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DM74AS174J/A+

Description
IC,FLIP-FLOP,HEX,D TYPE,AS-TTL,DIP,16PIN,CERAMIC
Categorylogic    logic   
File Size178KB,3 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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DM74AS174J/A+ Overview

IC,FLIP-FLOP,HEX,D TYPE,AS-TTL,DIP,16PIN,CERAMIC

DM74AS174J/A+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T16
JESD-609 codee0
Logic integrated circuit typeD FLIP-FLOP
Number of functions6
Number of terminals16
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Trigger typePOSITIVE EDGE

DM74AS174J/A+ Related Products

DM74AS174J/A+ DM74AS174N/A+
Description IC,FLIP-FLOP,HEX,D TYPE,AS-TTL,DIP,16PIN,CERAMIC IC,FLIP-FLOP,HEX,D TYPE,AS-TTL,DIP,16PIN,PLASTIC
Is it Rohs certified? incompatible incompatible
Maker Texas Instruments Texas Instruments
package instruction DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown
JESD-30 code R-XDIP-T16 R-PDIP-T16
JESD-609 code e0 e0
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP
Number of functions 6 6
Number of terminals 16 16
Maximum operating temperature 70 °C 70 °C
Package body material CERAMIC PLASTIC/EPOXY
encapsulated code DIP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
surface mount NO NO
technology TTL TTL
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm
Terminal location DUAL DUAL
Trigger type POSITIVE EDGE POSITIVE EDGE
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