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LHF00L15

Description
Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48
Categorystorage    storage   
File Size752KB,40 Pages
ManufacturerSHARP
Websitehttp://sharp-world.com/products/device/
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LHF00L15 Overview

Flash, 2MX16, 90ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48

LHF00L15 Parametric

Parameter NameAttribute value
MakerSHARP
package instruction12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48
Reach Compliance Codeunknown
Maximum access time90 ns
JESD-30 codeR-PDSO-G48
length18.4 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
typeNOR TYPE
width12 mm

LHF00L15 Preview

P
RELIMINARY
P
RODUCT
S
PECIFICATION
Integrated Circuits Group
Flash Memory
32M (2Mb x 16)
(Model Number: LHF00L15)
LHF00L15
Spec. Issue Date: June 16, 2004
Spec No: EL163056A
LHF00L15
Handle this document carefully for it contains material protected by international copyright law. Any reproduction,
full or in part, of this material is prohibited without the express written permission of the company.
When using the products covered herein, please observe the conditions written herein and the precautions outlined in
the following paragraphs. In no event shall the company be liable for any damages resulting from failure to strictly
adhere to these conditions and precautions.
(1) The products covered herein are designed and manufactured for the following application areas. When using the
products covered herein for the equipment listed in Paragraph (2), even for the following application areas, be sure
to observe the precautions given in Paragraph (2). Never use the products for the equipment listed in Paragraph
(3).
Office electronics
Instrumentation and measuring equipment
Machine tools
Audiovisual equipment
Home appliance
Communication equipment other than for trunk lines
(2) Those contemplating using the products covered herein for the following equipment which demands high
reliability, should first contact a sales representative of the company and then accept responsibility for
incorporating into the design fail-safe operation, redundancy, and other appropriate measures for ensuring
reliability and safety of the equipment and the overall system.
Control and safety devices for airplanes, trains, automobiles, and other transportation equipment
Mainframe computers
Traffic control systems
Gas leak detectors and automatic cutoff devices
Rescue and security equipment
Other safety devices and safety equipment, etc.
(3) Do not use the products covered herein for the following equipment which demands extremely high performance
in terms of functionality, reliability, or accuracy.
Aerospace equipment
Communications equipment for trunk lines
Control equipment for the nuclear power industry
Medical equipment related to life support, etc.
(4) Please direct all queries and comments regarding the interpretation of the above three Paragraphs to a sales
representative of the company.
Please direct all queries regarding the products covered herein to a sales representative of the company.
Rev. 2.45
LHF00L15
CONTENTS
1
PAGE
48-Lead TSOP (Normal Bend) Pinout ....................... 3
Pin Descriptions.......................................................... 4
Memory Map .............................................................. 5
Identifier Codes and OTP Address
for Read Operation ............................................. 6
OTP Block Address Map for OTP Program............... 7
PAGE
1 Electrical Specifications ........................................ 14
1.1 Absolute Maximum Ratings........................... 14
1.2 Operating Conditions ..................................... 14
1.2.1 Capacitance.............................................. 15
1.2.2 AC Input/Output Test Conditions............ 15
1.2.3 DC Characteristics................................... 16
Bus Operation............................................................. 8
Command Definitions ................................................ 9
Functions of Block Lock and Block Lock-Down...... 11
Block Locking State Transitions
upon Command Write........................................ 11
Block Locking State Transitions
upon WP#/ACC Transition .............................. 12
Status Register Definition......................................... 13
1.2.4 AC Characteristics
- Read-Only Operations............................ 18
1.2.5 AC Characteristics
- Write Operations .................................... 20
1.2.6 Reset Operations...................................... 22
1.2.7 Block Erase, Full Chip Erase,
Program and OTP Program Performance. 23
2 Related Document Information ............................. 24
3 Package and packing specification........................ 25
Rev. 2.45
LHF00L15
2
LHF00L15
32Mbit (2Mbit×16)
Flash MEMORY
32-M density with 16-bit I/O Interface
Read Operation
• 90ns
Low Power Operation
• 2.7V Read and Write Operations
• Automatic Power Savings Mode reduces I
CCR
in Static Mode
Enhanced Code + Data Storage
• 5µs Typical Erase/Program Suspends
OTP (One Time Program) Block
• 4-Word Factory-Programmed Area
• 4-Word User-Programmable Area
Operating Temperature -40°C to +85°C
CMOS Process (P-type silicon substrate)
Flexible Blocking Architecture
• Eight 4-Kword Parameter Blocks
• One 32-Kword Block
• Thirty-one 64-Kword Blocks
• Bottom Parameter Location
Enhanced Data Protection Features
• Individual Block Lock and Block Lock-Down with
Zero-Latency
• All blocks are locked at power-up or device reset.
• Block Erase, Full Chip Erase, Word Program Lockout
during Power Transitions
Automated Erase/Program Algorithms
• 3.0V Low-Power
10µs/Word
(Typ.)
Programming
• 12.0V No Glue Logic 9µs/Word (Typ.)
Production Programming and 0.8s Erase (Typ.)
Cross-Compatible Command Support
• Basic Command Set
• Common Flash Interface (CFI)
Extended Cycling Capability
• Minimum 100,000 Block Erase Cycles
48-Lead TSOP (Normal Bend)
ETOX
TM*
Flash Technology
Not designed or rated as radiation hardened
The product is a low power, high density, low cost, nonvolatile read/write storage solution for a wide range of applications.
The product can operate at V
CC
=2.7V-3.6V. Its low voltage operation capability greatly extends battery life for portable
applications.
The memory array block architecture utilizes Enhanced Data Protection features, which provides maximum flexibility for
safe nonvolatile code and data storage.
Special OTP (One Time Program) block provides an area to store permanent code such as an unique number.
* ETOX is a trademark of Intel Corporation.
Rev. 2.45

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