MODEL BB1110RC
Resistor capacitor network
Thick film resistors
Ceramic chip capacitors
DISCRIPTION
Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local
decoupling of data line drivers. These specialty networks employ solder balls for surface mount flip
chip attachment. Their unique construction yields extremely low capacitance and inductance
parasitics critical for these high-speed applications.
FEATURES
•
•
•
•
•
Integrated resistor and capacitor network
High density packaging
High temperature solder balls
Industry standard ball diameter and pitch
Excellent high frequency performance
SCHEMATIC
C1-9 = 0.1uF
R1-9 = 50
ELECTRICAL
1
Resistance Tolerance
Capacitance Tolerance
Capacitor Type
Capacitor Maximum Voltage
TCR
Operating Temperature Range
Maximum Resistor Power
Package Power Rating
±
1%
±
10%
X5R
10 volts
200 ppm/°C
-55°C to +85°C
0.05 watts at 70°C
1.0 watt @ 70°C
1
Specifications subject to change without notice.
BI Technologies Corporation
4200 Bonita Place, Fullerton, CA 92835 USA
Phone: 714 447 2345
August 30, 2005
Website:
www.bitechnologies.com
page 1 of 2
BI technologies
MODEL BB1110RC
MECHANICAL
Solder Ball Finish
Solder Ball Co-planarity
Substrate Material
Resistor Material
SnPb 10/90
0.15 mm
Al
2
O
3
Cermet
ORDERING INFORMATION
2
BB 1 1 10 RC 7
Model Series
Channels: 9
Solder ball Pitch: 1.0 mm
Tape Reel packing
Resistor Capacitor Network
Nominal: 50 ohms / 0.1uf
PACKING INFORMATION
Tape reel suffix (also reel size in inches)
Part count/reel
7
750
13
3000
OUTLINE DRAWING
Units: mm
2
Contact our customer service for custom designs and features.
BI Technologies Corporation
4200 Bonita Place, Fullerton, CA 92835 USA
Phone: 714 447 2345
October 7, 2004
Website:
www.bitechnologies.com
page 2 of 2
BI technologies