CY7C439-30LMB datasheet, PDF - EEWORLD Datasheet

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CY7C439-30LMB: DescriptionBi-Directional FIFO, 2KX9, 30ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32; Categorystorage storage; File Size462KB，13 Pages; ManufacturerCypress Semiconductor

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CY7C439-30LMB Overview

Bi-Directional FIFO, 2KX9, 30ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32

CY7C439-30LMB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	QFJ
package instruction	CERAMIC, LCC-32
Contacts	32
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	30 ns
Other features	BYPASS XCVR
Maximum clock frequency (fCLK)	25 MHz
period time	40 ns
JESD-30 code	R-CQCC-N32
JESD-609 code	e0
length	13.97 mm
memory density	18432 bit
Memory IC Type	BI-DIRECTIONAL FIFO
memory width	9
Number of functions	1
Number of terminals	32
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX9
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	2.286 mm
Maximum standby current	0.025 A
Maximum slew rate	0.17 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.43 mm

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CY7C439-30LMB Related Products

	CY7C439-30LMB	CY7C439-65LMB	CY7C439-25JC	CY7C439-65JC	CY7C439-40JC	CY7C439-65PC	CY7C439-65DMB	CY7C439-30PC
Description	Bi-Directional FIFO, 2KX9, 30ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	Bi-Directional FIFO, 2KX9, 65ns, Asynchronous, CMOS, CQCC32, CERAMIC, LCC-32	Bi-Directional FIFO, 2KX9, 25ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	Bi-Directional FIFO, 2KX9, 65ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	Bi-Directional FIFO, 2KX9, 40ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32	Bi-Directional FIFO, 2KX9, 65ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Bi-Directional FIFO, 2KX9, 65ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28	Bi-Directional FIFO, 2KX9, 30ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFJ	QFJ	QFJ	QFJ	QFJ	DIP	DIP	DIP
package instruction	CERAMIC, LCC-32	CERAMIC, LCC-32	PLASTIC, LCC-32	PLASTIC, LCC-32	PLASTIC, LCC-32	0.300 INCH, PLASTIC, DIP-28	0.300 INCH, CERDIP-28	0.300 INCH, PLASTIC, DIP-28
Contacts	32	32	32	32	32	28	28	28
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	30 ns	65 ns	25 ns	65 ns	40 ns	65 ns	65 ns	30 ns
Other features	BYPASS XCVR	BYPASS XCVR	BYPASS XCVR	BYPASS XCVR	BYPASS XCVR	BYPASS XCVR	BYPASS XCVR	BYPASS XCVR
Maximum clock frequency (fCLK)	25 MHz	12.5 MHz	28.5 MHz	12.5 MHz	20 MHz	12.5 MHz	12.5 MHz	25 MHz
period time	40 ns	80 ns	35 ns	80 ns	50 ns	80 ns	80 ns	40 ns
JESD-30 code	R-CQCC-N32	R-CQCC-N32	R-PQCC-J32	R-PQCC-J32	R-PQCC-J32	R-PDIP-T28	R-GDIP-T28	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	13.97 mm	13.97 mm	13.97 mm	13.97 mm	13.97 mm	35.4965 mm	37.0205 mm	35.4965 mm
memory density	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit
Memory IC Type	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO
memory width	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	28	28	28
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	70 °C	70 °C	70 °C	70 °C	125 °C	70 °C
organize	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	QCCN	QCCN	QCCJ	QCCJ	QCCJ	DIP	DIP	DIP
Encapsulate equivalent code	LCC32,.45X.55	LCC32,.45X.55	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6	DIP28,.3	DIP28,.3	DIP28,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.286 mm	2.286 mm	3.55 mm	3.55 mm	3.55 mm	4.826 mm	5.08 mm	4.826 mm
Maximum standby current	0.025 A	0.025 A	0.02 A	0.02 A	0.02 A	0.02 A	0.025 A	0.02 A
Maximum slew rate	0.17 mA	0.145 mA	0.147 mA	0.115 mA	0.13 mA	0.115 mA	0.145 mA	0.14 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	J BEND	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm	7.62 mm	7.62 mm	7.62 mm
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	-	-	Cypress Semiconductor	Cypress Semiconductor
Base Number Matches	-	1	1	1	1	1	-	-

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