EMK42G2J-9.8304M datasheet, PDF

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EMK42G2J-9.8304M: DescriptionCMOS, MEMS Clock Oscillators LVCMOS (CMOS) 2.5Vdc 4 Pad 2.0mm x 2.5mm Plastic Surface Mount (SMD) MEMS Clock Oscillators LVCMOS (CMOS) 2.5Vdc 4 Pad 2.0mm x 2.5mm Plastic Surface Mount (SMD); CategoryPassive components oscillator; File Size165KB，5 Pages; ManufacturerECLIPTEK; Websitehttp://www.ecliptek.com; Environmental Compliance

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EMK42G2J-9.8304M Overview

CMOS, MEMS Clock Oscillators LVCMOS (CMOS) 2.5Vdc 4 Pad 2.0mm x 2.5mm Plastic Surface Mount (SMD) MEMS Clock Oscillators LVCMOS (CMOS) 2.5Vdc 4 Pad 2.0mm x 2.5mm Plastic Surface Mount (SMD)

EMK42G2J-9.8304M Parametric

Parameter Name	Attribute value
Brand Name	Ecliptek
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ECLIPTEK
Parts packaging code	SMD 2.0mm x 2.5mm
Contacts	4
Manufacturer packaging code	SMD 2.0mm x 2.5mm
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	ENABLE/DISABLE FUNCTION; BULK
maximum descent time	2 ns
Frequency Adjustment - Mechanical	NO
frequency stability	100%
JESD-609 code	e4
Manufacturer's serial number	EMK42
Installation features	SURFACE MOUNT
Nominal operating frequency	9.8304 MHz
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Oscillator type	LVCMOS
Output load	15 pF
physical size	2.5mm x 2.0mm x 0.85mm
longest rise time	2 ns
Maximum supply voltage	2.625 V
Minimum supply voltage	2.375 V
Nominal supply voltage	2.5 V
surface mount	YES
maximum symmetry	55/45 %
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)

EMK42G2J-9.8304M Preview

EMK42G2J-9.8304M

Series

RoHS Compliant (Pb-free) 4 Pad 2mm x 2.5mm SMD

2.5Vdc LVCMOS MEMS Oscillator

Frequency Tolerance/Stability

±100ppm Maximum over -40°C to +85°C

Duty Cycle

50 ±5(%)

RoHS

EMK42 G 2 J -9.8304M

Nominal Frequency

9.8304MHz

Output Control Function

Power Down (Disabled Output: Logic Low)

ELECTRICAL SPECIFICATIONS

Nominal Frequency

Frequency Tolerance/Stability

9.8304MHz

±100ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C,

Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,

First Year Aging at 25°C, 260°C Reflow, Shock, and Vibration)

±1ppm Maximum First Year

-40°C to +85°C

2.5Vdc ±5%

17mA Maximum

90% of Vdd Minimum (IOH=-8mA)

10% of Vdd Maximum (IOL=+8mA)

2nSec Maximum (Measured from 20% to 80% of waveform)

50 ±5(%) (Measured at 50% of waveform)

15pF Maximum

CMOS

Power Down (Disabled Output: Logic Low)

+0.7Vdd Minimum or No Connect to Enable Output, +0.3Vdd Maximum to Disable Output

50µA Maximum (Disabled Output: Logic Low)

500pSec Maximum, 200pSec Typical

50mSec Maximum

-55°C to +125°C

Aging at 25°C

Operating Temperature Range

Supply Voltage

Input Current

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Rise/Fall Time

Duty Cycle

Load Drive Capability

Output Logic Type

Output Control Function

Output Control Input Voltage

Standby Current

Peak to Peak Jitter (tPK)

Start Up Time

Storage Temperature Range

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility

Flammability

Mechanical Shock

Moisture Resistance

Moisture Sensitivity Level

Resistance to Soldering Heat

Resistance to Solvents

Solderability

Temperature Cycling

Thermal Shock

Vibration

MIL-STD-883, Method 3015, Class 2, HBM 2000V

UL94-V0

MIL-STD-883, Method 2002, Condition G, 30,000G

MIL-STD-883, Method 1004

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003 (Pads on Bottom of Package Only)

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 1011, Condition B

MIL-STD-883, Method 2007, Condition A, 20G

www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/17/2010 | Page 1 of 5

EMK42G2J-9.8304M

MECHANICAL DIMENSIONS (all dimensions in millimeters)

CONNECTION

Power Down

Ground

Output

Supply Voltage

2.00

±0.15

0.85

±0.15

0.08

MAX

1.65

±0.10

R0.32

±0.10

0.70

±0.15

0.65 ±0.10 (x4)

R0.33

±0.10

0.65

±0.10

(x4)

LINE MARKING

XXXX

XXXX=Ecliptek

Manufacturing Lot Code

2.50

±0.15

Suggested Solder Pad Layout

All Dimensions in Millimeters

1.10 (X4)

0.50

Solder Land

(X4)

0.30

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/17/2010 | Page 2 of 5

EMK42G2J-9.8304M

OUTPUT WAVEFORM & TIMING DIAGRAM

POWER DOWN INPUT

CLOCK OUTPUT

80% of Waveform

50% of Waveform

20% of Waveform

PLZ

Fall

Time

Rise

Time

Duty Cycle (%) = T

/T x 100

PZL

OUTPUT DISABLE

(LOGIC LOW)

Test Circuit for CMOS Output

Oscilloscope

Frequency

Counter

Power

Supply

Voltage

Meter

Current

Meter

Supply

Voltage

)

Probe

(Note 2)

Output

0.01µF

(Note 1)

0.1µF

(Note 1)

Ground

(Note 3)

Tri-State or

Power Down

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and V

pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value C

includes sum of all probe and fixture capacitance.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/17/2010 | Page 3 of 5

EMK42G2J-9.8304M

Recommended Solder Reflow Methods

Critical Zone

to T

Ramp-up

Ramp-down

Temperature (T)

Max

Min

Preheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

MAX to T

(Ramp-up Rate)

Preheat

- Temperature Minimum (T

MIN)

- Temperature Typical (T

TYP)

- Temperature Maximum (T

MAX)

- Time (t

MIN)

Ramp-up Rate (T

to T

)

Time Maintained Above:

- Temperature (T

)

- Time (t

)

Peak Temperature (T

)

Target Peak Temperature (T

Target)

Time within 5°C of actual peak (t

)

Ramp-down Rate

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

3°C/second Maximum

150°C

175°C

200°C

60 - 180 Seconds

3°C/second Maximum

217°C

60 - 150 Seconds

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/17/2010 | Page 4 of 5

EMK42G2J-9.8304M

Recommended Solder Reflow Methods

Critical Zone

to T

Ramp-up

Ramp-down

Temperature (T)

Max

Min

Preheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 240°C

MAX to T

(Ramp-up Rate)

Preheat

- Temperature Minimum (T

MIN)

- Temperature Typical (T

TYP)

- Temperature Maximum (T

MAX)

- Time (t

MIN)

Ramp-up Rate (T

to T

)

Time Maintained Above:

- Temperature (T

)

- Time (t

)

Peak Temperature (T

)

Target Peak Temperature (T

Target)

Time within 5°C of actual peak (t

)

Ramp-down Rate

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

5°C/second Maximum

N/A

150°C

N/A

60 - 120 Seconds

5°C/second Maximum

150°C

200 Seconds Maximum

240°C Maximum

240°C Maximum 1 Time / 230°C Maximum 2 Times

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

5°C/second Maximum

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/17/2010 | Page 5 of 5

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