
20
40
60
100
150
V
0.50
0.50
0.7
3
80
0.5
50
55
17
(Note)
250(typ)
-55 ~ +125
-55 ~ +150
-55 ~ +150
0.85
0.9
V
A
A
mA
mA
℃
/W
pF
℃
℃
Recommended soldering footprint
SK320SC-SK3150SC
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Forward Current Derating Curve
3.5
Spec. No. : C333SC
Issued Date : 2011.01.07
Revised Date :2013.09.27
Page No. : 3/ 6
Maximum Non-Repetitive Forward Surge Current
90
Peak Forward Surge Current---IFSM(A)
80
70
60
50
40
30
20
10
0
1
10
100
Average Forward Current---Io(A)
3
2.5
2
1.5
1
0.5
0
0
50
100
SK320-340
SK360-3150
Tj=25℃, 8.3ms Single Half
Sine Wave
JEDEC method
150
200
Ambient Temperature---TA(℃)
Number of Cycles at 60Hz
Forward Current vs Forward Voltage
100
SK320-340
SK360
Junction Capacitance vs Reverse Voltage
700
Junction Capacitance---CJ(pF)
600
500
400
300
200
100
0
0.01
Forward Current---IF(A)
10
1
SK3100-3150
0.1
Tj=25℃, Pulse width=300μs,
1% Duty cycle
0.01
0.1
0.3
0.5
0.7
0.9
1.1
Forward Voltage---VF(V)
1.3
1.5
0.1
1
10
100
Reverse Voltage---VR(V)
Reverse Leakage Current vs Reverse Voltage
100
Reverse Leakage Current---IR(mA)
10
1
Tj=75℃
0.1
Tj=25℃
0.01
0
20
40
60
80
100
120
140
Percent of Rated Peak
Reverse Voltage---(%)
SK320SC-SK3150SC
CYStek Product Specification
CYStech Electronics Corp.
Reel Dimension
Spec. No. : C333SC
Issued Date : 2011.01.07
Revised Date :2013.09.27
Page No. : 4/ 6
Carrier Tape Dimension
SK320SC-SK3150SC
CYStek Product Specification
CYStech Electronics Corp.
Recommended temperature profile for IR reflow
Spec. No. : C333SC
Issued Date : 2011.01.07
Revised Date :2013.09.27
Page No. : 5/ 6
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature
Min(T
S
min)
−Temperature
Max(T
S
max)
−Time(ts
min
to ts
max
)
Time maintained above:
−Temperature
(T
L
)
−
Time (t
L
)
Peak Temperature(T
P
)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25
°C
to peak
temperature
Sn-Pb eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5
°C
10-30 seconds
6°C/second max.
6 minutes max.
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260 +0/-5
°C
20-40 seconds
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK320SC-SK3150SC
CYStek Product Specification
FPGA/CPLD
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