CYStech Electronics Corp.
1.0Amp. Surface Mount Schottky Barrier Diodes
Spec. No. : C752SB
Issued Date : 2012.09.20
Revised Date :
Page No. : 1/5
SK12SB thru SK1BSB
Features
•
For surface mounted applications.
•
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications.
•
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0.
•
Low leakage current.
•
High surge capability.
•
High temperature soldering: 250°C/10 seconds at terminals.
•
Exceeds environmental standards of MIL-S-19500/228.
Mechanical Data
•
Case: Molded plastic, JEDEC DO-214AA/SMB.
•
Terminals: Solder plated, solderable per MIL-STD-750 method 2026.
•
Polarity: Indicated by cathode band.
•
Mounting position: Any.
•
Weight: 0.093 gram.
Maximum Ratings and Electrical Characteristics
(Rating
at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%. )
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward
Voltage @ I
F
=1A
(Note 1)
Maximum average forward
rectified current @ T
L
=100°C
Peak forward surge current @
8.3ms, single half sine-wave
superimposed on rated load
(JEDEC method)
Maximum DC reverse current at
Rated DC blocking
TJ=25°C
voltage
TJ=100°C
Typical thermal resistance,
junction to ambient
Typical diode junction
capacitance @ f=1MHz and
applied 4V reverse voltage
Storage temperature
Operating temperature
Symbol
V
RRM
V
RMS
V
R
V
F
I
O
SK12
20
14
20
SK13 SK14
30
40
21
28
30
40
0.5
Type
SK15 SK16 SK18
50
60
80
35
42
56
50
60
80
0.7
1
SK1B
100
70
100
0.85
Units
V
V
V
V
A
I
FSM
30
A
I
R
R
th, JA
C
J
Tstg
T
J
0.5
10
40
120
-55 ~ +150
-55 ~ +125
mA
°C/W
pF
°C
°C
SK12SB thru SK1BSB
CYStek Product Specification
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5
°C
Spec. No. : C752SB
Issued Date : 2012.09.20
Revised Date :
Page No. : 4/5
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Note : All temperatures refer to topside of the package, measured on the package body surface.
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature
Min(T
S
min)
−Temperature
Max(T
S
max)
−Time(ts
min
to ts
max
)
Time maintained above:
−Temperature
(T
L
)
−
Time (t
L
)
Peak Temperature(T
P
)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25
°C
to peak temperature
Sn-Pb eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5
°C
10-30 seconds
6°C/second max.
6 minutes max.
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260 +0/-5
°C
20-40 seconds
6°C/second max.
8 minutes max.
SK12SB thru SK1BSB
CYStek Product Specification
CYStech Electronics Corp.
SMB/DO-214AA Dimension
Marking Code :
SK12SB SK13SB
SK12
SK13
SK16SB
SK16
SK18SB
SK18
Spec. No. : C752SB
Issued Date : 2012.09.20
Revised Date :
Page No. : 5/5
SK14SB SK15SB
SK14
SK15
SK1BSB
SK1B
SMB/DO-214AA Plastic
Surface Mounted Package
CYStek Package Code : SB
*:Typical
DIM
A
B
C
D
Inches
Min.
Max.
0.075
0.083
0.130
0.155
0.160
0.185
0.083
0.096
Millimeters
Min.
Max.
1.91
2.11
3.30
3.94
4.06
4.70
2.13
2.44
DIM
E
F
G
H
Inches
Min.
Max.
0.006
0.012
0.002
0.008
0.030
0.060
0.200
0.220
Millimeters
Min.
Max.
0.152
0.305
0.051
0.203
0.76
1.52
5.08
5.59
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : Pure tin plated.
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK12SB thru SK1BSB
CYStek Product Specification
FPGA/CPLD
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