CD40105BD datasheet, PDF - EEWORLD Datasheet

CD40105BD: Description16X4 OTHER FIFO, 420ns, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16; Categorystorage storage; File Size280KB，6 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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CD40105BD Overview

16X4 OTHER FIFO, 420ns, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP16,.3
Contacts	16
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	420 ns
Maximum clock frequency (fCLK)	1.5 MHz
period time	125 ns
JESD-30 code	R-CDIP-T16
memory density	64 bit
Memory IC Type	OTHER FIFO
memory width	4
Number of functions	1
Number of terminals	16
word count	16 words
character code	16
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16X4
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5/15 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	18 V
Minimum supply voltage (Vsup)	3 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

	CD40105BD	CD40105BH
Description	16X4 OTHER FIFO, 420ns, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16	16X4 OTHER FIFO, UUC16
package instruction	DIP, DIP16,.3	DIE,
Reach Compliance Code	not_compliant	unknown
ECCN code	EAR99	EAR99
JESD-30 code	R-CDIP-T16	X-XUUC-N16
memory density	64 bit	64 bit
memory width	4	4
Number of functions	1	1
Number of terminals	16	16
word count	16 words	16 words
character code	16	16
Operating mode	SYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C
organize	16X4	16X4
Exportable	YES	YES
Package body material	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
encapsulated code	DIP	DIE
Package shape	RECTANGULAR	UNSPECIFIED
Package form	IN-LINE	UNCASED CHIP
Parallel/Serial	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	18 V	18 V
Minimum supply voltage (Vsup)	3 V	3 V
surface mount	NO	YES
technology	CMOS	CMOS
Temperature level	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	NO LEAD
Terminal location	DUAL	UPPER

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